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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7049696 |
IC package with electrically conductive heat-radiating mechanism, connection structure and electronic device |
May. 23, 2006 |
| 7050303 |
Semiconductor module with vertically mounted semiconductor chip packages |
May. 23, 2006 |
| 7050304 |
Heat sink structure with embedded electronic components for semiconductor package |
May. 23, 2006 |
| 7044202 |
Cooler for electronic devices |
May. 16, 2006 |
| 7045828 |
Card-type LED illumination source |
May. 16, 2006 |
| 7045890 |
Heat spreader and stiffener having a stiffener extension |
May. 16, 2006 |
| 7045907 |
Semiconductor device and method of manufacturing same |
May. 16, 2006 |
| 7046518 |
Power module |
May. 16, 2006 |
| 7042081 |
Semiconductor device having heat dissipation layer |
May. 9, 2006 |
| 7042084 |
Semiconductor package with integrated heat spreader attached to a thermally conductive substrate core |
May. 9, 2006 |
| 7038310 |
Power module with improved heat dissipation |
May. 2, 2006 |
| 7038311 |
Thermally enhanced semiconductor package |
May. 2, 2006 |
| 7038312 |
Die-up ball grid array package with attached stiffener ring |
May. 2, 2006 |
| 7035113 |
Multi-chip electronic package having laminate carrier and method of making same |
Apr. 25, 2006 |
| 7029951 |
Cooling system for a semiconductor device and method of fabricating same |
Apr. 18, 2006 |
| 7030472 |
Integrated circuit device having flexible leadframe |
Apr. 18, 2006 |
| 7030482 |
Method and apparatus for protecting a die ESD events |
Apr. 18, 2006 |
| 7030483 |
Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application |
Apr. 18, 2006 |
| 7030484 |
Lidless chip package effectively having co-planar frame and semiconductor die surfaces |
Apr. 18, 2006 |
| 7030485 |
Thermal interface structure with integrated liquid cooling and methods |
Apr. 18, 2006 |
| 7030505 |
Resin-sealed-type semiconductor device, and production process for producing such semiconductor device |
Apr. 18, 2006 |
| 7026664 |
DC-DC converter implemented in a land grid array package |
Apr. 11, 2006 |
| 7026711 |
Thermal dispensing enhancement for high performance flip chip BGA (HPFCBGA) |
Apr. 11, 2006 |
| 7027303 |
Electronic power module |
Apr. 11, 2006 |
| 7023076 |
Multiple chip semiconductor packages |
Apr. 4, 2006 |
| 7023089 |
Low temperature packaging apparatus and method |
Apr. 4, 2006 |
| 7023707 |
Information handling system |
Apr. 4, 2006 |
| 7019394 |
Circuit package and method of plating the same |
Mar. 28, 2006 |
| 7019975 |
Power module and power module with heat sink |
Mar. 28, 2006 |
| 7019977 |
Method of attaching non-adhesive thermal interface materials |
Mar. 28, 2006 |
| 7015073 |
Method of forming heat spreader with down set leg attachment feature |
Mar. 21, 2006 |
| 7015577 |
Flip chip package capable of measuring bond line thickness of thermal interface material |
Mar. 21, 2006 |
| 7009289 |
Fluxless die-to-heat spreader bonding using thermal interface material |
Mar. 7, 2006 |
| 7009290 |
Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method |
Mar. 7, 2006 |
| 7004243 |
Method of extending the operational period of a heat-exchanger in a chip tester |
Feb. 28, 2006 |
| 7005737 |
Die-up ball grid array package with enhanced stiffener |
Feb. 28, 2006 |
| 7005738 |
Semiconductor package with lid heat spreader |
Feb. 28, 2006 |
| 7006353 |
Apparatus and method for attaching a heat sink to an integrated circuit module |
Feb. 28, 2006 |
| 7006354 |
Heat radiating structure for electronic device |
Feb. 28, 2006 |
| 7002246 |
Chip package structure with dual heat sinks |
Feb. 21, 2006 |
| 7002247 |
Thermal interposer for thermal management of semiconductor devices |
Feb. 21, 2006 |
| 7002795 |
Low noise heatsink |
Feb. 21, 2006 |
| 7002804 |
Heat dissipating apparatus |
Feb. 21, 2006 |
| 7002805 |
Thermal enhance MCM package and manufacturing method thereof |
Feb. 21, 2006 |
| 6999318 |
Heatsinking electronic devices |
Feb. 14, 2006 |
| 6995409 |
Module for high voltage power for converting a base of IGBT components |
Feb. 7, 2006 |
| 6992382 |
Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon |
Jan. 31, 2006 |
| 6992896 |
Stacked chip electronic package having laminate carrier and method of making same |
Jan. 31, 2006 |
| 6989587 |
Semiconductor device and manufacturing the same |
Jan. 24, 2006 |
| 6989593 |
Die-up ball grid array package with patterned stiffener opening |
Jan. 24, 2006 |
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