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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5894166 |
Chip mounting scheme |
Apr. 13, 1999 |
| 5892278 |
Aluminum and aluminum alloy radiator for semiconductor device and process for producing the same |
Apr. 6, 1999 |
| 5892279 |
Packaging for electronic power devices and applications using the packaging |
Apr. 6, 1999 |
| 5892657 |
Electronic-circuit assembly and its manufacturing method |
Apr. 6, 1999 |
| 5889319 |
RF power package with a dual ground |
Mar. 30, 1999 |
| 5884396 |
Transfer flat type ball grid array method for manufacturing packaging substrate |
Mar. 23, 1999 |
| 5886407 |
Heat-dissipating package for microcircuit devices |
Mar. 23, 1999 |
| 5886408 |
Multi-chip semiconductor device |
Mar. 23, 1999 |
| 5883430 |
Thermally enhanced flip chip package |
Mar. 16, 1999 |
| 5880933 |
Heat sinking module cover |
Mar. 9, 1999 |
| 5877552 |
Semiconductor package for improving the capability of spreading heat and electrical function |
Mar. 2, 1999 |
| 5877561 |
Plate and column type semiconductor package having heat sink |
Mar. 2, 1999 |
| 5874775 |
Diamond heat sink including microchannel therein and methods for manufacturing diamond heat sinks |
Feb. 23, 1999 |
| 5869883 |
Packaging of semiconductor circuit in pre-molded plastic package |
Feb. 9, 1999 |
| 5869890 |
Insulation substrate for a semiconductor device |
Feb. 9, 1999 |
| 5869891 |
Powdered metal heat sink with increased surface area |
Feb. 9, 1999 |
| 5866943 |
System and method for forming a grid array device package employing electomagnetic shielding |
Feb. 2, 1999 |
| 5859477 |
Apparatus for encapsulating IC packages with diamond substrate thermal conductor |
Jan. 12, 1999 |
| 5854507 |
Multiple chip assembly |
Dec. 29, 1998 |
| 5854511 |
Semiconductor package including heat sink with layered conductive plate and non-conductive tape bonding to leads |
Dec. 29, 1998 |
| 5852324 |
Plastic body surface-mounting semiconductor power device having dimensional characteristics optimized for use of standard shipping and testing modes |
Dec. 22, 1998 |
| 5841634 |
Liquid-cooled baffle series/parallel heat sink |
Nov. 24, 1998 |
| 5838064 |
Supporting member for cooling means and electronic package using the same |
Nov. 17, 1998 |
| 5834840 |
Net-shape ceramic processing for electronic devices and packages |
Nov. 10, 1998 |
| 5834842 |
Semiconductor device, semiconductor module, and radiating fin |
Nov. 10, 1998 |
| 5831829 |
Heat dissipating device for central processing units |
Nov. 3, 1998 |
| 5827999 |
Homogeneous chip carrier package |
Oct. 27, 1998 |
| 5828125 |
Ultra-high density warp-resistant memory module |
Oct. 27, 1998 |
| 5828127 |
Semiconductor substate with improved thermal conductivity |
Oct. 27, 1998 |
| 5828551 |
Heat sink apparatus for an electronic component |
Oct. 27, 1998 |
| 5824404 |
Hybrid composite articles and missile components, and their fabrication |
Oct. 20, 1998 |
| 5825080 |
Semiconductor device provided with surface grounding conductor for covering surfaces of electrically insulating films |
Oct. 20, 1998 |
| 5825087 |
Integral mesh flat plate cooling module |
Oct. 20, 1998 |
| 5821612 |
Heat radiative electronic component |
Oct. 13, 1998 |
| 5818105 |
Semiconductor device with plastic material covering a semiconductor chip mounted on a substrate of the device |
Oct. 6, 1998 |
| 5814883 |
Packaged semiconductor chip |
Sep. 29, 1998 |
| 5815427 |
Modular memory circuit and method for forming same |
Sep. 29, 1998 |
| 5811876 |
Semiconductor device with film carrier package structure |
Sep. 22, 1998 |
| 5811877 |
Semiconductor device structure |
Sep. 22, 1998 |
| 5812375 |
Electronic assembly for selective heat sinking and two-sided component attachment |
Sep. 22, 1998 |
| 5808358 |
Packaging electrical circuits |
Sep. 15, 1998 |
| 5808359 |
Semiconductor device having a heat sink with bumpers for protecting outer leads |
Sep. 15, 1998 |
| 5808868 |
Electronic module with power components |
Sep. 15, 1998 |
| 5808870 |
Plastic pin grid array package |
Sep. 15, 1998 |
| 5798566 |
Ceramic IC package base and ceramic cover |
Aug. 25, 1998 |
| 5796160 |
Resin-sealed semiconductor device |
Aug. 18, 1998 |
| 5793106 |
Semiconductor device |
Aug. 11, 1998 |
| 5793118 |
Semiconductor device capable of accomplishing a high moisture proof |
Aug. 11, 1998 |
| 5789820 |
Method for manufacturing heat radiating resin-molded semiconductor device |
Aug. 4, 1998 |
| 5786633 |
Semiconductor module having high insulating power and high thermal conductivity |
Jul. 28, 1998 |
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