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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6271583 |
Semiconductor device having resin encapsulated package structure |
Aug. 7, 2001 |
| 6272015 |
Power semiconductor module with insulation shell support for plural separate substrates |
Aug. 7, 2001 |
| 6265767 |
Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package |
Jul. 24, 2001 |
| 6265771 |
Dual chip with heat sink |
Jul. 24, 2001 |
| 6262475 |
Lead frame with heat slug |
Jul. 17, 2001 |
| 6262480 |
Package for electronic device having a fully insulated dissipator |
Jul. 17, 2001 |
| 6262481 |
Folded heat sink for semiconductor device package |
Jul. 17, 2001 |
| 6259146 |
Self-aligned fuse structure and method with heat sink |
Jul. 10, 2001 |
| 6259156 |
Semiconductor device and method for manufacturing same |
Jul. 10, 2001 |
| 6259157 |
Hybrid integrated circuit device, and method of manufacturing thereof |
Jul. 10, 2001 |
| 6259602 |
Heat conductive device |
Jul. 10, 2001 |
| 6255742 |
Semiconductor package incorporating heat dispersion plate inside resin molding |
Jul. 3, 2001 |
| 6251706 |
Method for cooling the backside of a semiconductor device using an infrared transparent heat slug |
Jun. 26, 2001 |
| 6248951 |
Dielectric decal for a substrate of an integrated circuit package |
Jun. 19, 2001 |
| 6249433 |
Heat-dissipating device for integrated circuit package |
Jun. 19, 2001 |
| 6246111 |
Universal lead frame type of quad flat non-lead package of semiconductor |
Jun. 12, 2001 |
| 6246115 |
Semiconductor package having a heat sink with an exposed surface |
Jun. 12, 2001 |
| 6246583 |
Method and apparatus for removing heat from a semiconductor device |
Jun. 12, 2001 |
| 6242797 |
Semiconductor device having pellet mounted on radiating plate thereof |
Jun. 5, 2001 |
| 6242807 |
Semiconductor integrated circuit having heat sinking means for heat generating wires |
Jun. 5, 2001 |
| 6236098 |
Heat spreader |
May. 22, 2001 |
| 6236109 |
Multi-chip chip scale package |
May. 22, 2001 |
| 6236568 |
Heat-dissipating structure for integrated circuit package |
May. 22, 2001 |
| 6230789 |
Heat dissipating device and method making the same |
May. 15, 2001 |
| 6225695 |
Grooved semiconductor die for flip-chip heat sink attachment |
May. 1, 2001 |
| 6225701 |
Semiconductor device provided with heat-sink and method of manufacturing the same |
May. 1, 2001 |
| 6226179 |
Mounting structure of a semiconductor device module for a computer system |
May. 1, 2001 |
| 6226183 |
Arrangement including a substrate for power components and a heat sink, and a method for manufacturing the arrangement |
May. 1, 2001 |
| 6226184 |
Enclosure mounted heat sink |
May. 1, 2001 |
| 6222264 |
Cooling apparatus for an electronic package |
Apr. 24, 2001 |
| 6219243 |
Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units |
Apr. 17, 2001 |
| 6215661 |
Heat spreader |
Apr. 10, 2001 |
| 6212074 |
Apparatus for dissipating heat from a circuit board having a multilevel surface |
Apr. 3, 2001 |
| 6206997 |
Method for bonding heat sinks to overmolds and device formed thereby |
Mar. 27, 2001 |
| 6208519 |
Thermally enhanced semiconductor package |
Mar. 27, 2001 |
| 6208521 |
Film carrier and laminate type mounting structure using same |
Mar. 27, 2001 |
| 6201300 |
Printed circuit board with thermal conductive structure |
Mar. 13, 2001 |
| 6201696 |
Package for semiconductor power device and method for assembling the same |
Mar. 13, 2001 |
| 6198163 |
Thin leadframe-type semiconductor package having heat sink with recess and exposed surface |
Mar. 6, 2001 |
| 6194778 |
Semiconductor package with improved cross talk and grounding, and method of manufacturing same |
Feb. 27, 2001 |
| 6195256 |
Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink |
Feb. 27, 2001 |
| 6195258 |
Thermal board used for bonding wires in semiconductor manufacturing process |
Feb. 27, 2001 |
| 6191473 |
Bonding lead structure with enhanced encapsulation |
Feb. 20, 2001 |
| 6191476 |
Semiconductor device |
Feb. 20, 2001 |
| 6191477 |
Leadless chip carrier design and structure |
Feb. 20, 2001 |
| 6191944 |
Heat sink for electric and/or electronic devices |
Feb. 20, 2001 |
| 6188130 |
Exposed heat spreader with seal ring |
Feb. 13, 2001 |
| 6188131 |
Clip for retaining a heatsink onto an electronic component |
Feb. 13, 2001 |
| 6188132 |
Two-wavelength semiconductor laser diode package for use on the read/write head of an optical drive capable of reading different types of optical discs |
Feb. 13, 2001 |
| 6188576 |
Protective cover and packaging for multi-chip memory modules |
Feb. 13, 2001 |
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