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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6858930 |
Multi chip module |
Feb. 22, 2005 |
| 6856011 |
Semiconductor chip package and method of fabricating same |
Feb. 15, 2005 |
| 6856015 |
Semiconductor package with heat sink |
Feb. 15, 2005 |
| 6856016 |
Method and apparatus using nanotubes for cooling and grounding die |
Feb. 15, 2005 |
| 6853059 |
Semiconductor package having improved adhesiveness and ground bonding |
Feb. 8, 2005 |
| 6853068 |
Heatsinking and packaging of integrated circuit chips |
Feb. 8, 2005 |
| 6853069 |
Packaged die on PCB with heat sink encapsulant and methods |
Feb. 8, 2005 |
| 6849933 |
Semiconductor mounting device and method of manufacturing the same |
Feb. 1, 2005 |
| 6849940 |
Integrated circuit package for the transfer of heat generated by the inte circuit and method of fabricating same |
Feb. 1, 2005 |
| 6849941 |
Heat sink and heat spreader assembly |
Feb. 1, 2005 |
| 6849942 |
Semiconductor package with heat sink attached to substrate |
Feb. 1, 2005 |
| 6850411 |
Method and structure to support heat sink arrangement on chip carrier packages |
Feb. 1, 2005 |
| 6847110 |
Method and apparatus for conducting heat in a flip-chip assembly |
Jan. 25, 2005 |
| 6847111 |
Semiconductor device with heat-dissipating capability |
Jan. 25, 2005 |
| 6847112 |
Semiconductor device and manufacturing the same |
Jan. 25, 2005 |
| 6844622 |
Semiconductor package with heat sink |
Jan. 18, 2005 |
| 6841857 |
Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip |
Jan. 11, 2005 |
| 6841867 |
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials |
Jan. 11, 2005 |
| 6842341 |
Electrical circuit apparatus and method for assembling same |
Jan. 11, 2005 |
| 6842342 |
Heat sink |
Jan. 11, 2005 |
| 6838761 |
Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield |
Jan. 4, 2005 |
| 6835004 |
Opto-electronic component packaging |
Dec. 28, 2004 |
| 6836005 |
Semiconductor device |
Dec. 28, 2004 |
| 6836006 |
Semiconductor module |
Dec. 28, 2004 |
| 6836014 |
Optical testing of integrated circuits with temperature control |
Dec. 28, 2004 |
| 6836015 |
Optical assemblies for transmitting and manipulating optical beams |
Dec. 28, 2004 |
| 6833614 |
Semiconductor package and semiconductor device |
Dec. 21, 2004 |
| 6833617 |
Composite material including copper and cuprous oxide and application thereof |
Dec. 21, 2004 |
| 6833993 |
Multichip package |
Dec. 21, 2004 |
| 6830813 |
Stress-reducing structure for electronic devices |
Dec. 14, 2004 |
| 6831351 |
Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material |
Dec. 14, 2004 |
| 6831358 |
Heat-dissipative coating |
Dec. 14, 2004 |
| 6831359 |
Power semiconductor module |
Dec. 14, 2004 |
| 6827130 |
Heatsink assembly and method of manufacturing the same |
Dec. 7, 2004 |
| 6828671 |
Enhanced BGA grounded heatsink |
Dec. 7, 2004 |
| 6828672 |
Thermally conductive silk-screenable interface material |
Dec. 7, 2004 |
| 6828673 |
Heat sink assembly |
Dec. 7, 2004 |
| 6828687 |
Cavity down ball grid array package structure and carrier thereof |
Dec. 7, 2004 |
| 6823915 |
Heat-conducting adhesive joint with an adhesive-filled, porous heat conductor |
Nov. 30, 2004 |
| 6825066 |
Stiffener design |
Nov. 30, 2004 |
| 6825547 |
Semiconductor device including edge bond pads |
Nov. 30, 2004 |
| 6825556 |
Integrated circuit package design with non-orthogonal die cut out |
Nov. 30, 2004 |
| 6826052 |
Retaining assembly for heat sink |
Nov. 30, 2004 |
| 6820329 |
Method of manufacturing multi-chip stacking package |
Nov. 23, 2004 |
| 6820798 |
Method for producing circuit arrangments |
Nov. 23, 2004 |
| 6822340 |
Low capacitance coupling wire bonded semiconductor device |
Nov. 23, 2004 |
| 6817405 |
Apparatus having forced fluid cooling and pin-fin heat sink |
Nov. 16, 2004 |
| 6818974 |
Semiconductor device |
Nov. 16, 2004 |
| 6818980 |
Stacked semiconductor package and method of manufacturing the same |
Nov. 16, 2004 |
| 6818981 |
Heat spreader interconnect for thermally enhanced PBGA packages |
Nov. 16, 2004 |
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