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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6921969 |
Semiconductor module and method of producing a semiconductor module |
Jul. 26, 2005 |
| 6921970 |
Package for electronic parts, lid thereof, material for the lid and method for producing the lid material |
Jul. 26, 2005 |
| 6921971 |
Heat releasing member, package for accommodating semiconductor element and semiconductor device |
Jul. 26, 2005 |
| 6922339 |
Heat dissipating structure of printed circuit board and fabricating method thereof |
Jul. 26, 2005 |
| 6919625 |
Surface mount multichip devices |
Jul. 19, 2005 |
| 6919630 |
Semiconductor package with heat spreader |
Jul. 19, 2005 |
| 6916122 |
Modular heat sinks |
Jul. 12, 2005 |
| 6917129 |
Electromechanical drive device |
Jul. 12, 2005 |
| 6913069 |
Cooling device having fins arranged to funnel air |
Jul. 5, 2005 |
| 6914325 |
Power semiconductor module |
Jul. 5, 2005 |
| 6914783 |
Digital micromirror device mounting system |
Jul. 5, 2005 |
| 6911728 |
Member for electronic circuit, method for manufacturing the member, and electronic part |
Jun. 28, 2005 |
| 6911737 |
Semiconductor device package and method |
Jun. 28, 2005 |
| 6912130 |
Combined member of aluminum-ceramics |
Jun. 28, 2005 |
| 6909169 |
Grounded embedded flip chip RF integrated circuit |
Jun. 21, 2005 |
| 6909176 |
Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate |
Jun. 21, 2005 |
| 6906413 |
Integrated heat spreader lid |
Jun. 14, 2005 |
| 6906414 |
Ball grid array package with patterned stiffener layer |
Jun. 14, 2005 |
| 6901993 |
Heat sink assembly having combined fins |
Jun. 7, 2005 |
| 6899164 |
Heat sink with guiding fins |
May. 31, 2005 |
| 6900534 |
Direct attach chip scale package |
May. 31, 2005 |
| 6897558 |
Power electronic component module and method for assembling same |
May. 24, 2005 |
| 6898081 |
Radiator structure for a computer device |
May. 24, 2005 |
| 6898084 |
Thermal diffusion apparatus |
May. 24, 2005 |
| 6894375 |
Semiconductor device, semiconductor module and hard disk |
May. 17, 2005 |
| 6894898 |
Fixing apparatus for heat sink |
May. 17, 2005 |
| 6891278 |
Semiconductor component |
May. 10, 2005 |
| 6888231 |
Surface mounting semiconductor device |
May. 3, 2005 |
| 6888238 |
Low warpage flip chip package solution-channel heat spreader |
May. 3, 2005 |
| 6888257 |
Interface adhesive |
May. 3, 2005 |
| 6882042 |
Thermally and electrically enhanced ball grid array packaging |
Apr. 19, 2005 |
| 6882535 |
Integrated heat spreader with downset edge, and method of making same |
Apr. 19, 2005 |
| 6882537 |
Electrical assemblage and method for removing heat locally generated therefrom |
Apr. 19, 2005 |
| 6879031 |
Multi-chips package |
Apr. 12, 2005 |
| 6875636 |
Wafer applied thermally conductive interposer |
Apr. 5, 2005 |
| 6876551 |
Heat sink assembly including clip with pressing and operating members |
Apr. 5, 2005 |
| 6873043 |
Electronic assembly having electrically-isolated heat-conductive structure |
Mar. 29, 2005 |
| 6873044 |
Microwave monolithic integrated circuit package |
Mar. 29, 2005 |
| 6870736 |
Heat sink and package surface design |
Mar. 22, 2005 |
| 6867492 |
Radio-frequency power component, radio-frequency power module, method for producing a radio-frequency power component, and method for producing a radio-frequency power module |
Mar. 15, 2005 |
| 6864572 |
Base for heat sink |
Mar. 8, 2005 |
| 6864574 |
Semiconductor package |
Mar. 8, 2005 |
| 6865083 |
Clip for heat sink |
Mar. 8, 2005 |
| 6865084 |
Thermally enhanced semiconductor package with EMI shielding |
Mar. 8, 2005 |
| 6861730 |
Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material |
Mar. 1, 2005 |
| 6861745 |
Method and apparatus for conducting heat in a flip-chip assembly |
Mar. 1, 2005 |
| 6861746 |
Electrical circuit apparatus and methods for assembling same |
Mar. 1, 2005 |
| 6861750 |
Ball grid array package with multiple interposers |
Mar. 1, 2005 |
| 6858923 |
Post-deposition treatment to enhance properties of Si-O-C low films |
Feb. 22, 2005 |
| 6858929 |
Semiconductor package with lid heat spreader |
Feb. 22, 2005 |
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