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Class Information
Number: 257/711
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Entirely of metal except for feedthrough > With raised portion of base for mounting semiconductor chip
Description: Subject matter wherein a portion of the base is raised above the rest of the base and the raised portion provides a base on which to mount a semiconductor chip with an active solid-state device therein or thereon.


Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
7449363 Semiconductor package substrate with embedded chip and fabrication method thereof Nov. 11, 2008
7446392 Electronic device and method for manufacturing the same Nov. 4, 2008
7436077 Semiconductor device and method of manufacturing the same Oct. 14, 2008
7423331 Molded stiffener for thin substrates Sep. 9, 2008
7423340 Semiconductor package free of substrate and fabrication method thereof Sep. 9, 2008
7388750 Plasma display module Jun. 17, 2008
7365422 Package of leadframe with heatsinks Apr. 29, 2008
7365423 Redistributed solder pads using etched lead frame Apr. 29, 2008
7365424 Microelectronic component assemblies with recessed wire bonds and methods of making same Apr. 29, 2008
7339266 Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof Mar. 4, 2008
7329957 Circuit device and manufacturing method thereof Feb. 12, 2008
7323769 High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package Jan. 29, 2008
7298021 Electronic device and method for manufacturing the same Nov. 20, 2007
7256491 Thermal interconnect systems methods of production and uses thereof Aug. 14, 2007
7247948 Semiconductor device and method for fabricating the semiconductor device Jul. 24, 2007
7245500 Ball grid array package with stepped stiffener layer Jul. 17, 2007
7245009 Hermetic cavity package Jul. 17, 2007
7235877 Redistributed solder pads using etched lead frame Jun. 26, 2007
7230333 Semiconductor package Jun. 12, 2007
7211889 Semiconductor package and method for manufacturing the same May. 1, 2007
7205652 Electronic assembly including multiple substrates Apr. 17, 2007
7196414 Semiconductor package with heat sink Mar. 27, 2007
7193328 Semiconductor device Mar. 20, 2007
7170151 Accurate alignment of an LED assembly Jan. 30, 2007
7166911 Packaged microchip with premolded-type package Jan. 23, 2007
7145230 Semiconductor device with a solder creep-up prevention zone Dec. 5, 2006
7095109 Optical fiber terminator package Aug. 22, 2006
7081645 SMD(surface mount device)-type light emitting diode with high heat dissipation efficiency and high power Jul. 25, 2006
7067908 Semiconductor package having improved adhesiveness and ground bonding Jun. 27, 2006
7053493 Semiconductor device having stiffener May. 30, 2006
7030472 Integrated circuit device having flexible leadframe Apr. 18, 2006
6963130 Heatsinking and packaging of integrated circuit chips Nov. 8, 2005
6934065 Microelectronic devices and methods for packaging microelectronic devices Aug. 23, 2005
6924985 Method of waterproofing power circuit section and power module having power circuit section Aug. 2, 2005
6921970 Package for electronic parts, lid thereof, material for the lid and method for producing the lid material Jul. 26, 2005
6914331 Semiconductor device having an inductor formed on a region of an insulating film Jul. 5, 2005
6909177 Chip carrier plate Jun. 21, 2005
6906414 Ball grid array package with patterned stiffener layer Jun. 14, 2005
6870259 Wafer scale fiber optic termination Mar. 22, 2005
6860621 LED module and methods for producing and using the module Mar. 1, 2005
6861746 Electrical circuit apparatus and methods for assembling same Mar. 1, 2005
6861743 Integrated circuit carrier socket Mar. 1, 2005
6853068 Heatsinking and packaging of integrated circuit chips Feb. 8, 2005
6853059 Semiconductor package having improved adhesiveness and ground bonding Feb. 8, 2005
6849941 Heat sink and heat spreader assembly Feb. 1, 2005
6831307 Semiconductor mounting system Dec. 14, 2004
6828674 Hermetically sealed microstructure package Dec. 7, 2004
6809931 Heat sink apparatus that provides electrical isolation for integrally shielded circuit Oct. 26, 2004
6809936 Integrated circuit component carrier with angled supporting and retaining surfaces Oct. 26, 2004
6806565 Lead-frame-based semiconductor package and fabrication method thereof Oct. 19, 2004

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