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Browse by Category: Main > Physics
Class Information
Number: 257/708
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Entirely of metal except for feedthrough
Description: Subject matter wherein the housing or package is made entirely of metal except for the portion wherein the electrical contacts or leads are fed through.










Sub-classes under this class:

Class Number Class Name Patents
257/711 With raised portion of base for mounting semiconductor chip 193
257/709 With specified insulator to isolate device from housing 134
257/710 With specified means (e.g., lip) to seal base to cap 399


Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8680671 Self-aligned double patterning for memory and other microelectronic devices Mar. 25, 2014
8653633 Semiconductor device packages with electromagnetic interference shielding Feb. 18, 2014
8497159 Method of manufacturing leadless integrated circuit packages having electrically routed contacts Jul. 30, 2013
8487426 Semiconductor package with embedded die and manufacturing methods thereof Jul. 16, 2013
8314485 Electronic component Nov. 20, 2012
8309388 MEMS package having formed metal lid Nov. 13, 2012
8237262 Method and system for innovative substrate/package design for a high performance integrated circuit chipset Aug. 7, 2012
8198709 Potted integrated circuit device with aluminum case Jun. 12, 2012
8120054 Light emitting diode package having heat dissipating slugs Feb. 21, 2012
8119516 Bump structure formed from using removable mandrel Feb. 21, 2012
8018052 Integrated circuit package system with side substrate having a top layer Sep. 13, 2011
7989928 Semiconductor device packages with electromagnetic interference shielding Aug. 2, 2011
7932171 Dual metal stud bumping for flip chip applications Apr. 26, 2011
7928545 LED package and fabrication method thereof Apr. 19, 2011
7923822 Integrated circuit package system including shield Apr. 12, 2011
7906841 Wafer level incapsulation chip and encapsulation chip manufacturing method Mar. 15, 2011
7902481 Method of manufacturing sealed electronic component and sealed electronic component Mar. 8, 2011
7847379 Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same Dec. 7, 2010
7846778 Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly Dec. 7, 2010
7821125 Semiconductor device Oct. 26, 2010
7795071 Semiconductor package for fine pitch miniaturization and manufacturing method thereof Sep. 14, 2010
7791155 Detector shield Sep. 7, 2010
7786587 Semiconductor device and method for manufacturing thereof Aug. 31, 2010
7728417 Integrated circuit package system including shield Jun. 1, 2010
7701048 Power module for low thermal resistance and method of fabricating the same Apr. 20, 2010
7687895 Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips Mar. 30, 2010
7663228 Electronic component and electronic component module Feb. 16, 2010
7641709 High thermal conductivity metal matrix composites Jan. 5, 2010
7582964 Semiconductor package having non-ceramic based window frame Sep. 1, 2009
7521794 Intrinsic thermal enhancement for FBGA package Apr. 21, 2009
7504670 Sealing structure for mounting a semiconductor device to a substrate Mar. 17, 2009
7477519 Electronic component package including heat spreading member Jan. 13, 2009
7365423 Redistributed solder pads using etched lead frame Apr. 29, 2008
7332802 Package for semiconductor light emitting element and semiconductor light emitting device Feb. 19, 2008
7329957 Circuit device and manufacturing method thereof Feb. 12, 2008
7298046 Semiconductor package having non-ceramic based window frame Nov. 20, 2007
7295436 Cooling system for computer components Nov. 13, 2007
7279023 High thermal conductivity metal matrix composites Oct. 9, 2007
7276788 Hydrophobic foamed insulators for high density circuits Oct. 2, 2007
7259450 Double-packaged multi-chip semiconductor module Aug. 21, 2007
7242085 Semiconductor device including a semiconductor chip mounted on a metal base Jul. 10, 2007
7242028 Light emitting diode light source Jul. 10, 2007
7235877 Redistributed solder pads using etched lead frame Jun. 26, 2007
7221048 Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier May. 22, 2007
7205652 Electronic assembly including multiple substrates Apr. 17, 2007
7170171 Support ring for use with a contact pad and semiconductor device components including the same Jan. 30, 2007
7145230 Semiconductor device with a solder creep-up prevention zone Dec. 5, 2006
7112881 Semiconductor device Sep. 26, 2006
7098533 Printed circuit board with a heat dissipation element and package comprising the printed circuit board Aug. 29, 2006
7087937 Light emitting diode (LED) packaging Aug. 8, 2006

1 2 3 4










 
 
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