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Class Information
Number: 257/711
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Entirely of metal except for feedthrough > With raised portion of base for mounting semiconductor chip
Description: Subject matter wherein a portion of the base is raised above the rest of the base and the raised portion provides a base on which to mount a semiconductor chip with an active solid-state device therein or thereon.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
6860621 LED module and methods for producing and using the module Mar. 1, 2005
6861743 Integrated circuit carrier socket Mar. 1, 2005
6861746 Electrical circuit apparatus and methods for assembling same Mar. 1, 2005
6853068 Heatsinking and packaging of integrated circuit chips Feb. 8, 2005
6853059 Semiconductor package having improved adhesiveness and ground bonding Feb. 8, 2005
6849941 Heat sink and heat spreader assembly Feb. 1, 2005
6831307 Semiconductor mounting system Dec. 14, 2004
6828674 Hermetically sealed microstructure package Dec. 7, 2004
6809936 Integrated circuit component carrier with angled supporting and retaining surfaces Oct. 26, 2004
6809931 Heat sink apparatus that provides electrical isolation for integrally shielded circuit Oct. 26, 2004
6806565 Lead-frame-based semiconductor package and fabrication method thereof Oct. 19, 2004
6787900 Semiconductor module and insulating substrate thereof Sep. 7, 2004
6777785 Lead frame containing a master and a slave IC chips and a testing circuit embedded within the master IC chip Aug. 17, 2004
6744119 Leadframe having slots in a die pad Jun. 1, 2004
6740962 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same May. 25, 2004
6731012 Non-planar surface for semiconductor chips May. 4, 2004
6720651 Semiconductor plastic package and process for the production thereof Apr. 13, 2004
6707073 Semiconductor laser device with press-formed base and heat sink Mar. 16, 2004
6707124 HID land grid array packaged device having electrical and optical interconnects Mar. 16, 2004
6700138 Modular semiconductor die package and method of manufacturing thereof Mar. 2, 2004
6664626 Semiconductor device and method of manufacturing the same Dec. 16, 2003
6664624 Semiconductor device and manufacturing method thereof Dec. 16, 2003
6639313 Hermetic seals for large optical packages and the like Oct. 28, 2003
6635953 IC chip package Oct. 21, 2003
6625028 Heat sink apparatus that provides electrical isolation for integrally shielded circuit Sep. 23, 2003
6624523 Structure and package of a heat spreader substrate Sep. 23, 2003
6538322 Semiconductor device in a recess of a semiconductor plate Mar. 25, 2003
6528892 Land grid array stiffener use with flexible chip carriers Mar. 4, 2003
6528871 Structure and method for mounting semiconductor devices Mar. 4, 2003
6519844 Overmold integrated circuit package Feb. 18, 2003
6501156 Lead frame which includes a die pad, a support lead, and inner leads Dec. 31, 2002
6495914 Multi-chip module structure having conductive blocks to provide electrical connection between conductors on first and second sides of a conductive base substrate Dec. 17, 2002
6495913 Semiconductor clamped-stack assembly Dec. 17, 2002
6489670 Sealed symmetric multilayered microelectronic device package with integral windows Dec. 3, 2002
6483180 Lead frame design for burr-free singulation of molded array packages Nov. 19, 2002
6465883 Capsule for at least one high power transistor chip for high frequencies Oct. 15, 2002
6441481 Hermetically sealed microstructure package Aug. 27, 2002
6414389 Alignment pedestals in an LDMOS power package Jul. 2, 2002
6410981 Vented semiconductor device package having separate substrate, strengthening ring and cap structures Jun. 25, 2002
6376908 Semiconductor plastic package and process for the production thereof Apr. 23, 2002
6365965 Power semiconductor module with terminals having holes for better adhesion Apr. 2, 2002
6362522 Cool frame for protecting packaged electronic devices Mar. 26, 2002
6331729 Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them Dec. 18, 2001
6316826 Semiconductor mounting package Nov. 13, 2001
6313524 Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrate Nov. 6, 2001
6310391 Mounted structure of circuit board and multi-layer circuit board therefor Oct. 30, 2001
6307259 Plastic package for semiconductor device Oct. 23, 2001
6292374 Assembly having a back plate with inserts Sep. 18, 2001
6281568 Plastic integrated circuit device package and leadframe having partially undercut leads and die pad Aug. 28, 2001
6229204 Chip on board with heat sink attachment May. 8, 2001

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