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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6091603 |
Customizable lid for improved thermal performance of modules using flip chips |
Jul. 18, 2000 |
| 6084299 |
Integrated circuit package including a heat sink and an adhesive |
Jul. 4, 2000 |
| 6084775 |
Heatsink and package structures with fusible release layer |
Jul. 4, 2000 |
| 6081027 |
Integrated heat sink |
Jun. 27, 2000 |
| 6081037 |
Semiconductor component having a semiconductor chip mounted to a chip mount |
Jun. 27, 2000 |
| 6081039 |
Pressure assembled motor cube |
Jun. 27, 2000 |
| 6081426 |
Semiconductor package having a heat slug |
Jun. 27, 2000 |
| 6078097 |
Lead frame |
Jun. 20, 2000 |
| 6078500 |
Pluggable chip scale package |
Jun. 20, 2000 |
| 6075287 |
Integrated, multi-chip, thermally conductive packaging device and methodology |
Jun. 13, 2000 |
| 6075288 |
Semiconductor package having interlocking heat sinks and method of fabrication |
Jun. 13, 2000 |
| 6075700 |
Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures |
Jun. 13, 2000 |
| 6067231 |
Heat-dissipating structure for an electrical device |
May. 23, 2000 |
| 6064115 |
Semiconductor device provided with a heat sink |
May. 16, 2000 |
| 6060776 |
Rectifier diode |
May. 9, 2000 |
| 6061243 |
Modular and multifunctional structure |
May. 9, 2000 |
| 6057174 |
Semiconductor device, method of fabricating the same, and electronic apparatus |
May. 2, 2000 |
| 6057223 |
Passivated copper conductive layers for microelectronic applications |
May. 2, 2000 |
| 6057601 |
Heat spreader with a placement recess and bottom saw-teeth for connection to ground planes on a thin two-sided single-core BGA substrate |
May. 2, 2000 |
| 6055158 |
Electronic component heat sink assembly |
Apr. 25, 2000 |
| 6055159 |
Heat dissipating module for a heat generating electronic component |
Apr. 25, 2000 |
| 6046496 |
Chip package |
Apr. 4, 2000 |
| 6046498 |
Device having a heat sink for cooling an integrated circuit |
Apr. 4, 2000 |
| 6046906 |
Vent chimney heat sink design for an electrical assembly |
Apr. 4, 2000 |
| 6046907 |
Heat conductor |
Apr. 4, 2000 |
| 6043560 |
Thermal interface thickness control for a microprocessor |
Mar. 28, 2000 |
| 6040624 |
Semiconductor device package and method |
Mar. 21, 2000 |
| 6037658 |
Electronic package with heat transfer means |
Mar. 14, 2000 |
| 6037659 |
Composite thermal interface pad |
Mar. 14, 2000 |
| 6033787 |
Ceramic circuit board with heat sink |
Mar. 7, 2000 |
| 6034425 |
Flat multiple-chip module micro ball grid array packaging |
Mar. 7, 2000 |
| 6031285 |
Heat sink for semiconductors and manufacturing process thereof |
Feb. 29, 2000 |
| 6028354 |
Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package |
Feb. 22, 2000 |
| 6028355 |
Method and apparatus for dissipating heat from an enclosed printed wiring board |
Feb. 22, 2000 |
| 6028358 |
Package for a semiconductor device and a semiconductor device |
Feb. 22, 2000 |
| 6028367 |
Bonds pads equipped with heat dissipating rings and method for forming |
Feb. 22, 2000 |
| 6025643 |
Device for dissipating heat from a semiconductor element |
Feb. 15, 2000 |
| 6025991 |
Electronic apparatus having heat dissipating arrangement |
Feb. 15, 2000 |
| 6020649 |
Plastic molded semiconductor package and a method for producing the same |
Feb. 1, 2000 |
| 6018459 |
Porous metal heat sink |
Jan. 25, 2000 |
| 6016005 |
Multilayer, high density micro circuit module and method of manufacturing same |
Jan. 18, 2000 |
| 6016007 |
Power electronics cooling apparatus |
Jan. 18, 2000 |
| 6011299 |
Apparatus to minimize integrated circuit heatsink E.M.I. radiation |
Jan. 4, 2000 |
| 6011304 |
Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid |
Jan. 4, 2000 |
| 6011697 |
Constraining ring for use in electronic packaging |
Jan. 4, 2000 |
| 6007730 |
Method of manufacturing diamond heat sink |
Dec. 28, 1999 |
| 6008537 |
Semiconductor device with heat dissipation metal layer and metal projections |
Dec. 28, 1999 |
| 6008541 |
Packaged integrated circuit device |
Dec. 28, 1999 |
| 6002171 |
Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package |
Dec. 14, 1999 |
| 6002173 |
Semiconductor device package with metal-polymer joint of controlled roughness |
Dec. 14, 1999 |
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