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Class Information
Number: 257/709
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Entirely of metal except for feedthrough > With specified insulator to isolate device from housing
Description: Subject matter wherein a specific insulator means is provided to electrically isolate the active solid-state device contained in the metal package or housing from the metal package or housing to prevent electrical short circuits due to the housing or package.










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
5698899 Semiconductor device with first and second sealing resins Dec. 16, 1997
5639990 Solid printed substrate and electronic circuit package using the same Jun. 17, 1997
5629835 Metal ball grid array package with improved thermal conductivity May. 13, 1997
5552636 Discrete transitor assembly Sep. 3, 1996
5508560 Semiconductor module Apr. 16, 1996
5480727 Electronic device assembly and method for making Jan. 2, 1996
5451818 Millimeter wave ceramic package Sep. 19, 1995
5394011 Package structure for semiconductor devices and method of manufacturing the same Feb. 28, 1995
5367196 Molded plastic semiconductor package including an aluminum alloy heat spreader Nov. 22, 1994
5321582 Electronic component heat sink attachment using a low force spring Jun. 14, 1994
5291064 Package structure for semiconductor device having a flexible wiring circuit member spaced from the package casing Mar. 1, 1994
5235209 Multi-layer lead frame for a semiconductor device with contact geometry Aug. 10, 1993
5175611 Microwave integrated circuit package to eliminate alumina substrate cracking Dec. 29, 1992
5155299 Aluminum alloy semiconductor packages Oct. 13, 1992
5103292 Metal pin grid array package Apr. 7, 1992
5023703 Semiconductor device Jun. 11, 1991
5001299 Explosively formed electronic packages Mar. 19, 1991
4961105 Arrangement of a semiconductor device for use in a card Oct. 2, 1990
4908694 Semiconductor device Mar. 13, 1990
4881117 Semiconductor power device formed of a multiplicity of identical parallel-connected elements Nov. 14, 1989
4686324 Cold-seal package for withstanding high temperatures Aug. 11, 1987
4577056 Hermetically sealed metal package Mar. 18, 1986
4574299 Thyristor packaging system Mar. 4, 1986
4563541 Package providing high heat dissipation, in particular for microelectronics Jan. 7, 1986
4499485 Semiconductor unit Feb. 12, 1985
4443655 Extruded semiconductor package and fabrication method Apr. 17, 1984
4309507 Glass and hermetic seal Jan. 5, 1982
4266089 All metal flat package having excellent heat transfer characteristics May. 5, 1981
4266090 All metal flat package May. 5, 1981
4262300 Microcircuit package formed of multi-components Apr. 14, 1981
4167647 Hybrid microelectronic circuit package Sep. 11, 1979
4152718 Semiconductor structure for millimeter waves May. 1, 1979
4047197 Housing and lead structure for a series connected semiconductor rectifier arrangement Sep. 6, 1977
3988825 Method of hermetically sealing an electrical component in a metallic housing Nov. 2, 1976

1 2 3










 
 
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