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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6455930 |
Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology |
Sep. 24, 2002 |
| 6449158 |
Method and apparatus for securing an electronic power device to a heat spreader |
Sep. 10, 2002 |
| 6449295 |
Method and system for generating laser light |
Sep. 10, 2002 |
| 6444498 |
Method of making semiconductor package with heat spreader |
Sep. 3, 2002 |
| 6441480 |
Microelectronic circuit package |
Aug. 27, 2002 |
| 6442043 |
Chip assembly module of bump connection type using a multi-layer printed circuit substrate |
Aug. 27, 2002 |
| 6437240 |
Microelectronic connections with liquid conductive elements |
Aug. 20, 2002 |
| 6437427 |
Lead frame used for the fabrication of semiconductor packages and semiconductor package fabricated using the same |
Aug. 20, 2002 |
| 6437438 |
Eddy current limiting thermal plate |
Aug. 20, 2002 |
| 6436550 |
Sintered compact and method of producing the same |
Aug. 20, 2002 |
| 6432742 |
Methods of forming drop-in heat spreader plastic ball grid array (PBGA) packages |
Aug. 13, 2002 |
| 6432750 |
Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof |
Aug. 13, 2002 |
| 6434007 |
Heat sink attachment clip |
Aug. 13, 2002 |
| 6429512 |
Ball grid array integrated circuit package with palladium coated heat-dissipation device |
Aug. 6, 2002 |
| 6430047 |
Standardized test board for testing custom chips |
Aug. 6, 2002 |
| 6426875 |
Heat sink chip package |
Jul. 30, 2002 |
| 6422303 |
Silent heat exchanger and fan assembly |
Jul. 23, 2002 |
| 6423576 |
Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package |
Jul. 23, 2002 |
| 6424026 |
Power module with closely spaced printed circuit board and substrate |
Jul. 23, 2002 |
| 6424531 |
High performance heat sink for electronics cooling |
Jul. 23, 2002 |
| 6418022 |
Heat sink clip with operating bar |
Jul. 9, 2002 |
| 6414388 |
Light emitting/receiving element for optical pickup apparatus |
Jul. 2, 2002 |
| 6414847 |
Integral dielectric heatspreader |
Jul. 2, 2002 |
| 6407924 |
Enhanced thermal path mechanical tolerance system |
Jun. 18, 2002 |
| 6404042 |
Subcarrier and semiconductor device |
Jun. 11, 2002 |
| 6404048 |
Heat dissipating microelectronic package |
Jun. 11, 2002 |
| 6404065 |
Electrically isolated power semiconductor package |
Jun. 11, 2002 |
| 6404636 |
Passively operated thermally diodic packaging method for missile avionics |
Jun. 11, 2002 |
| 6404638 |
Small gaps cooling technology |
Jun. 11, 2002 |
| 6399422 |
Radiating plate structure and method for manufacturing semiconductor devices using the same structure |
Jun. 4, 2002 |
| 6400010 |
Substrate including a metal portion and a resin portion |
Jun. 4, 2002 |
| 6400014 |
Semiconductor package with a heat sink |
Jun. 4, 2002 |
| 6400035 |
Microwave semiconductor device with improved heat discharge and electrical properties and manufacturing method thereof |
Jun. 4, 2002 |
| 6395998 |
Electronic package having an adhesive retaining cavity |
May. 28, 2002 |
| 6396130 |
Semiconductor package having multiple dies with independently biased back surfaces |
May. 28, 2002 |
| 6396141 |
Tape ball grid array with interconnected ground plane |
May. 28, 2002 |
| 6396142 |
Semiconductor device |
May. 28, 2002 |
| 6396699 |
Heat sink with chip die EMC ground interconnect |
May. 28, 2002 |
| 6392309 |
Semiconductor device including solid state imaging device |
May. 21, 2002 |
| 6392887 |
PLGA-BGA socket using elastomer connectors |
May. 21, 2002 |
| 6385047 |
U-shaped heat sink assembly |
May. 7, 2002 |
| 6382307 |
Device for forming heat dissipating fin set |
May. 7, 2002 |
| 6380617 |
Electrode terminal connection structure of semiconductor module |
Apr. 30, 2002 |
| 6380620 |
Tape ball grid array semiconductor |
Apr. 30, 2002 |
| 6376907 |
Ball grid array type package for semiconductor device |
Apr. 23, 2002 |
| 6376908 |
Semiconductor plastic package and process for the production thereof |
Apr. 23, 2002 |
| 6373702 |
Cooling structure and display apparatus containing the cooling structure |
Apr. 16, 2002 |
| 6373705 |
Electronic semiconductor module |
Apr. 16, 2002 |
| 6369331 |
Printed circuit board for semiconductor package and method of making same |
Apr. 9, 2002 |
| 6369333 |
Flexible connection system |
Apr. 9, 2002 |
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