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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5998241 |
Semiconductor device and method of manufacturing the same |
Dec. 7, 1999 |
| 5990548 |
Plate type member for semiconductor device package and package |
Nov. 23, 1999 |
| 5990549 |
Thermal bus bar design for an electronic cartridge |
Nov. 23, 1999 |
| 5990550 |
Integrated circuit device cooling structure |
Nov. 23, 1999 |
| 5990554 |
Semiconductor package having isolated heatsink bonding pads |
Nov. 23, 1999 |
| 5986340 |
Ball grid array package with enhanced thermal and electrical characteristics and electronic device incorporating same |
Nov. 16, 1999 |
| 5986885 |
Semiconductor package with internal heatsink and assembly method |
Nov. 16, 1999 |
| 5982621 |
Electronic device cooling arrangement |
Nov. 9, 1999 |
| 5977626 |
Thermally and electrically enhanced PBGA package |
Nov. 2, 1999 |
| 5977629 |
Condensed memory matrix |
Nov. 2, 1999 |
| 5973395 |
IC package having a single wiring sheet with a lead pattern disposed thereon |
Oct. 26, 1999 |
| 5973398 |
Semiconductor device and fabrication method employing a palladium-plated heat spreader substrate |
Oct. 26, 1999 |
| 5973407 |
Integral heat spreader for semiconductor package |
Oct. 26, 1999 |
| 5973921 |
Fixation structure for the fan of the CPU heat dissipating device |
Oct. 26, 1999 |
| 5969414 |
Semiconductor package with molded plastic body |
Oct. 19, 1999 |
| 5965937 |
Thermal interface attach mechanism for electrical packages |
Oct. 12, 1999 |
| 5959356 |
Solder ball grid array carrier package with heat sink |
Sep. 28, 1999 |
| 5953210 |
Reworkable circuit board assembly including a reworkable flip chip |
Sep. 14, 1999 |
| 5953594 |
Method of making a circuitized substrate for chip carrier structure |
Sep. 14, 1999 |
| 5949138 |
Heat spreader |
Sep. 7, 1999 |
| 5945736 |
Heat sink assembly with snap-in cover plate having multiple pressure capability |
Aug. 31, 1999 |
| 5940264 |
Electrolytic capacitor with heat sink and method of heat dissipation |
Aug. 17, 1999 |
| 5940271 |
Stiffener with integrated heat sink attachment |
Aug. 17, 1999 |
| 5935719 |
Lead-free, nickel-free and cyanide-free plating finish for semiconductor leadframes |
Aug. 10, 1999 |
| 5936837 |
Semiconductor component having leadframe with offset ground plane |
Aug. 10, 1999 |
| 5933326 |
Clipping device for heat sink |
Aug. 3, 1999 |
| 5929510 |
Integrated electronic circuit |
Jul. 27, 1999 |
| 5930115 |
Apparatus, method and system for thermal management of a semiconductor device |
Jul. 27, 1999 |
| 5930117 |
Heat sink structure comprising a microarray of thermal metal heat channels or vias in a polymeric or film layer |
Jul. 27, 1999 |
| 5926372 |
Power block assembly and method of making same |
Jul. 20, 1999 |
| 5920117 |
Semiconductor device and method of forming the device |
Jul. 6, 1999 |
| 5920458 |
Enhanced cooling of a heat dissipating circuit element |
Jul. 6, 1999 |
| 5910686 |
Cavity down HBGA package structure |
Jun. 8, 1999 |
| 5907185 |
Ceramic terminal block, hermetic sealed package, and complex semiconductor device |
May. 25, 1999 |
| 5907189 |
Conformal diamond coating for thermal improvement of electronic packages |
May. 25, 1999 |
| 5905305 |
Condensed memory matrix |
May. 18, 1999 |
| 5905636 |
Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device |
May. 18, 1999 |
| 5903052 |
Structure for semiconductor package for improving the efficiency of spreading heat |
May. 11, 1999 |
| 5903436 |
Emulative lid/heatspreader for processor die attached to an organic substrate |
May. 11, 1999 |
| 5900673 |
Low-temperature fusing brazing material, and wiring board and semiconductor device-housing package assembled with the same |
May. 4, 1999 |
| 5901042 |
Package and semiconductor device |
May. 4, 1999 |
| 5898211 |
Laser diode package with heat sink |
Apr. 27, 1999 |
| 5898219 |
Custom corner attach heat sink design for a plastic ball grid array integrated circuit package |
Apr. 27, 1999 |
| 5898571 |
Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages |
Apr. 27, 1999 |
| 5898573 |
Microelectronic packages and packaging methods including thermally and electrically conductive pad |
Apr. 27, 1999 |
| 5895966 |
Integrated circuit and supply decoupling capacitor therefor |
Apr. 20, 1999 |
| 5895967 |
Ball grid array package having a deformable metal layer and method |
Apr. 20, 1999 |
| 5895972 |
Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug |
Apr. 20, 1999 |
| 5895974 |
Durable substrate subassembly for transistor switch module |
Apr. 20, 1999 |
| 5896269 |
Positive pressure heat sink conduit |
Apr. 20, 1999 |
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