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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6750534 |
Heat spreader hole pin 1 identifier |
Jun. 15, 2004 |
| 6751099 |
Coated heat spreaders |
Jun. 15, 2004 |
| 6748350 |
Method to compensate for stress between heat spreader and thermal interface material |
Jun. 8, 2004 |
| 6742573 |
Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin |
Jun. 1, 2004 |
| 6744132 |
Module with adhesively attached heat sink |
Jun. 1, 2004 |
| 6744133 |
Adhesive film for semiconductor, lead frame and semiconductor device using the same |
Jun. 1, 2004 |
| 6740968 |
Power source unit for driving magnetron and heatsink to be mounted on printed circuit board thereof |
May. 25, 2004 |
| 6740972 |
Electronic device having fibrous interface |
May. 25, 2004 |
| 6734371 |
Soldered heat sink anchor and method of use |
May. 11, 2004 |
| 6734551 |
Semiconductor device |
May. 11, 2004 |
| 6735077 |
Thermal diffuser and radiator |
May. 11, 2004 |
| 6735082 |
Heatsink with improved heat dissipation capability |
May. 11, 2004 |
| 6735084 |
Heat sink for electronic devices, and circuit board and plasma display panel assembly each equipped with the heat sink |
May. 11, 2004 |
| 6730996 |
Semiconductor device |
May. 4, 2004 |
| 6727585 |
Power device with a plastic molded package and direct bonded substrate |
Apr. 27, 2004 |
| 6722419 |
Computer cooler |
Apr. 20, 2004 |
| 6723926 |
Mounting configuration of electric and/or electronic components on a printed circuit board |
Apr. 20, 2004 |
| 6724078 |
Electronic assembly comprising solderable thermal interface |
Apr. 20, 2004 |
| 6720236 |
Mask and method of manufacturing the same, electro-luminescence device and method of manufacturing the same, and electronic instrument |
Apr. 13, 2004 |
| 6720581 |
Mounting plate for a laser chip in a semiconductor laser device |
Apr. 13, 2004 |
| 6720649 |
Semiconductor package with heat dissipating structure |
Apr. 13, 2004 |
| 6717246 |
Semiconductor package with integrated conical vapor chamber |
Apr. 6, 2004 |
| 6714415 |
Split fin heat sink |
Mar. 30, 2004 |
| 6713409 |
Semiconductor manufacturing using modular substrates |
Mar. 30, 2004 |
| 6713792 |
Integrated circuit heat sink device including through hole to facilitate communication |
Mar. 30, 2004 |
| 6713859 |
Direct build-up layer on an encapsulated die package having a moisture barrier structure |
Mar. 30, 2004 |
| 6713862 |
Low temperature co-fired ceramic-metal packaging technology |
Mar. 30, 2004 |
| 6713865 |
Semiconductor device having semiconductor element housed in packed with heat sink |
Mar. 30, 2004 |
| 6710433 |
Leadless chip carrier with embedded inductor |
Mar. 23, 2004 |
| 6710442 |
Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices |
Mar. 23, 2004 |
| 6710463 |
Electrically isolated power semiconductor package |
Mar. 23, 2004 |
| 6707671 |
Power module and method of manufacturing the same |
Mar. 16, 2004 |
| 6706563 |
Heat spreader interconnect methodology for thermally enhanced PBGA packages |
Mar. 16, 2004 |
| 6700190 |
Integrated circuit device with exposed upper and lower die surfaces |
Mar. 2, 2004 |
| 6700194 |
Semiconductor device |
Mar. 2, 2004 |
| 6700195 |
Electronic assembly for removing heat from a flip chip |
Mar. 2, 2004 |
| 6700783 |
Three-dimensional stacked heat spreader assembly for electronic package and method for assembling |
Mar. 2, 2004 |
| 6696750 |
Semiconductor package with heat dissipating structure |
Feb. 24, 2004 |
| 6697399 |
Semiconductor laser module with peltier module for regulating a temperature of a semiconductor laser chip |
Feb. 24, 2004 |
| 6688379 |
Heat dissipation device with high efficiency |
Feb. 10, 2004 |
| 6690087 |
Power semiconductor module ceramic substrate with upper and lower plates attached to a metal base |
Feb. 10, 2004 |
| 6683795 |
Shield cap and semiconductor package including shield cap |
Jan. 27, 2004 |
| 6680532 |
Multi chip module |
Jan. 20, 2004 |
| 6674163 |
Package structure for a semiconductor device |
Jan. 6, 2004 |
| 6670699 |
Semiconductor device packaging structure |
Dec. 30, 2003 |
| 6670704 |
Device for electronic packaging, pin jig fixture |
Dec. 30, 2003 |
| 6671176 |
Method of cooling heat-generating electrical components |
Dec. 30, 2003 |
| 6667548 |
Diamond heat spreading and cooling technique for integrated circuits |
Dec. 23, 2003 |
| 6664624 |
Semiconductor device and manufacturing method thereof |
Dec. 16, 2003 |
| 6664649 |
Lead-on-chip type of semiconductor package with embedded heat sink |
Dec. 16, 2003 |
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