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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7122243 |
Metal/ceramic bonding substrate and method for producing same |
Oct. 17, 2006 |
| 7120018 |
Mother board with a ventilation-enhancing member |
Oct. 10, 2006 |
| 7119447 |
Direct fet device for high frequency application |
Oct. 10, 2006 |
| 7119434 |
Efficiency CPU cooling arrangement |
Oct. 10, 2006 |
| 7119433 |
Packaging for enhanced thermal and structural performance of electronic chip modules |
Oct. 10, 2006 |
| 7119432 |
Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor package |
Oct. 10, 2006 |
| 7119431 |
Apparatus and method for forming heat sinks on silicon on insulator wafers |
Oct. 10, 2006 |
| 7118941 |
Method of fabricating a composite carbon nanotube thermal interface device |
Oct. 10, 2006 |
| 7115988 |
Bypass capacitor embedded flip chip package lid and stiffener |
Oct. 3, 2006 |
| 7112883 |
Semiconductor device with temperature control mechanism |
Sep. 26, 2006 |
| 7112882 |
Structures and methods for heat dissipation of semiconductor integrated circuits |
Sep. 26, 2006 |
| 7111667 |
Heat dissipating device |
Sep. 26, 2006 |
| 7109573 |
Thermally enhanced component substrate |
Sep. 19, 2006 |
| 7106592 |
Coolant cooled type semiconductor device |
Sep. 12, 2006 |
| 7106766 |
Optical device, method of manufacturing the same, optical module, optical transmission system |
Sep. 12, 2006 |
| 7102225 |
Die-up ball grid array package with printed circuit board attachable heat spreader |
Sep. 5, 2006 |
| 7102226 |
Device and method for package warp compensation in an integrated heat spreader |
Sep. 5, 2006 |
| 7098533 |
Printed circuit board with a heat dissipation element and package comprising the printed circuit board |
Aug. 29, 2006 |
| 7091602 |
Miniature moldlocks for heatsink or flag for an overmolded plastic package |
Aug. 15, 2006 |
| 7091603 |
Semiconductor device |
Aug. 15, 2006 |
| 7091604 |
Three dimensional integrated circuits |
Aug. 15, 2006 |
| 7087937 |
Light emitting diode (LED) packaging |
Aug. 8, 2006 |
| 7088586 |
Techniques for cooling a circuit board component within an environment with little or no forced convection airflow |
Aug. 8, 2006 |
| 7083850 |
Electrically conductive thermal interface |
Aug. 1, 2006 |
| 7084495 |
Electroosmotic pumps using porous frits for cooling integrated circuit stacks |
Aug. 1, 2006 |
| 7084496 |
Method and apparatus for providing optoelectronic communication with an electronic device |
Aug. 1, 2006 |
| 7085135 |
Thermal dissipation structure and method employing segmented heat sink surface coupling to an electronic component |
Aug. 1, 2006 |
| 7081645 |
SMD(surface mount device)-type light emitting diode with high heat dissipation efficiency and high power |
Jul. 25, 2006 |
| 7081668 |
Flip chip molded/exposed die process and package structure |
Jul. 25, 2006 |
| 7081669 |
Device and system for heat spreader with controlled thermal expansion |
Jul. 25, 2006 |
| 7081670 |
Insulation sheet and apparatus utilizing the same |
Jul. 25, 2006 |
| 7071550 |
Semiconductor module having heat sink serving as wiring line |
Jul. 4, 2006 |
| 7072182 |
Switching assembly |
Jul. 4, 2006 |
| 7067903 |
Heat spreader and semiconductor device and package using the same |
Jun. 27, 2006 |
| 7067913 |
Semiconductor cooling system and process for manufacturing the same |
Jun. 27, 2006 |
| 7068512 |
Heat dissipation device incorporating with protective cover |
Jun. 27, 2006 |
| 7064429 |
Electronic package having integrated cooling element with clearance for engaging package |
Jun. 20, 2006 |
| 7060747 |
Chain extension for thermal materials |
Jun. 13, 2006 |
| 7061080 |
Power module package having improved heat dissipating capability |
Jun. 13, 2006 |
| 7061084 |
Lead-bond type chip package and manufacturing method thereof |
Jun. 13, 2006 |
| 7061100 |
Semiconductor built-in millimeter-wave band module |
Jun. 13, 2006 |
| 7057896 |
Power module and production method thereof |
Jun. 6, 2006 |
| 7057275 |
Device with power semiconductor components for controlling the power of high currents and use of said device |
Jun. 6, 2006 |
| 7057276 |
Semiconductor package with heat sink |
Jun. 6, 2006 |
| 7057277 |
Chip package structure |
Jun. 6, 2006 |
| 7053426 |
Semiconductor device with heat sink |
May. 30, 2006 |
| 7053493 |
Semiconductor device having stiffener |
May. 30, 2006 |
| 7054159 |
Printed wiring board having heat radiating means and method of manufacturing the same |
May. 30, 2006 |
| 7049688 |
Semiconductor device having a pair of heat sinks and method for manufacturing the same |
May. 23, 2006 |
| 7049695 |
Method and device for heat dissipation in semiconductor modules |
May. 23, 2006 |
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