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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7196411 |
Heat dissipation for chip-on-chip IC packages |
Mar. 27, 2007 |
| 7196403 |
Semiconductor package with heat spreader |
Mar. 27, 2007 |
| 7195145 |
Electrical circuit apparatus and method for assembling same |
Mar. 27, 2007 |
| 7192870 |
Semiconductor device and fabrication process therefor |
Mar. 20, 2007 |
| 7190585 |
Thermal heat spreaders designed for lower cost manufacturability, lower mass and increased thermal performance |
Mar. 13, 2007 |
| 7190068 |
Bottom heat spreader |
Mar. 13, 2007 |
| 7190067 |
Semiconductor package with exposed heat sink and the heat sink thereof |
Mar. 13, 2007 |
| 7190066 |
Heat spreader and package structure utilizing the same |
Mar. 13, 2007 |
| 7189449 |
Metal/ceramic bonding substrate and method for producing same |
Mar. 13, 2007 |
| 7187551 |
Module for solid state relay for engine cooling fan control |
Mar. 6, 2007 |
| 7187075 |
Stress relieving film for semiconductor packages |
Mar. 6, 2007 |
| 7187074 |
Semiconductor and electronic device with spring terminal |
Mar. 6, 2007 |
| 7183640 |
Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards |
Feb. 27, 2007 |
| 7180745 |
Flip chip heat sink package and method |
Feb. 20, 2007 |
| 7180179 |
Thermal interposer for thermal management of semiconductor devices |
Feb. 20, 2007 |
| 7180178 |
Semiconductor heat-dissipating substrate, and manufacturing method and package therefor |
Feb. 20, 2007 |
| 7180174 |
Nanotube modified solder thermal intermediate structure, systems, and methods |
Feb. 20, 2007 |
| 7180173 |
Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC) |
Feb. 20, 2007 |
| 7177155 |
Semiconductor package with heat sink |
Feb. 13, 2007 |
| 7173322 |
COF flexible printed wiring board and method of producing the wiring board |
Feb. 6, 2007 |
| 7170165 |
Circuit board assembly with a brace surrounding a ball-grid array device |
Jan. 30, 2007 |
| 7170151 |
Accurate alignment of an LED assembly |
Jan. 30, 2007 |
| 7166914 |
Semiconductor package with heat sink |
Jan. 23, 2007 |
| 7161810 |
Stacked chip electronic package having laminate carrier and method of making same |
Jan. 9, 2007 |
| 7161239 |
Ball grid array package enhanced with a thermal and electrical connector |
Jan. 9, 2007 |
| 7154753 |
Circuit structural body and method for manufacturing the same |
Dec. 26, 2006 |
| 7154751 |
Interface module-mounted LSI package |
Dec. 26, 2006 |
| 7151670 |
Digital micromirror device mounting system |
Dec. 19, 2006 |
| 7148573 |
Semiconductor integrated circuit |
Dec. 12, 2006 |
| 7148562 |
Power semiconductor device and power semiconductor module |
Dec. 12, 2006 |
| 7145254 |
Transfer-molded power device and method for manufacturing transfer-molded power device |
Dec. 5, 2006 |
| 7145232 |
Construction to improve thermal performance and reduce die backside warpage |
Dec. 5, 2006 |
| 7145224 |
Semiconductor device |
Dec. 5, 2006 |
| 7145179 |
Magnetic attachment method for LED light engines |
Dec. 5, 2006 |
| 7142429 |
Heat sink and retaining clip assembly |
Nov. 28, 2006 |
| 7142422 |
Heat dissipation device |
Nov. 28, 2006 |
| 7141886 |
Air pocket resistant semiconductor package |
Nov. 28, 2006 |
| 7138706 |
Semiconductor device and method for manufacturing the same |
Nov. 21, 2006 |
| 7136285 |
Wave-fans and wave-fans with heat sinks |
Nov. 14, 2006 |
| 7132748 |
Semiconductor apparatus |
Nov. 7, 2006 |
| 7132744 |
Enhanced die-up ball grid array packages and method for making the same |
Nov. 7, 2006 |
| 7131487 |
Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers |
Nov. 7, 2006 |
| 7129577 |
Power supply packaging system |
Oct. 31, 2006 |
| 7128979 |
Circuit board, method of producing same, and power module |
Oct. 31, 2006 |
| 7126825 |
Combined chip/heat-dissipating metal plate and method for manufacturing the same |
Oct. 24, 2006 |
| 7126824 |
Heat dissipation device assembly incorporating retention member |
Oct. 24, 2006 |
| 7126218 |
Embedded heat spreader ball grid array |
Oct. 24, 2006 |
| 7126217 |
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support |
Oct. 24, 2006 |
| 7122911 |
Heat spreader and semiconductor device package having the same |
Oct. 17, 2006 |
| 7122890 |
Low cost power semiconductor module without substrate |
Oct. 17, 2006 |
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