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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6987317 |
Power delivery using an integrated heat spreader |
Jan. 17, 2006 |
| 6984887 |
Heatsink arrangement for semiconductor device |
Jan. 10, 2006 |
| 6985359 |
Variable-wedge thermal-interface device |
Jan. 10, 2006 |
| 6982192 |
High performance thermal interface curing process for organic flip chip packages |
Jan. 3, 2006 |
| 6978541 |
Apparatus and methods to enhance thermal energy transfer in IC handler systems |
Dec. 27, 2005 |
| 6979899 |
System and method for high performance heat sink for multiple chip devices |
Dec. 27, 2005 |
| 6979900 |
Integrated circuit package with integral leadframe convector and method therefor |
Dec. 27, 2005 |
| 6979909 |
Semiconductor device and method of manufacturing same |
Dec. 27, 2005 |
| 6980438 |
Semiconductor package with heat dissipating structure |
Dec. 27, 2005 |
| 6973962 |
Radiator with airflow guiding structure |
Dec. 13, 2005 |
| 6975026 |
Package for mounting semiconductor device |
Dec. 13, 2005 |
| 6972485 |
Fixing device for fixing ball grid array chip on a substrate without soldering |
Dec. 6, 2005 |
| 6969907 |
Cooling structure for multichip module |
Nov. 29, 2005 |
| 6966357 |
Venturi fan |
Nov. 22, 2005 |
| 6967401 |
Semiconductor device, semiconductor module and hard disk |
Nov. 22, 2005 |
| 6967402 |
Hermetically sealed semiconductor power module and large scale module comprising the same |
Nov. 22, 2005 |
| 6967845 |
Integrated heat dissipating device with curved fins |
Nov. 22, 2005 |
| 6965163 |
Substrate-less microelectronic package |
Nov. 15, 2005 |
| 6963129 |
Multi-chip package having a contiguous heat spreader assembly |
Nov. 8, 2005 |
| 6963130 |
Heatsinking and packaging of integrated circuit chips |
Nov. 8, 2005 |
| 6963141 |
Semiconductor package for efficient heat spreading |
Nov. 8, 2005 |
| 6958534 |
Power semiconductor module |
Oct. 25, 2005 |
| 6958548 |
Semiconductor device with magnetically permeable heat sink |
Oct. 25, 2005 |
| 6958914 |
Interlocking heat sink |
Oct. 25, 2005 |
| 6958915 |
Heat dissipating device for electronic component |
Oct. 25, 2005 |
| 6956284 |
Integrated circuit stacking system and method |
Oct. 18, 2005 |
| 6956743 |
Electronic component, in particular regulator for generators in motor vehicles |
Oct. 18, 2005 |
| 6953291 |
Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection |
Oct. 11, 2005 |
| 6948555 |
Heat dissipating system and method |
Sep. 27, 2005 |
| 6949823 |
Method and apparatus for high electrical and thermal performance ball grid array package |
Sep. 27, 2005 |
| 6949838 |
Integrated circuit device |
Sep. 27, 2005 |
| 6950306 |
Connection frame for fan |
Sep. 27, 2005 |
| 6950307 |
Fastening structure for a heat sink |
Sep. 27, 2005 |
| 6946729 |
Wafer level package structure with a heat slug |
Sep. 20, 2005 |
| 6947285 |
Thermal interface material |
Sep. 20, 2005 |
| 6943057 |
Multichip module package and fabrication method |
Sep. 13, 2005 |
| 6943293 |
High power electronic package with enhanced cooling characteristics |
Sep. 13, 2005 |
| 6943436 |
EMI heatspreader/lid for integrated circuit packages |
Sep. 13, 2005 |
| 6944025 |
EMI shielding apparatus |
Sep. 13, 2005 |
| 6939742 |
Thermal gap control |
Sep. 6, 2005 |
| 6940162 |
Semiconductor module and mounting method for same |
Sep. 6, 2005 |
| 6940724 |
DC-DC converter implemented in a land grid array package |
Sep. 6, 2005 |
| 6936501 |
Semiconductor component and method of manufacture |
Aug. 30, 2005 |
| 6936919 |
Heatsink-substrate-spacer structure for an integrated-circuit package |
Aug. 30, 2005 |
| 6937462 |
Electronic control device and manufacturing method for the same |
Aug. 30, 2005 |
| 6937473 |
Heatsink device and method |
Aug. 30, 2005 |
| 6933598 |
Semiconductor stacked multi-package module having inverted second package and electrically shielded first package |
Aug. 23, 2005 |
| 6933602 |
Semiconductor package having a thermally and electrically connected heatspreader |
Aug. 23, 2005 |
| 6933603 |
Multi-substrate layer semiconductor packages and method for making same |
Aug. 23, 2005 |
| 6930021 |
Mask and method of manufacturing the same, electro-luminescence device and method of manufacturing the same, and electronic instrument |
Aug. 16, 2005 |
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