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Class Information
Number: 257/707
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink > Directly attached to semiconductor device
Description: Subject matter wherein the heat sink is attached directly to the semiconductor device.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618575 |
Method for wafer scale molding of protective caps |
Nov. 17, 2009 |
| 7615862 |
Heat dissipating package structure and method for fabricating the same |
Nov. 10, 2009 |
| 7615861 |
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards |
Nov. 10, 2009 |
| 7615842 |
Inductor integrated chip |
Nov. 10, 2009 |
| 7615482 |
Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength |
Nov. 10, 2009 |
| 7612446 |
Structures to enhance cooling of computer memory modules |
Nov. 3, 2009 |
| 7609523 |
Memory module assembly including heat sink attached to integrated circuits by adhesive and clips |
Oct. 27, 2009 |
| 7608923 |
Electronic device with flexible heat spreader |
Oct. 27, 2009 |
| 7608917 |
Power semiconductor module |
Oct. 27, 2009 |
| 7608915 |
Heat dissipation semiconductor package |
Oct. 27, 2009 |
| 7608485 |
Highly reliable, cost effective and thermally enhanced AuSn die-attach technology |
Oct. 27, 2009 |
| 7606038 |
Method for producing a printed circuit board with a heat radiating structure and a printed circuit board with a heat radiating structure |
Oct. 20, 2009 |
| 7605465 |
Semiconductor device for high frequency power amplification |
Oct. 20, 2009 |
| 7598535 |
Light-emitting diode assembly and method of fabrication |
Oct. 6, 2009 |
| 7596477 |
Peel strength simulating apparatus, peel strength simulating program storage medium, and peel strength simulating method |
Sep. 29, 2009 |
| 7593228 |
Technique for forming a thermally conductive interface with patterned metal foil |
Sep. 22, 2009 |
| 7589969 |
Folding protective cover for heat-conductive medium |
Sep. 15, 2009 |
| 7586191 |
Integrated circuit apparatus with heat spreader |
Sep. 8, 2009 |
| 7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Sep. 8, 2009 |
| 7586179 |
Wireless semiconductor package for efficient heat dissipation |
Sep. 8, 2009 |
| 7579688 |
Heat radiation structure of semiconductor device, and manufacturing method thereof |
Aug. 25, 2009 |
| 7579687 |
Circuit module turbulence enhancement systems and methods |
Aug. 25, 2009 |
| 7579675 |
Semiconductor device having surface mountable external contact areas and method for producing the same |
Aug. 25, 2009 |
| 7573131 |
Die-up integrated circuit package with grounded stiffener |
Aug. 11, 2009 |
| 7569928 |
Assembly structure of electronic element and heat sink |
Aug. 4, 2009 |
| 7566590 |
Low voltage drop and high thermal performance ball grid array package |
Jul. 28, 2009 |
| 7564690 |
Method for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers |
Jul. 21, 2009 |
| 7564124 |
Semiconductor die package including stacked dice and heat sink structures |
Jul. 21, 2009 |
| 7560812 |
Cooling module against ESD and electronic package, assembly and system using the same |
Jul. 14, 2009 |
| 7554190 |
Liquid metal thermal interface material system |
Jun. 30, 2009 |
| 7550839 |
Integrated circuit package and system interface |
Jun. 23, 2009 |
| 7547966 |
Power semiconductor module |
Jun. 16, 2009 |
| 7547922 |
Light-emitting diode assembly |
Jun. 16, 2009 |
| 7546943 |
Apparatus, system, and method for positioning a printed circuit board component |
Jun. 16, 2009 |
| 7545647 |
Compliant thermal interface structure utilizing spring elements |
Jun. 9, 2009 |
| 7545033 |
Low cost power semiconductor module without substrate |
Jun. 9, 2009 |
| 7541669 |
Semiconductor device package with base features to reduce leakage |
Jun. 2, 2009 |
| 7535085 |
Semiconductor package having improved adhesiveness and ground bonding |
May. 19, 2009 |
| 7534649 |
Thermoset polyimides for microelectronic applications |
May. 19, 2009 |
| 7532480 |
Power delivery for electronic assemblies |
May. 12, 2009 |
| 7532475 |
Semiconductor chip assembly with flexible metal cantilevers |
May. 12, 2009 |
| 7529095 |
Integrated electrical shield in a heat sink |
May. 5, 2009 |
| 7525182 |
Multi-package module and electronic device using the same |
Apr. 28, 2009 |
| 7524703 |
Integrated circuit stacking system and method |
Apr. 28, 2009 |
| 7521792 |
Semiconductor package with heat spreader |
Apr. 21, 2009 |
| 7518233 |
Sealing structure for multi-chip module |
Apr. 14, 2009 |
| 7518200 |
Semiconductor integrated circuit chip with a nano-structure-surface passivation film |
Apr. 14, 2009 |
| 7514784 |
Electronic circuit device and production method of the same |
Apr. 7, 2009 |
| 7514783 |
Semiconductor module |
Apr. 7, 2009 |
| 7514782 |
Semiconductor device |
Apr. 7, 2009 |
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