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Class Information
Number: 257/709
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Entirely of metal except for feedthrough > With specified insulator to isolate device from housing
Description: Subject matter wherein a specific insulator means is provided to electrically isolate the active solid-state device contained in the metal package or housing from the metal package or housing to prevent electrical short circuits due to the housing or package.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7521296 |
Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material |
Apr. 21, 2009 |
| 7521794 |
Intrinsic thermal enhancement for FBGA package |
Apr. 21, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7453145 |
Electronics unit |
Nov. 18, 2008 |
| 7429790 |
Semiconductor structure and method of manufacture |
Sep. 30, 2008 |
| 7365423 |
Redistributed solder pads using etched lead frame |
Apr. 29, 2008 |
| RE39957 |
Method of making semiconductor package with heat spreader |
Dec. 25, 2007 |
| 7276788 |
Hydrophobic foamed insulators for high density circuits |
Oct. 2, 2007 |
| 7259450 |
Double-packaged multi-chip semiconductor module |
Aug. 21, 2007 |
| 7256491 |
Thermal interconnect systems methods of production and uses thereof |
Aug. 14, 2007 |
| 7235431 |
Methods for packaging a plurality of semiconductor dice using a flowable dielectric material |
Jun. 26, 2007 |
| 7235877 |
Redistributed solder pads using etched lead frame |
Jun. 26, 2007 |
| 7173332 |
Placement tool for wafer scale caps |
Feb. 6, 2007 |
| 7145230 |
Semiconductor device with a solder creep-up prevention zone |
Dec. 5, 2006 |
| 7135768 |
Hermetic seal |
Nov. 14, 2006 |
| 7088010 |
Chip packaging compositions, packages and systems made therewith, and methods of making same |
Aug. 8, 2006 |
| 7078730 |
Semiconductor light-emitting device and method of manufacturing the same and mounting plate |
Jul. 18, 2006 |
| 7067903 |
Heat spreader and semiconductor device and package using the same |
Jun. 27, 2006 |
| 7067922 |
Semiconductor device |
Jun. 27, 2006 |
| 7053481 |
High capacitance package substrate |
May. 30, 2006 |
| 7049695 |
Method and device for heat dissipation in semiconductor modules |
May. 23, 2006 |
| 7045868 |
Wafer-level sealed microdevice having trench isolation and methods for making the same |
May. 16, 2006 |
| 7033927 |
Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer |
Apr. 25, 2006 |
| 6992380 |
Package for semiconductor device having a device-supporting polymeric material covering a solder ball array area |
Jan. 31, 2006 |
| 6967401 |
Semiconductor device, semiconductor module and hard disk |
Nov. 22, 2005 |
| 6963130 |
Heatsinking and packaging of integrated circuit chips |
Nov. 8, 2005 |
| 6949825 |
Laminates for encapsulating devices |
Sep. 27, 2005 |
| 6911721 |
Semiconductor device, method for manufacturing semiconductor device and electronic equipment |
Jun. 28, 2005 |
| 6858942 |
Semiconductor package with improved thermal cycling performance, and method of forming same |
Feb. 22, 2005 |
| 6856013 |
Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit |
Feb. 15, 2005 |
| 6853068 |
Heatsinking and packaging of integrated circuit chips |
Feb. 8, 2005 |
| 6812561 |
Thin high-frequency module having integrated circuit chip with little breakage |
Nov. 2, 2004 |
| 6809929 |
Heat sink assembly with retaining device |
Oct. 26, 2004 |
| 6798053 |
IC chip package |
Sep. 28, 2004 |
| 6798061 |
Multiple semiconductor chip (multi-chip) module for use in power applications |
Sep. 28, 2004 |
| 6774481 |
Solid-state image pickup device |
Aug. 10, 2004 |
| 6753600 |
Structure of a substrate for a high density semiconductor package |
Jun. 22, 2004 |
| 6748350 |
Method to compensate for stress between heat spreader and thermal interface material |
Jun. 8, 2004 |
| 6740970 |
Semiconductor device with stack of semiconductor chips |
May. 25, 2004 |
| 6703703 |
Low cost power semiconductor module without substrate |
Mar. 9, 2004 |
| 6680532 |
Multi chip module |
Jan. 20, 2004 |
| 6664624 |
Semiconductor device and manufacturing method thereof |
Dec. 16, 2003 |
| 6649978 |
Semiconductor module having multiple semiconductor chips |
Nov. 18, 2003 |
| 6630735 |
Insulator/metal bonding island for active-area silver epoxy bonding |
Oct. 7, 2003 |
| 6624523 |
Structure and package of a heat spreader substrate |
Sep. 23, 2003 |
| 6614108 |
Electronic package and method therefor |
Sep. 2, 2003 |
| 6593652 |
Semiconductor device reinforced by a highly elastic member made of a synthetic resin |
Jul. 15, 2003 |
| 6519152 |
Yarn processing system |
Feb. 11, 2003 |
| 6507104 |
Semiconductor package with embedded heat-dissipating device |
Jan. 14, 2003 |
| 6495913 |
Semiconductor clamped-stack assembly |
Dec. 17, 2002 |
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