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Class Information
Number: 257/707
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink > Directly attached to semiconductor device
Description: Subject matter wherein the heat sink is attached directly to the semiconductor device.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459784 |
High capacity thin module system |
Dec. 2, 2008 |
| 7459783 |
Light emitting chip package and light source module |
Dec. 2, 2008 |
| 7457122 |
Memory module assembly including a clip for mounting a heat sink thereon |
Nov. 25, 2008 |
| 7456498 |
Integrated circuit package and system interface |
Nov. 25, 2008 |
| 7456492 |
Semiconductor device having semiconductor element, insulation substrate and metal electrode |
Nov. 25, 2008 |
| 7453142 |
System and method for implementing transformer on package substrate |
Nov. 18, 2008 |
| 7449780 |
Apparatus to minimize thermal impedance using copper on die backside |
Nov. 11, 2008 |
| 7449776 |
Cooling devices that use nanowires |
Nov. 11, 2008 |
| 7446417 |
Semiconductor integrated circuit device and fabrication method thereof |
Nov. 4, 2008 |
| 7446410 |
Circuit module with thermal casing systems |
Nov. 4, 2008 |
| 7446409 |
Cavity-down multiple-chip package |
Nov. 4, 2008 |
| 7446408 |
Semiconductor package with heat sink |
Nov. 4, 2008 |
| 7446407 |
Chip package structure |
Nov. 4, 2008 |
| 7446406 |
Circuit device and manufacturing method thereof |
Nov. 4, 2008 |
| 7443025 |
Thermally improved placement of power-dissipating components onto a circuit board |
Oct. 28, 2008 |
| 7443023 |
High capacity thin module system |
Oct. 28, 2008 |
| 7443022 |
Board-on-chip packages |
Oct. 28, 2008 |
| 7439617 |
Capillary underflow integral heat spreader |
Oct. 21, 2008 |
| 7436669 |
3D multi-layer heat conduction diffusion plate |
Oct. 14, 2008 |
| 7436058 |
Reactive solder material |
Oct. 14, 2008 |
| 7436000 |
Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source |
Oct. 14, 2008 |
| 7432591 |
Thermal enhanced plastic ball grid array with heat sink attachment option |
Oct. 7, 2008 |
| 7432586 |
Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages |
Oct. 7, 2008 |
| 7425762 |
Electronic apparatus |
Sep. 16, 2008 |
| 7423342 |
Method for assembling semiconductor switching elements and heat sink in rotary electric machine and rotary electric machine |
Sep. 9, 2008 |
| 7423341 |
Plastic overmolded packages with mechanically decoupled lid attach attachment |
Sep. 9, 2008 |
| 7417312 |
Use of solder paste for heat dissipation |
Aug. 26, 2008 |
| 7417311 |
Semiconductor device and method of fabricating the same |
Aug. 26, 2008 |
| 7414311 |
Ball grid array housing having a cooling foil |
Aug. 19, 2008 |
| 7411790 |
Heat sink with built-in heat pipes for semiconductor packages |
Aug. 12, 2008 |
| 7411281 |
Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same |
Aug. 12, 2008 |
| 7410830 |
Leadless plastic chip carrier and method of fabricating same |
Aug. 12, 2008 |
| 7405933 |
Cooling device, substrate, and electronic equipment |
Jul. 29, 2008 |
| 7400049 |
Integrated circuit package system with heat sink |
Jul. 15, 2008 |
| 7399657 |
Ball grid array packages with thermally conductive containers |
Jul. 15, 2008 |
| 7394659 |
Apparatus and methods for cooling semiconductor integrated circuit package structures |
Jul. 1, 2008 |
| 7394657 |
Method of obtaining enhanced localized thermal interface regions by particle stacking |
Jul. 1, 2008 |
| 7391061 |
Light emitting diode with thermal spreading layer |
Jun. 24, 2008 |
| 7388286 |
Semiconductor package having enhanced heat dissipation and method of fabricating the same |
Jun. 17, 2008 |
| 7385824 |
Processor module with rigidly coupled processor and voltage-regulator heat sinks |
Jun. 10, 2008 |
| 7378747 |
Semiconductor device chip and semiconductor device chip package |
May. 27, 2008 |
| 7378730 |
Thermal interconnect systems methods of production and uses thereof |
May. 27, 2008 |
| 7375964 |
Memory module assembly including a clamp for mounting heat sinks thereon |
May. 20, 2008 |
| 7372147 |
Supporting a circuit package including a substrate having a solder column array |
May. 13, 2008 |
| 7372146 |
Semiconductor module |
May. 13, 2008 |
| 7365422 |
Package of leadframe with heatsinks |
Apr. 29, 2008 |
| 7362573 |
Heat dissipation device |
Apr. 22, 2008 |
| 7361972 |
Chip packaging structure for improving reliability |
Apr. 22, 2008 |
| 7360586 |
Wrap around heat sink apparatus and method |
Apr. 22, 2008 |
| 7357173 |
Cooling device for a chip and method for its production |
Apr. 15, 2008 |
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