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Class Information
Number: 257/711
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Entirely of metal except for feedthrough > With raised portion of base for mounting semiconductor chip
Description: Subject matter wherein a portion of the base is raised above the rest of the base and the raised portion provides a base on which to mount a semiconductor chip with an active solid-state device therein or thereon.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8561291 Method for producing a number of chip cards Oct. 22, 2013
8536691 Semiconductor device and method for manufacturing the same Sep. 17, 2013
8531024 Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace Sep. 10, 2013
8455987 Electrically isolated power semiconductor package with optimized layout Jun. 4, 2013
8389306 Light emission device package and method of fabricating the same Mar. 5, 2013
8384212 Semiconductor equipment and method of manufacturing the same Feb. 26, 2013
8362610 Mounting configuration of electronic component Jan. 29, 2013
8315056 Heat-radiating substrate and method of manufacturing the same Nov. 20, 2012
8298868 Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole Oct. 30, 2012
8288792 Semiconductor chip assembly with post/base/post heat spreader Oct. 16, 2012
8283211 Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump Oct. 9, 2012
8258014 Method of manufacturing a power transistor module and package with integrated bus bar Sep. 4, 2012
8236618 Method of making a semiconductor chip assembly with a post/base/post heat spreader Aug. 7, 2012
8237261 Semiconductor device Aug. 7, 2012
8232576 Semiconductor chip assembly with post/base heat spreader and ceramic block in post Jul. 31, 2012
8207019 Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts Jun. 26, 2012
8207553 Semiconductor chip assembly with base heat spreader and cavity in base Jun. 26, 2012
8193556 Semiconductor chip assembly with post/base heat spreader and cavity in post Jun. 5, 2012
8169075 Electronic part with affixed MEMS May. 1, 2012
8163603 Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding Apr. 24, 2012
8153477 Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader Apr. 10, 2012
8143717 Surface mount package with ceramic sidewalls Mar. 27, 2012
8121167 Dual wavelength laser device for optical communication Feb. 21, 2012
8080872 Surface mount package with high thermal conductivity Dec. 20, 2011
8063482 Heat spreader as mechanical reinforcement for ultra-thin die Nov. 22, 2011
8053872 Integrated shield for a no-lead semiconductor device package Nov. 8, 2011
8039951 Thermally enhanced semiconductor package and method of producing the same Oct. 18, 2011
8025950 Sensor-securing apparatus and camera module Sep. 27, 2011
7994630 Power transistor package with integrated bus bar Aug. 9, 2011
7939937 Chip housing having reduced induced vibration May. 10, 2011
7936062 Wafer level chip packaging May. 3, 2011
7928560 Composite multi-layer substrate and module using the substrate Apr. 19, 2011
7911059 High thermal conductivity substrate for a semiconductor device Mar. 22, 2011
7911051 Electronic circuit arrangement and method for producing an electronic circuit arrangement Mar. 22, 2011
7902663 Semiconductor package having stepwise depression in substrate Mar. 8, 2011
7875971 Semiconductor device having improved heat sink Jan. 25, 2011
7863732 Ball grid array package system Jan. 4, 2011
7843058 Flip chip packages with spacers separating heat sinks and substrates Nov. 30, 2010
7821125 Semiconductor device Oct. 26, 2010
7812430 Leadframe and semiconductor package having downset baffle paddles Oct. 12, 2010
RE41559 Semiconductor device package with improved cooling Aug. 24, 2010
7745926 Composite multi-layer substrate and module using the substrate Jun. 29, 2010
7732914 Cavity-type integrated circuit package Jun. 8, 2010
7701048 Power module for low thermal resistance and method of fabricating the same Apr. 20, 2010
7692293 Semiconductor switching module Apr. 6, 2010
7679918 LED element and printed circuit board with the same Mar. 16, 2010
7678613 Integrated circuit edge protection method and apparatus Mar. 16, 2010
7671467 Power semiconductor module Mar. 2, 2010
7642644 Packaging for high power integrated circuits Jan. 5, 2010
7638877 Alternative to desmear for build-up roughening and copper adhesion promotion Dec. 29, 2009

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