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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7259448 |
Die-up ball grid array package with a heat spreader and method for making the same |
Aug. 21, 2007 |
| 7259446 |
Heat sink packaging assembly for electronic components |
Aug. 21, 2007 |
| 7256494 |
Chip package |
Aug. 14, 2007 |
| 7256492 |
Heat sink and display panel including heat sink |
Aug. 14, 2007 |
| 7256491 |
Thermal interconnect systems methods of production and uses thereof |
Aug. 14, 2007 |
| 7256489 |
Semiconductor apparatus |
Aug. 14, 2007 |
| 7256353 |
Metal/ceramic bonding substrate and method for producing same |
Aug. 14, 2007 |
| 7254149 |
Submount, pedestal, and bond wire assembly for a transistor outline package with reduced bond wire inductance |
Aug. 7, 2007 |
| 7254036 |
High density memory module using stacked printed circuit boards |
Aug. 7, 2007 |
| 7254033 |
Method and apparatus for heat dissipation |
Aug. 7, 2007 |
| 7253529 |
Multi-chip package structure |
Aug. 7, 2007 |
| 7253523 |
Reworkable thermal interface material |
Aug. 7, 2007 |
| 7251138 |
Thermal managed interconnect system for a circuit board |
Jul. 31, 2007 |
| 7250672 |
Dual semiconductor die package with reverse lead form |
Jul. 31, 2007 |
| 7250327 |
Silicon die substrate manufacturing process and silicon die substrate with integrated cooling mechanism |
Jul. 31, 2007 |
| 7247930 |
Power management integrated circuit |
Jul. 24, 2007 |
| 7244965 |
Power surface mount light emitting die package |
Jul. 17, 2007 |
| 7242582 |
Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module |
Jul. 10, 2007 |
| 7241645 |
Method for assembling a ball grid array package with multiple interposers |
Jul. 10, 2007 |
| 7239517 |
Integrated heat spreader and method for using |
Jul. 3, 2007 |
| 7239015 |
Heat sinks including nonlinear passageways |
Jul. 3, 2007 |
| 7235889 |
Integrated heatspreader for use in wire bonded ball grid array semiconductor packages |
Jun. 26, 2007 |
| 7235876 |
Semiconductor device having metallic plate with groove |
Jun. 26, 2007 |
| 7235875 |
Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module |
Jun. 26, 2007 |
| 7235874 |
Semiconductor device, its manufacturing method, circuit board, and electronic unit |
Jun. 26, 2007 |
| 7233497 |
Surface mount heat sink |
Jun. 19, 2007 |
| 7233065 |
Semiconductor device having capacitors for reducing power source noise |
Jun. 19, 2007 |
| 7230332 |
Chip package with embedded component |
Jun. 12, 2007 |
| 7224057 |
Thermal enhance package with universal heat spreader |
May. 29, 2007 |
| 7224047 |
Semiconductor device package with reduced leakage |
May. 29, 2007 |
| 7221048 |
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier |
May. 22, 2007 |
| 7221042 |
Leadframe designs for integrated circuit plastic packages |
May. 22, 2007 |
| 7218522 |
Heat dissipating device |
May. 15, 2007 |
| 7217997 |
Ground arch for wirebond ball grid arrays |
May. 15, 2007 |
| 7217598 |
Method for manufacturing plastic ball grid array package with integral heatsink |
May. 15, 2007 |
| 7215545 |
Liquid cooled diamond bearing heat sink |
May. 8, 2007 |
| 7215022 |
Multi-die module |
May. 8, 2007 |
| 7215020 |
Semiconductor device having metal plates and semiconductor chip |
May. 8, 2007 |
| 7211891 |
Electronic heat pump device, laser component, optical pickup and electronic equipment |
May. 1, 2007 |
| 7209354 |
Ball grid array package with heat sink device |
Apr. 24, 2007 |
| 7208772 |
High power light emitting diode package |
Apr. 24, 2007 |
| 7205652 |
Electronic assembly including multiple substrates |
Apr. 17, 2007 |
| 7205651 |
Thermally enhanced stacked die package and fabrication method |
Apr. 17, 2007 |
| 7202561 |
Semiconductor package with heat dissipating structure and method of manufacturing the same |
Apr. 10, 2007 |
| 7199465 |
Wire bonding system and method of use |
Apr. 3, 2007 |
| 7199454 |
Optoelectronic semiconductor component |
Apr. 3, 2007 |
| 7196417 |
Method of manufacturing a low expansion material and semiconductor device using the low expansion material |
Mar. 27, 2007 |
| 7196414 |
Semiconductor package with heat sink |
Mar. 27, 2007 |
| 7196413 |
Heat dissipation assembly and method for producing the same |
Mar. 27, 2007 |
| 7196412 |
Multi-chip press-connected type semiconductor device |
Mar. 27, 2007 |
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