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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6188578 |
Integrated circuit package with multiple heat dissipation paths |
Feb. 13, 2001 |
| 6184580 |
Ball grid array package with conductive leads |
Feb. 6, 2001 |
| 6185100 |
Control device consisting of at least two housing sections |
Feb. 6, 2001 |
| 6181560 |
Semiconductor package substrate and semiconductor package |
Jan. 30, 2001 |
| 6175497 |
Thermal vias-provided cavity-down IC package structure |
Jan. 16, 2001 |
| 6169657 |
Radiating device for electronic appliances |
Jan. 2, 2001 |
| 6165612 |
Thermally conductive interface layers |
Dec. 26, 2000 |
| 6166434 |
Die clip assembly for semiconductor package |
Dec. 26, 2000 |
| 6166435 |
Flip-chip ball grid array package with a heat slug |
Dec. 26, 2000 |
| 6166446 |
Semiconductor device and fabrication process thereof |
Dec. 26, 2000 |
| 6166909 |
Switch box for a vehicle |
Dec. 26, 2000 |
| 6163070 |
Semiconductor package utilizing a flexible wiring substrate |
Dec. 19, 2000 |
| 6163458 |
Heat spreader for ball grid array package |
Dec. 19, 2000 |
| 6160311 |
Enhanced heat dissipating chip scale package method and devices |
Dec. 12, 2000 |
| 6160705 |
Ball grid array package and method using enhanced power and ground distribution circuitry |
Dec. 12, 2000 |
| 6157077 |
Semiconductor device with plated heat sink and partially plated side surfaces |
Dec. 5, 2000 |
| 6153926 |
Semiconductor device |
Nov. 28, 2000 |
| 6154364 |
Circuit board assembly with IC device mounted thereto |
Nov. 28, 2000 |
| 6154366 |
Structures and processes for fabricating moisture resistant chip-on-flex packages |
Nov. 28, 2000 |
| 6150715 |
Semiconductor device with radiation plate for high radiation character and method of manufacturing the same |
Nov. 21, 2000 |
| 6150716 |
Metal substrate having an IC chip and carrier mounting |
Nov. 21, 2000 |
| 6151217 |
Apparatus and method for enabling hot plugging of an integrated circuit |
Nov. 21, 2000 |
| 6146921 |
Cavity mold cap BGA package with post mold thermally conductive epoxy attach heat sink |
Nov. 14, 2000 |
| 6147869 |
Adaptable planar module |
Nov. 14, 2000 |
| 6143590 |
Multi-chip semiconductor device and method of producing the same |
Nov. 7, 2000 |
| 6134776 |
Heatsink and package structure for wirebond chip rework and replacement |
Oct. 24, 2000 |
| 6137169 |
Heat reduction system for transistor assemblies |
Oct. 24, 2000 |
| 6137680 |
Electronic component cooling apparatus |
Oct. 24, 2000 |
| 6133630 |
Condensed memory matrix |
Oct. 17, 2000 |
| 6130821 |
Multi-chip assembly having a heat sink and method thereof |
Oct. 10, 2000 |
| 6127724 |
Packaged microelectronic elements with enhanced thermal conduction |
Oct. 3, 2000 |
| 6124632 |
Monolithic silicon mass flow control structure |
Sep. 26, 2000 |
| 6122171 |
Heat sink chip package and method of making |
Sep. 19, 2000 |
| 6118177 |
Heatspreader for a flip chip device, and method for connecting the heatspreader |
Sep. 12, 2000 |
| 6118178 |
Circuit film utilizing a power supply and ground connections |
Sep. 12, 2000 |
| 6118660 |
Circuit module with improved heat transfer |
Sep. 12, 2000 |
| 6114761 |
Thermally-enhanced flip chip IC package with extruded heatspreader |
Sep. 5, 2000 |
| 6110762 |
Method of manufacturing a custom corner attach heat sink design for a plastic ball grid array integrated circuit package |
Aug. 29, 2000 |
| 6111311 |
Semiconductor device and method of forming the same |
Aug. 29, 2000 |
| 6111313 |
Integrated circuit package having a stiffener dimensioned to receive heat transferred laterally from the integrated circuit |
Aug. 29, 2000 |
| 6111315 |
Semiconductor package with offset die pad |
Aug. 29, 2000 |
| 6111322 |
Semiconductor device and manufacturing method thereof |
Aug. 29, 2000 |
| 6107683 |
Sequentially built integrated circuit package |
Aug. 22, 2000 |
| 6104090 |
Integrated circuit subassembly with thermally anisotropic heat transfer element |
Aug. 15, 2000 |
| 6104093 |
Thermally enhanced and mechanically balanced flip chip package and method of forming |
Aug. 15, 2000 |
| 6101094 |
Printed circuit board with integrated cooling mechanism |
Aug. 8, 2000 |
| 6097085 |
Electronic device and semiconductor package |
Aug. 1, 2000 |
| 6097601 |
Retention mechanism for heat sink |
Aug. 1, 2000 |
| 6093960 |
Semiconductor package having a heat spreader capable of preventing being soldered and enhancing adhesion and electrical performance |
Jul. 25, 2000 |
| 6091142 |
Assembly for dissipating heat from a stacked semiconductor package |
Jul. 18, 2000 |
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