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Class Information
Number: 257/710
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Entirely of metal except for feedthrough > With specified means (e.g., lip) to seal base to cap
Description: Subject matter wherein specific means are provided to seal the cap to the base such as, for example, a bead or lip or boss around the periphery of the base.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7456499 |
Power light emitting die package with reflecting lens and the method of making the same |
Nov. 25, 2008 |
| 7446411 |
Semiconductor structure and method of assembly |
Nov. 4, 2008 |
| 7443024 |
Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same |
Oct. 28, 2008 |
| 7439617 |
Capillary underflow integral heat spreader |
Oct. 21, 2008 |
| 7436056 |
Electronic component package |
Oct. 14, 2008 |
| 7429501 |
Lid and method of employing a lid on an integrated circuit |
Sep. 30, 2008 |
| 7414310 |
Waferscale package system |
Aug. 19, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7394153 |
Encapsulation of electronic devices |
Jul. 1, 2008 |
| 7388282 |
Micro-electro-mechanical system (MEMS) package having hydrophobic layer |
Jun. 17, 2008 |
| 7387902 |
Methods for packaging image sensitive electronic devices |
Jun. 17, 2008 |
| 7382046 |
Semiconductor device protection cover, and semiconductor device unit including the cover |
Jun. 3, 2008 |
| 7378748 |
Solid-state imaging device and method for manufacturing the same |
May. 27, 2008 |
| 7378294 |
Wafer-level sealed microdevice having trench isolation and methods for making the same |
May. 27, 2008 |
| 7372700 |
Plasma display device |
May. 13, 2008 |
| 7368816 |
Micro-electro-mechanical system (MEMS) package having metal sealing member |
May. 6, 2008 |
| 7365981 |
Fluid-cooled electronic system |
Apr. 29, 2008 |
| 7358106 |
Hermetic MEMS package and method of manufacture |
Apr. 15, 2008 |
| 7348663 |
Integrated circuit package and method for fabricating same |
Mar. 25, 2008 |
| 7332802 |
Package for semiconductor light emitting element and semiconductor light emitting device |
Feb. 19, 2008 |
| 7298046 |
Semiconductor package having non-ceramic based window frame |
Nov. 20, 2007 |
| 7294925 |
Optical scanner package having heating dam |
Nov. 13, 2007 |
| 7271480 |
Constraint stiffener design |
Sep. 18, 2007 |
| 7262498 |
Assembly with a ring and bonding pads formed of a same material on a substrate |
Aug. 28, 2007 |
| 7259450 |
Double-packaged multi-chip semiconductor module |
Aug. 21, 2007 |
| 7256067 |
LGA fixture for indium assembly process |
Aug. 14, 2007 |
| 7253029 |
Non-magnetic, hermetically-sealed micro device package |
Aug. 7, 2007 |
| 7245022 |
Semiconductor module with improved interposer structure and method for forming the same |
Jul. 17, 2007 |
| 7245009 |
Hermetic cavity package |
Jul. 17, 2007 |
| 7233065 |
Semiconductor device having capacitors for reducing power source noise |
Jun. 19, 2007 |
| 7230333 |
Semiconductor package |
Jun. 12, 2007 |
| 7224047 |
Semiconductor device package with reduced leakage |
May. 29, 2007 |
| 7211889 |
Semiconductor package and method for manufacturing the same |
May. 1, 2007 |
| 7208833 |
Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate |
Apr. 24, 2007 |
| 7205652 |
Electronic assembly including multiple substrates |
Apr. 17, 2007 |
| 7202552 |
MEMS package using flexible substrates, and method thereof |
Apr. 10, 2007 |
| 7196426 |
Multilayered substrate for semiconductor device |
Mar. 27, 2007 |
| 7196414 |
Semiconductor package with heat sink |
Mar. 27, 2007 |
| 7192870 |
Semiconductor device and fabrication process therefor |
Mar. 20, 2007 |
| 7173331 |
Hermetic sealing cap and method of manufacturing the same |
Feb. 6, 2007 |
| 7170165 |
Circuit board assembly with a brace surrounding a ball-grid array device |
Jan. 30, 2007 |
| 7166911 |
Packaged microchip with premolded-type package |
Jan. 23, 2007 |
| 7154173 |
Semiconductor device and manufacturing method of the same |
Dec. 26, 2006 |
| 7145230 |
Semiconductor device with a solder creep-up prevention zone |
Dec. 5, 2006 |
| 7135768 |
Hermetic seal |
Nov. 14, 2006 |
| 7132745 |
Method for attaching shields on substrates |
Nov. 7, 2006 |
| 7132746 |
Electronic assembly with solder-bonded heat sink |
Nov. 7, 2006 |
| 7132748 |
Semiconductor apparatus |
Nov. 7, 2006 |
| 7129119 |
Method for fabricating semiconductor packages |
Oct. 31, 2006 |
| 7129571 |
Semiconductor chip package having decoupling capacitor and manufacturing method thereof |
Oct. 31, 2006 |
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