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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7342304 |
Semiconductor package with heat dissipating structure |
Mar. 11, 2008 |
| 7339266 |
Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof |
Mar. 4, 2008 |
| 7335983 |
Carbon nanotube micro-chimney and thermo siphon die-level cooling |
Feb. 26, 2008 |
| 7335982 |
Chip package structure and chip packaging process |
Feb. 26, 2008 |
| 7333331 |
Power unit device and power converter device |
Feb. 19, 2008 |
| 7332807 |
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same |
Feb. 19, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7329948 |
Microelectronic devices and methods |
Feb. 12, 2008 |
| 7329947 |
Heat treatment jig for semiconductor substrate |
Feb. 12, 2008 |
| 7327577 |
Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers |
Feb. 5, 2008 |
| 7327028 |
Embedded heat spreader for folded stacked chip-scale package |
Feb. 5, 2008 |
| 7327027 |
Thermal interface structure with integrated liquid cooling and methods |
Feb. 5, 2008 |
| 7327025 |
Heat spreader for thermally enhanced semiconductor package |
Feb. 5, 2008 |
| 7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
Jan. 29, 2008 |
| 7323255 |
Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate |
Jan. 29, 2008 |
| 7321492 |
Heat sink module for an electronic device |
Jan. 22, 2008 |
| 7321161 |
LED package assembly with datum reference feature |
Jan. 22, 2008 |
| 7319592 |
Recyclable protective cover for a heat-conductive medium |
Jan. 15, 2008 |
| 7317247 |
Semiconductor package having heat spreader and package stack using the same |
Jan. 8, 2008 |
| RE39957 |
Method of making semiconductor package with heat spreader |
Dec. 25, 2007 |
| 7312526 |
Semiconductor device and method of manufacturing thereof |
Dec. 25, 2007 |
| 7312400 |
Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method |
Dec. 25, 2007 |
| 7307841 |
Electronic package and method of cooling electronics |
Dec. 11, 2007 |
| 7307773 |
Micro-optoelectromechanical system packages for a light modulator and methods of making the same |
Dec. 11, 2007 |
| 7304854 |
Heat dissipating device for electronic component |
Dec. 4, 2007 |
| 7304849 |
Compliant thermal cap for an electronic device |
Dec. 4, 2007 |
| 7304372 |
Semiconductor package |
Dec. 4, 2007 |
| 7301233 |
Semiconductor chip package with thermoelectric cooler |
Nov. 27, 2007 |
| 7301232 |
Integrated circuit package with carbon nanotube array heat conductor |
Nov. 27, 2007 |
| 7300822 |
Low warpage flip chip package solution-channel heat spreader |
Nov. 27, 2007 |
| 7298028 |
Printed circuit board for thermal dissipation and electronic device using the same |
Nov. 20, 2007 |
| 7295436 |
Cooling system for computer components |
Nov. 13, 2007 |
| 7294924 |
Flat panel display device and method of fabricating the same |
Nov. 13, 2007 |
| 7289329 |
Integration of planar transformer and/or planar inductor with power switches in power converter |
Oct. 30, 2007 |
| 7288839 |
Apparatus and methods for cooling semiconductor integrated circuit package structures |
Oct. 30, 2007 |
| 7286358 |
Surface mounted resistor with improved thermal resistance characteristics |
Oct. 23, 2007 |
| 7282790 |
Planar array contact memory cards |
Oct. 16, 2007 |
| 7280360 |
Socket adapted for compressive loading |
Oct. 9, 2007 |
| 7274106 |
Packaged electroosmotic pumps using porous frits for cooling integrated circuits |
Sep. 25, 2007 |
| 7273769 |
Method and apparatus for removing encapsulating material from a packaged microelectronic device |
Sep. 25, 2007 |
| 7272015 |
Electronic unit with EMC shielding |
Sep. 18, 2007 |
| 7269015 |
Heat sink interface insert |
Sep. 11, 2007 |
| 7269013 |
Heat dissipation device having phase-changeable medium therein |
Sep. 11, 2007 |
| 7268427 |
Semiconductor package, printed board mounted with the same, and electronic apparatus having the printed board |
Sep. 11, 2007 |
| 7268425 |
Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
Sep. 11, 2007 |
| 7265977 |
Active liquid metal thermal spreader |
Sep. 4, 2007 |
| 7265444 |
Resin molded semiconductor device |
Sep. 4, 2007 |
| 7262498 |
Assembly with a ring and bonding pads formed of a same material on a substrate |
Aug. 28, 2007 |
| 7259457 |
Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same |
Aug. 21, 2007 |
| 7259456 |
Heat dissipation apparatus for package device |
Aug. 21, 2007 |
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