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Class Information
Number: 257/711
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Entirely of metal except for feedthrough > With raised portion of base for mounting semiconductor chip
Description: Subject matter wherein a portion of the base is raised above the rest of the base and the raised portion provides a base on which to mount a semiconductor chip with an active solid-state device therein or thereon.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619308 |
Multi-lid semiconductor package |
Nov. 17, 2009 |
| 7592695 |
Compound heat sink |
Sep. 22, 2009 |
| 7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Sep. 8, 2009 |
| 7579671 |
Semiconductor device and manufacturing method thereof |
Aug. 25, 2009 |
| 7569926 |
Wafer level hermetic bond using metal alloy with raised feature |
Aug. 4, 2009 |
| 7569928 |
Assembly structure of electronic element and heat sink |
Aug. 4, 2009 |
| 7564129 |
Power semiconductor module, and power semiconductor device having the module mounted therein |
Jul. 21, 2009 |
| 7535085 |
Semiconductor package having improved adhesiveness and ground bonding |
May. 19, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7475175 |
Multi-processor module |
Jan. 6, 2009 |
| 7449363 |
Semiconductor package substrate with embedded chip and fabrication method thereof |
Nov. 11, 2008 |
| 7446392 |
Electronic device and method for manufacturing the same |
Nov. 4, 2008 |
| 7436077 |
Semiconductor device and method of manufacturing the same |
Oct. 14, 2008 |
| 7423331 |
Molded stiffener for thin substrates |
Sep. 9, 2008 |
| 7423340 |
Semiconductor package free of substrate and fabrication method thereof |
Sep. 9, 2008 |
| 7388750 |
Plasma display module |
Jun. 17, 2008 |
| 7365423 |
Redistributed solder pads using etched lead frame |
Apr. 29, 2008 |
| 7365422 |
Package of leadframe with heatsinks |
Apr. 29, 2008 |
| 7365424 |
Microelectronic component assemblies with recessed wire bonds and methods of making same |
Apr. 29, 2008 |
| 7339266 |
Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof |
Mar. 4, 2008 |
| 7329957 |
Circuit device and manufacturing method thereof |
Feb. 12, 2008 |
| 7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
Jan. 29, 2008 |
| 7298021 |
Electronic device and method for manufacturing the same |
Nov. 20, 2007 |
| 7256491 |
Thermal interconnect systems methods of production and uses thereof |
Aug. 14, 2007 |
| 7247948 |
Semiconductor device and method for fabricating the semiconductor device |
Jul. 24, 2007 |
| 7245500 |
Ball grid array package with stepped stiffener layer |
Jul. 17, 2007 |
| 7245009 |
Hermetic cavity package |
Jul. 17, 2007 |
| 7235877 |
Redistributed solder pads using etched lead frame |
Jun. 26, 2007 |
| 7230333 |
Semiconductor package |
Jun. 12, 2007 |
| 7211889 |
Semiconductor package and method for manufacturing the same |
May. 1, 2007 |
| 7205652 |
Electronic assembly including multiple substrates |
Apr. 17, 2007 |
| 7196414 |
Semiconductor package with heat sink |
Mar. 27, 2007 |
| 7193328 |
Semiconductor device |
Mar. 20, 2007 |
| 7170151 |
Accurate alignment of an LED assembly |
Jan. 30, 2007 |
| 7166911 |
Packaged microchip with premolded-type package |
Jan. 23, 2007 |
| 7145230 |
Semiconductor device with a solder creep-up prevention zone |
Dec. 5, 2006 |
| 7095109 |
Optical fiber terminator package |
Aug. 22, 2006 |
| 7081645 |
SMD(surface mount device)-type light emitting diode with high heat dissipation efficiency and high power |
Jul. 25, 2006 |
| 7067908 |
Semiconductor package having improved adhesiveness and ground bonding |
Jun. 27, 2006 |
| 7053493 |
Semiconductor device having stiffener |
May. 30, 2006 |
| 7030472 |
Integrated circuit device having flexible leadframe |
Apr. 18, 2006 |
| 6963130 |
Heatsinking and packaging of integrated circuit chips |
Nov. 8, 2005 |
| 6934065 |
Microelectronic devices and methods for packaging microelectronic devices |
Aug. 23, 2005 |
| 6924985 |
Method of waterproofing power circuit section and power module having power circuit section |
Aug. 2, 2005 |
| 6921970 |
Package for electronic parts, lid thereof, material for the lid and method for producing the lid material |
Jul. 26, 2005 |
| 6914331 |
Semiconductor device having an inductor formed on a region of an insulating film |
Jul. 5, 2005 |
| 6909177 |
Chip carrier plate |
Jun. 21, 2005 |
| 6906414 |
Ball grid array package with patterned stiffener layer |
Jun. 14, 2005 |
| 6870259 |
Wafer scale fiber optic termination |
Mar. 22, 2005 |
| 6861743 |
Integrated circuit carrier socket |
Mar. 1, 2005 |
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