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Class Information
Number: 257/710
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Entirely of metal except for feedthrough > With specified means (e.g., lip) to seal base to cap
Description: Subject matter wherein specific means are provided to seal the cap to the base such as, for example, a bead or lip or boss around the periphery of the base.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619308 |
Multi-lid semiconductor package |
Nov. 17, 2009 |
| 7615842 |
Inductor integrated chip |
Nov. 10, 2009 |
| 7598611 |
Semiconductor device with side terminals |
Oct. 6, 2009 |
| 7595540 |
Semiconductor device and method of manufacturing the same |
Sep. 29, 2009 |
| 7582964 |
Semiconductor package having non-ceramic based window frame |
Sep. 1, 2009 |
| 7582951 |
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages |
Sep. 1, 2009 |
| 7576427 |
Cold weld hermetic MEMS package and method of manufacture |
Aug. 18, 2009 |
| 7576426 |
Wafer level package including a device wafer integrated with a passive component |
Aug. 18, 2009 |
| 7573718 |
Spacer, printed circuit board, and electronic equipment |
Aug. 11, 2009 |
| 7566965 |
Semiconductor module |
Jul. 28, 2009 |
| 7541669 |
Semiconductor device package with base features to reduce leakage |
Jun. 2, 2009 |
| 7531899 |
Ball grid array package |
May. 12, 2009 |
| 7528481 |
Wafer level packaging cap and fabrication method thereof |
May. 5, 2009 |
| 7528482 |
Embedded chip package with improved heat dissipation performance and method of making the same |
May. 5, 2009 |
| 7518233 |
Sealing structure for multi-chip module |
Apr. 14, 2009 |
| 7518234 |
MEMS direct chip attach packaging methodologies and apparatuses for harsh environments |
Apr. 14, 2009 |
| 7511373 |
Cap package for micro electro-mechanical system |
Mar. 31, 2009 |
| 7508064 |
Package for sealing an integrated circuit die |
Mar. 24, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7495333 |
Seal cover structure comprising a nickel-tin (Ni--Sn) alloy barrier layer formed between a nickel (Ni) plating layer and a gold-tin (Au--Sn) brazing layer having Sn content of 20.65 to 25 WT % |
Feb. 24, 2009 |
| 7489033 |
Electronic assembly with hot spot cooling |
Feb. 10, 2009 |
| 7482686 |
Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same |
Jan. 27, 2009 |
| 7476955 |
Die package having an adhesive flow restriction area |
Jan. 13, 2009 |
| 7456499 |
Power light emitting die package with reflecting lens and the method of making the same |
Nov. 25, 2008 |
| 7446411 |
Semiconductor structure and method of assembly |
Nov. 4, 2008 |
| 7443024 |
Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same |
Oct. 28, 2008 |
| 7439617 |
Capillary underflow integral heat spreader |
Oct. 21, 2008 |
| 7436056 |
Electronic component package |
Oct. 14, 2008 |
| 7429501 |
Lid and method of employing a lid on an integrated circuit |
Sep. 30, 2008 |
| 7414310 |
Waferscale package system |
Aug. 19, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7394153 |
Encapsulation of electronic devices |
Jul. 1, 2008 |
| 7387902 |
Methods for packaging image sensitive electronic devices |
Jun. 17, 2008 |
| 7388282 |
Micro-electro-mechanical system (MEMS) package having hydrophobic layer |
Jun. 17, 2008 |
| 7382046 |
Semiconductor device protection cover, and semiconductor device unit including the cover |
Jun. 3, 2008 |
| 7378294 |
Wafer-level sealed microdevice having trench isolation and methods for making the same |
May. 27, 2008 |
| 7378748 |
Solid-state imaging device and method for manufacturing the same |
May. 27, 2008 |
| 7372700 |
Plasma display device |
May. 13, 2008 |
| 7368816 |
Micro-electro-mechanical system (MEMS) package having metal sealing member |
May. 6, 2008 |
| 7365981 |
Fluid-cooled electronic system |
Apr. 29, 2008 |
| 7358106 |
Hermetic MEMS package and method of manufacture |
Apr. 15, 2008 |
| 7348663 |
Integrated circuit package and method for fabricating same |
Mar. 25, 2008 |
| 7332802 |
Package for semiconductor light emitting element and semiconductor light emitting device |
Feb. 19, 2008 |
| 7298046 |
Semiconductor package having non-ceramic based window frame |
Nov. 20, 2007 |
| 7294925 |
Optical scanner package having heating dam |
Nov. 13, 2007 |
| 7271480 |
Constraint stiffener design |
Sep. 18, 2007 |
| 7262498 |
Assembly with a ring and bonding pads formed of a same material on a substrate |
Aug. 28, 2007 |
| 7259450 |
Double-packaged multi-chip semiconductor module |
Aug. 21, 2007 |
| 7256067 |
LGA fixture for indium assembly process |
Aug. 14, 2007 |
| 7253029 |
Non-magnetic, hermetically-sealed micro device package |
Aug. 7, 2007 |
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