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Browse by Category: Main > Physics
Class Information
Number: 257/709
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Entirely of metal except for feedthrough > With specified insulator to isolate device from housing
Description: Subject matter wherein a specific insulator means is provided to electrically isolate the active solid-state device contained in the metal package or housing from the metal package or housing to prevent electrical short circuits due to the housing or package.










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8680671 Self-aligned double patterning for memory and other microelectronic devices Mar. 25, 2014
8519531 Electrical and/or electronic device with elastic contact element Aug. 27, 2013
8324724 LED assembly and manufacturing method thereof Dec. 4, 2012
8143708 Semiconductor device and method for manufacturing the same Mar. 27, 2012
8084777 Light emitting diode source with protective barrier Dec. 27, 2011
7986039 Wafer assembly comprising MEMS wafer with polymerized siloxane attachment surface Jul. 26, 2011
7952185 Semiconductor device with hollow structure May. 31, 2011
7911798 Memory heat sink device provided with a larger heat dissipating area Mar. 22, 2011
7847379 Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same Dec. 7, 2010
7755897 Memory module assembly with heat dissipation device Jul. 13, 2010
7709099 Bonded body, wafer support member using the same, and wafer treatment method May. 4, 2010
7687895 Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips Mar. 30, 2010
7663228 Electronic component and electronic component module Feb. 16, 2010
7656023 Electronic parts packaging structure and method of manufacturing the same Feb. 2, 2010
7635918 High frequency device module and manufacturing method thereof Dec. 22, 2009
7622804 Semiconductor device and method of manufacturing the same Nov. 24, 2009
7521296 Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material Apr. 21, 2009
7521794 Intrinsic thermal enhancement for FBGA package Apr. 21, 2009
7504670 Sealing structure for mounting a semiconductor device to a substrate Mar. 17, 2009
7453145 Electronics unit Nov. 18, 2008
7429790 Semiconductor structure and method of manufacture Sep. 30, 2008
7365423 Redistributed solder pads using etched lead frame Apr. 29, 2008
RE39957 Method of making semiconductor package with heat spreader Dec. 25, 2007
7276788 Hydrophobic foamed insulators for high density circuits Oct. 2, 2007
7259450 Double-packaged multi-chip semiconductor module Aug. 21, 2007
7256491 Thermal interconnect systems methods of production and uses thereof Aug. 14, 2007
7235877 Redistributed solder pads using etched lead frame Jun. 26, 2007
7235431 Methods for packaging a plurality of semiconductor dice using a flowable dielectric material Jun. 26, 2007
7173332 Placement tool for wafer scale caps Feb. 6, 2007
7145230 Semiconductor device with a solder creep-up prevention zone Dec. 5, 2006
7135768 Hermetic seal Nov. 14, 2006
7088010 Chip packaging compositions, packages and systems made therewith, and methods of making same Aug. 8, 2006
7078730 Semiconductor light-emitting device and method of manufacturing the same and mounting plate Jul. 18, 2006
7067903 Heat spreader and semiconductor device and package using the same Jun. 27, 2006
7067922 Semiconductor device Jun. 27, 2006
7053481 High capacitance package substrate May. 30, 2006
7049695 Method and device for heat dissipation in semiconductor modules May. 23, 2006
7045868 Wafer-level sealed microdevice having trench isolation and methods for making the same May. 16, 2006
7033927 Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer Apr. 25, 2006
6992380 Package for semiconductor device having a device-supporting polymeric material covering a solder ball array area Jan. 31, 2006
6967401 Semiconductor device, semiconductor module and hard disk Nov. 22, 2005
6963130 Heatsinking and packaging of integrated circuit chips Nov. 8, 2005
6949825 Laminates for encapsulating devices Sep. 27, 2005
6911721 Semiconductor device, method for manufacturing semiconductor device and electronic equipment Jun. 28, 2005
6858942 Semiconductor package with improved thermal cycling performance, and method of forming same Feb. 22, 2005
6856013 Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit Feb. 15, 2005
6853068 Heatsinking and packaging of integrated circuit chips Feb. 8, 2005
6812561 Thin high-frequency module having integrated circuit chip with little breakage Nov. 2, 2004
6809929 Heat sink assembly with retaining device Oct. 26, 2004
6798061 Multiple semiconductor chip (multi-chip) module for use in power applications Sep. 28, 2004

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