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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6665186 |
Liquid metal thermal interface for an electronic module |
Dec. 16, 2003 |
| 6661658 |
Fluid-cooled heat sink for electronic components |
Dec. 9, 2003 |
| 6657296 |
Semicondctor package |
Dec. 2, 2003 |
| 6657864 |
High density thermal solution for direct attach modules |
Dec. 2, 2003 |
| 6654248 |
Top gated heat dissipation |
Nov. 25, 2003 |
| 6649937 |
Semiconductor device with components embedded in backside diamond layer |
Nov. 18, 2003 |
| 6649978 |
Semiconductor module having multiple semiconductor chips |
Nov. 18, 2003 |
| 6646331 |
Semiconductor device and semiconductor module |
Nov. 11, 2003 |
| 6643137 |
Heat-dissipating device with grounding capability |
Nov. 4, 2003 |
| 6639324 |
Flip chip package module and method of forming the same |
Oct. 28, 2003 |
| 6630727 |
Modularly expandable multi-layered semiconductor component |
Oct. 7, 2003 |
| 6630734 |
Composite material, and manufacturing method and uses of same |
Oct. 7, 2003 |
| 6631077 |
Heat spreader with oscillating flow |
Oct. 7, 2003 |
| 6627978 |
Chip package enabling increased input/output density |
Sep. 30, 2003 |
| 6627980 |
Stacked semiconductor device assembly with microelectronic spring contacts |
Sep. 30, 2003 |
| 6627981 |
Resin-packaged semiconductor device |
Sep. 30, 2003 |
| 6627987 |
Ceramic semiconductor package and method for fabricating the package |
Sep. 30, 2003 |
| 6627988 |
Semiconductor device and method for manufacturing the same |
Sep. 30, 2003 |
| 6627989 |
Semiconductor device and method for manufacturing same |
Sep. 30, 2003 |
| 6624523 |
Structure and package of a heat spreader substrate |
Sep. 23, 2003 |
| 6621158 |
Package for sealing an integrated circuit die |
Sep. 16, 2003 |
| 6621705 |
Miniature surface mount heatsink element and method of use |
Sep. 16, 2003 |
| 6617682 |
Structure for reducing die corner and edge stresses in microelectronic packages |
Sep. 9, 2003 |
| 6617685 |
Clip heat sink assembly |
Sep. 9, 2003 |
| 6617698 |
Reworkable and thermally conductive adhesive and use thereof |
Sep. 9, 2003 |
| 6614107 |
Thin-film heat sink and method of manufacturing same |
Sep. 2, 2003 |
| 6614657 |
Heat sink for cooling an electronic component of a computer |
Sep. 2, 2003 |
| 6611055 |
Leadless flip chip carrier design and structure |
Aug. 26, 2003 |
| 6611056 |
Composite material, and manufacturing method and uses of same |
Aug. 26, 2003 |
| 6608371 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
Aug. 19, 2003 |
| 6608379 |
Enhanced chip scale package for flip chips |
Aug. 19, 2003 |
| 6606246 |
Method and apparatus for retaining cooling apparatus and bus bar |
Aug. 12, 2003 |
| 6600197 |
Thin film transistor having a heat sink that exhibits a high degree of heat dissipation effect |
Jul. 29, 2003 |
| 6597063 |
Package for semiconductor power device and method for assembling the same |
Jul. 22, 2003 |
| 6593652 |
Semiconductor device reinforced by a highly elastic member made of a synthetic resin |
Jul. 15, 2003 |
| 6590278 |
Electronic package |
Jul. 8, 2003 |
| 6590773 |
Heat dissipation device for enhanced power light emitting diodes |
Jul. 8, 2003 |
| 6583505 |
Electrically isolated power device package |
Jun. 24, 2003 |
| 6579743 |
Chip packaging system and method using deposited diamond film |
Jun. 17, 2003 |
| 6579747 |
Method of making electronics package with specific areas having low coefficient of thermal expansion |
Jun. 17, 2003 |
| 6580072 |
Method for performing failure analysis on copper metallization |
Jun. 17, 2003 |
| 6580166 |
High frequency semiconductor device |
Jun. 17, 2003 |
| 6580167 |
Heat spreader with spring IC package |
Jun. 17, 2003 |
| 6580611 |
Dual-sided heat removal system |
Jun. 17, 2003 |
| 6576996 |
Method for bonding heat sinks to overmolds and device formed thereby |
Jun. 10, 2003 |
| 6577504 |
Integrated heat sink for different size components with EMI suppression features |
Jun. 10, 2003 |
| 6574107 |
Stacked intelligent power module package |
Jun. 3, 2003 |
| 6570247 |
Integrated circuit device having an embedded heat slug |
May. 27, 2003 |
| 6570250 |
Power conditioning substrate stiffener |
May. 27, 2003 |
| 6566748 |
Flip-chip semiconductor device having an improved reliability |
May. 20, 2003 |
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