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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6566749 |
Semiconductor die package with improved thermal and electrical performance |
May. 20, 2003 |
| 6563211 |
Semiconductor device for controlling electricity |
May. 13, 2003 |
| 6563213 |
Integrated circuit heat sink support and retention mechanism |
May. 13, 2003 |
| 6563696 |
Solderless laser assembly |
May. 13, 2003 |
| 6563712 |
Heak sink chip package |
May. 13, 2003 |
| 6558500 |
Method of producing a lead frame with composite film attached, and use of the lead frame |
May. 6, 2003 |
| 6559529 |
Press-fit diode for universal mounting |
May. 6, 2003 |
| 6559534 |
Thermal capacity for electronic component operating in long pulses |
May. 6, 2003 |
| 6560109 |
Stack of multilayer modules with heat-focusing metal layer |
May. 6, 2003 |
| 6556443 |
Heat dissipation device coupling structure |
Apr. 29, 2003 |
| 6552264 |
High performance chip packaging and method |
Apr. 22, 2003 |
| 6552266 |
High performance chip packaging and method |
Apr. 22, 2003 |
| 6552267 |
Microelectronic assembly with stiffening member |
Apr. 22, 2003 |
| 6552428 |
Semiconductor package having an exposed heat spreader |
Apr. 22, 2003 |
| 6548338 |
Integrated high-performance decoupling capacitor and heat sink |
Apr. 15, 2003 |
| 6548894 |
Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication |
Apr. 15, 2003 |
| 6548895 |
Packaging of electro-microfluidic devices |
Apr. 15, 2003 |
| 6545350 |
Integrated circuit packages and the method for the same |
Apr. 8, 2003 |
| 6545352 |
Assembly for mounting power semiconductive modules to heat dissipators |
Apr. 8, 2003 |
| 6545353 |
Multilayer wiring board and semiconductor device |
Apr. 8, 2003 |
| 6545868 |
Electronic module having canopy-type carriers |
Apr. 8, 2003 |
| 6545869 |
Adjusting fillet geometry to couple a heat spreader to a chip carrier |
Apr. 8, 2003 |
| 6542368 |
Heat sink and power source unit employing the same |
Apr. 1, 2003 |
| 6542370 |
Heat dissipating device for a CPU |
Apr. 1, 2003 |
| 6541310 |
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader |
Apr. 1, 2003 |
| 6538320 |
Heat spreader having holes for rivet-like adhesive connections |
Mar. 25, 2003 |
| 6538321 |
Heat sink with collapse structure and semiconductor package with heat sink |
Mar. 25, 2003 |
| 6538333 |
Three dimensional IC package module |
Mar. 25, 2003 |
| 6538890 |
Heat sink element and high-frequency electronic circuit substrate using such |
Mar. 25, 2003 |
| 6538892 |
Radial finned heat sink |
Mar. 25, 2003 |
| 6534848 |
Electrical coupling of a stiffener to a chip carrier |
Mar. 18, 2003 |
| 6534858 |
Assembly and methods for packaged die on pcb with heat sink encapsulant |
Mar. 18, 2003 |
| 6534859 |
Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package |
Mar. 18, 2003 |
| 6534860 |
Thermal transfer plate |
Mar. 18, 2003 |
| 6534861 |
Ball grid substrate for lead-on-chip semiconductor package |
Mar. 18, 2003 |
| 6534873 |
Semiconductor package and printed wiring board for semiconductor package |
Mar. 18, 2003 |
| 6535388 |
Wirebonded microelectronic packages including heat dissipation devices for heat removal from active surfaces thereof |
Mar. 18, 2003 |
| 6528876 |
Semiconductor package having heat sink attached to substrate |
Mar. 4, 2003 |
| 6528882 |
Thermal enhanced ball grid array package |
Mar. 4, 2003 |
| 6523362 |
Support for components used in microsystems technology |
Feb. 25, 2003 |
| 6525418 |
Semiconductor device |
Feb. 25, 2003 |
| 6525420 |
Semiconductor package with lid heat spreader |
Feb. 25, 2003 |
| 6525421 |
Molded integrated circuit package |
Feb. 25, 2003 |
| 6525942 |
Heat dissipation ball grid array package |
Feb. 25, 2003 |
| 6521990 |
Ball grid array package comprising a heat sink |
Feb. 18, 2003 |
| 6518502 |
Ceramic multilayer circuit boards mounted on a patterned metal support substrate |
Feb. 11, 2003 |
| 6518661 |
Apparatus for metal stack thermal management in semiconductor devices |
Feb. 11, 2003 |
| 6518666 |
Circuit board reducing a warp and a method of mounting an integrated circuit chip |
Feb. 11, 2003 |
| 6519152 |
Yarn processing system |
Feb. 11, 2003 |
| 6519154 |
Thermal bus design to cool a microelectronic die |
Feb. 11, 2003 |
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