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Class Information
Number: 257/710
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Entirely of metal except for feedthrough > With specified means (e.g., lip) to seal base to cap
Description: Subject matter wherein specific means are provided to seal the cap to the base such as, for example, a bead or lip or boss around the periphery of the base.










Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
8704360 Top port surface mount silicon condenser microphone package Apr. 22, 2014
8704361 Sealing glass for semiconductor device, sealing material, sealing material paste, and semiconductor device and its production process Apr. 22, 2014
8674498 MEMS package and method for the production thereof Mar. 18, 2014
8652883 Methods of manufacture of bottom port surface mount silicon condenser microphone packages Feb. 18, 2014
8633064 Methods of manufacture of top port multipart surface mount silicon condenser microphone package Jan. 21, 2014
8629005 Methods of manufacture of bottom port surface mount silicon condenser microphone packages Jan. 14, 2014
8629552 Top port multi-part surface mount silicon condenser microphone package Jan. 14, 2014
8624387 Top port multi-part surface mount silicon condenser microphone package Jan. 7, 2014
8624386 Bottom port multi-part surface mount silicon condenser microphone package Jan. 7, 2014
8624385 Top port surface mount silicon condenser microphone package Jan. 7, 2014
8624384 Bottom port surface mount silicon condenser microphone package Jan. 7, 2014
8623710 Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages Jan. 7, 2014
8623709 Methods of manufacture of top port surface mount silicon condenser microphone packages Jan. 7, 2014
8617934 Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages Dec. 31, 2013
8598701 Semiconductor device Dec. 3, 2013
8592959 Semiconductor device mounted on a wiring board having a cap Nov. 26, 2013
8581239 Package structure and semiconductor structure thereof Nov. 12, 2013
8575748 Wafer-level packaging with compression-controlled seal ring bonding Nov. 5, 2013
8564123 Chip package and fabrication method thereof Oct. 22, 2013
8558371 Method for wafer level package and semiconductor device fabricated using the same Oct. 15, 2013
8546936 Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package Oct. 1, 2013
8541891 Semiconductor device Sep. 24, 2013
8502372 Low-cost 3D face-to-face out assembly Aug. 6, 2013
8481859 Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom Jul. 9, 2013
8476755 High frequency ceramic package and fabrication method for the same Jul. 2, 2013
8471382 Package and high frequency terminal structure for the same Jun. 25, 2013
8446004 Power light emitting die package with reflecting lens and the method of making the same May. 21, 2013
8421219 Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same Apr. 16, 2013
8421838 Optical device, optical scanning device, image forming apparatus, and manufacturing method of optical device Apr. 16, 2013
8384212 Semiconductor equipment and method of manufacturing the same Feb. 26, 2013
8351222 Package carrier for enclosing at least one microelectronic device Jan. 8, 2013
8338851 Multi-layer LED array engine Dec. 25, 2012
8314486 Integrated circuit packaging system with shield and method of manufacture thereof Nov. 20, 2012
8309388 MEMS package having formed metal lid Nov. 13, 2012
8304845 Method for sealing an opening Nov. 6, 2012
8268670 Method of semiconductor device protection Sep. 18, 2012
8264059 Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield Sep. 11, 2012
8247900 Flip chip package having enhanced thermal and mechanical performance Aug. 21, 2012
8227911 Method and structure of wafer level encapsulation of integrated circuits with cavity Jul. 24, 2012
8164181 Semiconductor device packaging structure Apr. 24, 2012
8143717 Surface mount package with ceramic sidewalls Mar. 27, 2012
8129838 Housed active microstructures with direct contacting to a substrate Mar. 6, 2012
8120168 Methods and materials useful for chip stacking, chip and wafer bonding Feb. 21, 2012
8120170 Integrated package circuit with stiffener Feb. 21, 2012
8094454 Immersion cooling apparatus for a power semiconductor device Jan. 10, 2012
8089146 Semiconductor device and heat radiation member Jan. 3, 2012
8080872 Surface mount package with high thermal conductivity Dec. 20, 2011
8076771 Semiconductor device having metal cap divided by slit Dec. 13, 2011
8063482 Heat spreader as mechanical reinforcement for ultra-thin die Nov. 22, 2011
8053887 Semiconductor assembly Nov. 8, 2011

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