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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6519157 |
System and method for mounting a stack-up structure |
Feb. 11, 2003 |
| 6515360 |
Packaged semiconductor device and manufacturing method thereof |
Feb. 4, 2003 |
| 6512291 |
Flexible semiconductor device support with integrated thermoelectric cooler and method for making same |
Jan. 28, 2003 |
| 6512673 |
Low profile equipment housing with angular fan |
Jan. 28, 2003 |
| 6512674 |
Package for semiconductor device having radiating substrate and radiator fin |
Jan. 28, 2003 |
| 6512675 |
Heat sink grounded to a grounded package lid |
Jan. 28, 2003 |
| 6507101 |
Lossy RF shield for integrated circuits |
Jan. 14, 2003 |
| 6507102 |
Printed circuit board with integral heat sink for semiconductor package |
Jan. 14, 2003 |
| 6507105 |
Member for semiconductor device and method for producing the same |
Jan. 14, 2003 |
| 6504242 |
Electronic assembly having a wetting layer on a thermally conductive heat spreader |
Jan. 7, 2003 |
| 6504243 |
Removable heat transfer apparatus for a pin grid array (PGA) device, and associated installation and removal methods |
Jan. 7, 2003 |
| 6501171 |
Flip chip package with improved cap design and process for making thereof |
Dec. 31, 2002 |
| 6501172 |
Power module |
Dec. 31, 2002 |
| 6498355 |
High flux LED array |
Dec. 24, 2002 |
| 6498390 |
Integrated circuit package that includes a thermally conductive tape which attaches a thermal element to a plastic housing |
Dec. 24, 2002 |
| 6498394 |
IC packages with diamond substrate thermal conductor |
Dec. 24, 2002 |
| 6498395 |
Heat sink with cooling fins for semiconductor package |
Dec. 24, 2002 |
| 6495912 |
Structure of ceramic package with integrated passive devices |
Dec. 17, 2002 |
| 6495914 |
Multi-chip module structure having conductive blocks to provide electrical connection between conductors on first and second sides of a conductive base substrate |
Dec. 17, 2002 |
| 6496374 |
Apparatus suitable for mounting an integrated circuit |
Dec. 17, 2002 |
| 6493228 |
Heat radiation packaging structure for an electric part and packaging method thereof |
Dec. 10, 2002 |
| 6493229 |
Heat sink chip package |
Dec. 10, 2002 |
| 6489634 |
Microelectronic device structure utilizing a diamond inlay in a package flange |
Dec. 3, 2002 |
| 6489668 |
Semiconductor device and method for manufacturing the same |
Dec. 3, 2002 |
| 6486554 |
Molded body for PBGA and chip-scale packages |
Nov. 26, 2002 |
| 6486564 |
Heat dissipation module for a BGA IC |
Nov. 26, 2002 |
| 6481874 |
Heat dissipation system for high power LED lighting system |
Nov. 19, 2002 |
| 6483147 |
Through wafer backside contact to improve SOI heat dissipation |
Nov. 19, 2002 |
| 6483180 |
Lead frame design for burr-free singulation of molded array packages |
Nov. 19, 2002 |
| 6483185 |
Power module substrate, method of producing the same, and semiconductor device including the substrate |
Nov. 19, 2002 |
| 6483187 |
Heat-spread substrate |
Nov. 19, 2002 |
| 6483704 |
Microprocessor heat sink retention module |
Nov. 19, 2002 |
| 6479895 |
High performance air cooled heat sinks used in high density packaging applications |
Nov. 12, 2002 |
| 6480385 |
Electronic assembly and cooling thereof |
Nov. 12, 2002 |
| 6475327 |
Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier |
Nov. 5, 2002 |
| 6476484 |
Heat sink dissipator for adapting to thickness change of a combination of a CPU and a CPU carrier |
Nov. 5, 2002 |
| 6472741 |
Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same |
Oct. 29, 2002 |
| 6472742 |
Thermal gap control |
Oct. 29, 2002 |
| 6472743 |
Semiconductor package with heat dissipating structure |
Oct. 29, 2002 |
| 6472762 |
Enhanced laminate flipchip package using a high CTE heatspreader |
Oct. 29, 2002 |
| 6469379 |
Chain extension for thermal materials |
Oct. 22, 2002 |
| 6469380 |
Resin sealed semiconductor device utilizing a clad material heat sink |
Oct. 22, 2002 |
| 6469381 |
Carbon-carbon and/or metal-carbon fiber composite heat spreader |
Oct. 22, 2002 |
| 6469398 |
Semiconductor package and manufacturing method thereof |
Oct. 22, 2002 |
| 6465890 |
Integrated circuit package having offset segmentation of package power and/or ground planes and methods for reducing delamination in integrated circuit packages |
Oct. 15, 2002 |
| 6462405 |
Semiconductor package |
Oct. 8, 2002 |
| 6462410 |
Integrated circuit component temperature gradient reducer |
Oct. 8, 2002 |
| 6462412 |
Foldable, flexible laminate type semiconductor apparatus with reinforcing and heat-radiating plates |
Oct. 8, 2002 |
| 6462950 |
Stacked power amplifier module |
Oct. 8, 2002 |
| 6459163 |
Semiconductor device and method for fabricating the same |
Oct. 1, 2002 |
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