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Browse by Category: Main > Physics
Class Information
Number: 257/707
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink > Directly attached to semiconductor device
Description: Subject matter wherein the heat sink is attached directly to the semiconductor device.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710640 Integrated circuit packaging system with heat slug and method of manufacture thereof Apr. 29, 2014
8705239 Heat dissipation for electronic modules Apr. 22, 2014
8703286 Polymer matrices for polymer solder hybrid materials Apr. 22, 2014
8692281 Light emitting diode submount with high thermal conductivity for high power operation Apr. 8, 2014
8686556 Wafer level applied thermal heat sink Apr. 1, 2014
8680666 Bond wireless power module with double-sided single device cooling and immersion bath cooling Mar. 25, 2014
8674499 Heat radiation component and semiconductor package including same Mar. 18, 2014
8674492 Power module Mar. 18, 2014
8674395 System and method for LED packaging Mar. 18, 2014
8669646 Apparatus and method for grounding an IC package lid for EMI reduction Mar. 11, 2014
8661660 Process for manufacturing LED lighting with integrated heat sink Mar. 4, 2014
8659130 Power module and power module manufacturing method Feb. 25, 2014
8659047 Light emitting device and manufacturing method thereof Feb. 25, 2014
8653651 Semiconductor apparatus and method for manufacturing the same Feb. 18, 2014
8653647 Plastic package and method of fabricating the same Feb. 18, 2014
8648478 Flexible heat sink having ventilation ports and semiconductor package including the same Feb. 11, 2014
8643171 Power semiconductor device Feb. 4, 2014
8643170 Method of assembling semiconductor device including insulating substrate and heat sink Feb. 4, 2014
8623707 Method of fabricating a semiconductor package with integrated substrate thermal slug Jan. 7, 2014
8604608 Semiconductor module Dec. 10, 2013
8604606 Heat sink package Dec. 10, 2013
8598701 Semiconductor device Dec. 3, 2013
8598700 Active thermal control for stacked IC devices Dec. 3, 2013
8582291 Power conversion apparatus Nov. 12, 2013
8581400 Post-passivation interconnect structure Nov. 12, 2013
8581390 Semiconductor device with heat dissipation Nov. 12, 2013
8575765 Semiconductor package having underfill agent dispersion Nov. 5, 2013
8575746 Chip on flexible printed circuit type semiconductor package Nov. 5, 2013
8575657 Direct growth of diamond in backside vias for GaN HEMT devices Nov. 5, 2013
8570745 Electrical connector assembly Oct. 29, 2013
8569892 Semiconductor device and manufacturing method thereof Oct. 29, 2013
8564957 Cooling structure for electronic equipment Oct. 22, 2013
8564953 Semiconductor power module, inverter/converter including the same, and method of manufacturing a cooling jacket for semiconductor power module Oct. 22, 2013
8564122 Circuit board component shim structure Oct. 22, 2013
8564121 Semiconductor device and manufacturing method of semiconductor device Oct. 22, 2013
8564119 Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system Oct. 22, 2013
8564116 Semiconductor device with reinforcement plate and method of forming same Oct. 22, 2013
8558372 Semiconductor device Oct. 15, 2013
8546924 Package structures for integrating thermoelectric components with stacking chips Oct. 1, 2013
8545987 Thermal interface material with thin transfer film or metallization Oct. 1, 2013
8541876 Microelectronic package having direct contact heat spreader and method of manufacturing same Sep. 24, 2013
8541875 Integrated three-dimensional module heat exchanger for power electronics cooling Sep. 24, 2013
8537551 Semiconductor device including semiconductor packages stacked on one another Sep. 17, 2013
8531025 Thermal paste containment for semiconductor modules Sep. 10, 2013
8525214 Semiconductor chip assembly with post/base heat spreader with thermal via Sep. 3, 2013
8520391 Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereof Aug. 27, 2013
8519545 Electronic device comprising a chip disposed on a pin Aug. 27, 2013
8519529 Semiconductor package with lid bonded on wiring board and method of manufacturing the same Aug. 27, 2013
8513800 Semiconductor device and method for manufacturing the same Aug. 20, 2013
8513795 3D IC configuration with contactless communication Aug. 20, 2013











 
 
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