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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6362516 |
Electronic apparatus |
Mar. 26, 2002 |
| 6362517 |
High voltage package for electronic device |
Mar. 26, 2002 |
| 6362962 |
Clip for heat sink |
Mar. 26, 2002 |
| 6359334 |
Thermally conductive adhesive tape for semiconductor devices and method using the same |
Mar. 19, 2002 |
| 6359335 |
Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures |
Mar. 19, 2002 |
| 6355985 |
Integrated circuit device and synchronous-link dynamic random access memory device |
Mar. 12, 2002 |
| 6351032 |
Method and structure for heatspreader attachment in high thermal performance IC packages |
Feb. 26, 2002 |
| 6351385 |
Heat sink for integrated circuit packages |
Feb. 26, 2002 |
| 6351386 |
Component shim for mounting a component on a heat spreader |
Feb. 26, 2002 |
| 6344686 |
Power electronic component including cooling means |
Feb. 5, 2002 |
| 6337228 |
Low-cost printed circuit board with integral heat sink for semiconductor package |
Jan. 8, 2002 |
| 6337512 |
Semiconductor module |
Jan. 8, 2002 |
| 6337513 |
Chip packaging system and method using deposited diamond film |
Jan. 8, 2002 |
| 6333551 |
Surface profiling in electronic packages for reducing thermally induced interfacial stresses |
Dec. 25, 2001 |
| 6331731 |
Column for module component |
Dec. 18, 2001 |
| 6330158 |
Semiconductor package having heat sinks and method of fabrication |
Dec. 11, 2001 |
| 6324755 |
Solid interface module |
Dec. 4, 2001 |
| 6324756 |
Method and system for sealing the edge of a PBGA package |
Dec. 4, 2001 |
| 6326233 |
Semiconductor device, method of fabricating the same and electronic apparatus |
Dec. 4, 2001 |
| 6326685 |
Low thermal expansion composite comprising bodies of negative CTE material disposed within a positive CTE matrix |
Dec. 4, 2001 |
| 6326687 |
IC package with dual heat spreaders |
Dec. 4, 2001 |
| 6324061 |
Heat sink |
Nov. 27, 2001 |
| 6316826 |
Semiconductor mounting package |
Nov. 13, 2001 |
| 6316827 |
Semiconductor device having improved temperature distribution |
Nov. 13, 2001 |
| 6317327 |
Diode cooling arrangement |
Nov. 13, 2001 |
| 6313526 |
Semiconductor apparatus, Including thin film belt-like insulating tape |
Nov. 6, 2001 |
| 6313994 |
Extended surface area heat sink |
Nov. 6, 2001 |
| 6310364 |
Light-emitting apparatus |
Oct. 30, 2001 |
| 6307262 |
Condensed memory matrix |
Oct. 23, 2001 |
| 6303974 |
Semiconductor chips encapsulated within a preformed sub-assembly |
Oct. 16, 2001 |
| 6303989 |
Integrated circuit device on metal board with CPU power converter |
Oct. 16, 2001 |
| 6304450 |
Inter-circuit encapsulated packaging |
Oct. 16, 2001 |
| 6296048 |
Heat sink assembly |
Oct. 2, 2001 |
| 6297444 |
Fixing device |
Oct. 2, 2001 |
| 6297549 |
Hermetically sealed semiconductor power module and large scale module comprising the same |
Oct. 2, 2001 |
| 6297959 |
Radiation structure for heating element |
Oct. 2, 2001 |
| 6295201 |
Bus bar having embedded switching device |
Sep. 25, 2001 |
| 6291893 |
Power semiconductor device for "flip-chip" connections |
Sep. 18, 2001 |
| 6292369 |
Methods for customizing lid for improved thermal performance of modules using flip chips |
Sep. 18, 2001 |
| 6288900 |
Warpage compensating heat spreader |
Sep. 11, 2001 |
| 6283201 |
Heat-radiating structure |
Sep. 4, 2001 |
| 6285075 |
Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly |
Sep. 4, 2001 |
| 6285551 |
Overmolded electronic assembly |
Sep. 4, 2001 |
| 6285554 |
Method and an arrangement for the electrical contact of components |
Sep. 4, 2001 |
| 6281573 |
Thermal enhancement approach using solder compositions in the liquid state |
Aug. 28, 2001 |
| 6281574 |
High power microwave transistor amplifier |
Aug. 28, 2001 |
| 6281575 |
Multi-chip module |
Aug. 28, 2001 |
| 6282095 |
Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures |
Aug. 28, 2001 |
| 6282096 |
Integration of heat conducting apparatus and chip carrier in IC package |
Aug. 28, 2001 |
| 6278177 |
Substrateless chip scale package and method of making same |
Aug. 21, 2001 |
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