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Class Information
Number: 257/708
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Entirely of metal except for feedthrough
Description: Subject matter wherein the housing or package is made entirely of metal except for the portion wherein the electrical contacts or leads are fed through.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7365423 |
Redistributed solder pads using etched lead frame |
Apr. 29, 2008 |
| 7332802 |
Package for semiconductor light emitting element and semiconductor light emitting device |
Feb. 19, 2008 |
| 7329957 |
Circuit device and manufacturing method thereof |
Feb. 12, 2008 |
| 7298046 |
Semiconductor package having non-ceramic based window frame |
Nov. 20, 2007 |
| 7295436 |
Cooling system for computer components |
Nov. 13, 2007 |
| 7279023 |
High thermal conductivity metal matrix composites |
Oct. 9, 2007 |
| 7276788 |
Hydrophobic foamed insulators for high density circuits |
Oct. 2, 2007 |
| 7259450 |
Double-packaged multi-chip semiconductor module |
Aug. 21, 2007 |
| 7242085 |
Semiconductor device including a semiconductor chip mounted on a metal base |
Jul. 10, 2007 |
| 7242028 |
Light emitting diode light source |
Jul. 10, 2007 |
| 7235877 |
Redistributed solder pads using etched lead frame |
Jun. 26, 2007 |
| 7221048 |
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier |
May. 22, 2007 |
| 7205652 |
Electronic assembly including multiple substrates |
Apr. 17, 2007 |
| 7170171 |
Support ring for use with a contact pad and semiconductor device components including the same |
Jan. 30, 2007 |
| 7145230 |
Semiconductor device with a solder creep-up prevention zone |
Dec. 5, 2006 |
| 7112881 |
Semiconductor device |
Sep. 26, 2006 |
| 7098533 |
Printed circuit board with a heat dissipation element and package comprising the printed circuit board |
Aug. 29, 2006 |
| 7087937 |
Light emitting diode (LED) packaging |
Aug. 8, 2006 |
| 7081661 |
High-frequency module and method for manufacturing the same |
Jul. 25, 2006 |
| 7071551 |
Device used to produce or examine semiconductors |
Jul. 4, 2006 |
| 7049695 |
Method and device for heat dissipation in semiconductor modules |
May. 23, 2006 |
| 7049688 |
Semiconductor device having a pair of heat sinks and method for manufacturing the same |
May. 23, 2006 |
| 7012192 |
Feedthrough terminal assembly with lead wire bonding pad for human implant applications |
Mar. 14, 2006 |
| 6992382 |
Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon |
Jan. 31, 2006 |
| 6963130 |
Heatsinking and packaging of integrated circuit chips |
Nov. 8, 2005 |
| 6882040 |
Semiconductor device |
Apr. 19, 2005 |
| 6879033 |
Semiconductor device |
Apr. 12, 2005 |
| 6867491 |
Metal core integrated circuit package with electrically isolated regions and associated methods |
Mar. 15, 2005 |
| 6861745 |
Method and apparatus for conducting heat in a flip-chip assembly |
Mar. 1, 2005 |
| 6853082 |
Method and structure for integrating metal insulator metal capacitor with copper |
Feb. 8, 2005 |
| 6853068 |
Heatsinking and packaging of integrated circuit chips |
Feb. 8, 2005 |
| 6853066 |
Semiconductor device |
Feb. 8, 2005 |
| 6847110 |
Method and apparatus for conducting heat in a flip-chip assembly |
Jan. 25, 2005 |
| 6841857 |
Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip |
Jan. 11, 2005 |
| 6816375 |
Heat sink attachment |
Nov. 9, 2004 |
| 6809337 |
Liquid crystal display devices having fill holes and electrical contacts on the back side of the die |
Oct. 26, 2004 |
| 6806567 |
Chip on board with heat sink attachment and assembly |
Oct. 19, 2004 |
| 6806563 |
Composite capacitor and stiffener for chip carrier |
Oct. 19, 2004 |
| 6784537 |
Semiconductor device of surface-mounting type |
Aug. 31, 2004 |
| 6773964 |
Integrated circuit package including sealed gaps and prevention of vapor induced failures and method of manufacturing the same |
Aug. 10, 2004 |
| 6762935 |
Electronic apparatus and electric part |
Jul. 13, 2004 |
| 6753596 |
Resin-sealed semiconductor device |
Jun. 22, 2004 |
| 6744134 |
Use of a reference fiducial on a semiconductor package to monitor and control a singulation method |
Jun. 1, 2004 |
| 6696747 |
Semiconductor package having reduced thickness |
Feb. 24, 2004 |
| 6680530 |
Multi-step transmission line for multilayer packaging |
Jan. 20, 2004 |
| 6670704 |
Device for electronic packaging, pin jig fixture |
Dec. 30, 2003 |
| 6664624 |
Semiconductor device and manufacturing method thereof |
Dec. 16, 2003 |
| 6649937 |
Semiconductor device with components embedded in backside diamond layer |
Nov. 18, 2003 |
| 6646339 |
Thin and heat radiant semiconductor package and method for manufacturing |
Nov. 11, 2003 |
| 6624523 |
Structure and package of a heat spreader substrate |
Sep. 23, 2003 |
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