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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6818982 |
Heat dissipation type semiconductor package and method of fabricating the same |
Nov. 16, 2004 |
| 6819566 |
Grounding and thermal dissipation for integrated circuit packages |
Nov. 16, 2004 |
| 6815813 |
Self-contained heat sink and a method for fabricating same |
Nov. 9, 2004 |
| 6815814 |
Thermoelectric module |
Nov. 9, 2004 |
| 6816378 |
Stack up assembly |
Nov. 9, 2004 |
| 6812562 |
Method and apparatus for surface mounted power transistor with heat sink |
Nov. 2, 2004 |
| 6809407 |
Semiconductor device |
Oct. 26, 2004 |
| 6809416 |
Package for integrated circuit with thermal vias and method thereof |
Oct. 26, 2004 |
| 6806567 |
Chip on board with heat sink attachment and assembly |
Oct. 19, 2004 |
| 6807059 |
Stud welded pin fin heat sink |
Oct. 19, 2004 |
| 6803652 |
Heat dissipation device having a load centering mechanism |
Oct. 12, 2004 |
| 6803654 |
Heat-radiating device of chip |
Oct. 12, 2004 |
| 6803667 |
Semiconductor device having a protective film |
Oct. 12, 2004 |
| 6800931 |
Heat-dissipating device of a semiconductor device and fabrication method for same |
Oct. 5, 2004 |
| 6800932 |
Package for semiconductor die containing symmetrical lead and heat sink |
Oct. 5, 2004 |
| 6800948 |
Ball grid array package |
Oct. 5, 2004 |
| 6800949 |
Embedded chip enclosure with solder-free interconnect |
Oct. 5, 2004 |
| 6798061 |
Multiple semiconductor chip (multi-chip) module for use in power applications |
Sep. 28, 2004 |
| 6798663 |
Heat sink hold-down with fan-module attach location |
Sep. 28, 2004 |
| 6794748 |
Substrate-less microelectronic package |
Sep. 21, 2004 |
| 6791181 |
Semiconductor light emitting device |
Sep. 14, 2004 |
| 6791182 |
Semiconductor device |
Sep. 14, 2004 |
| 6791838 |
Flexible assembly system and mechanism adapted for an optical projection apparatus |
Sep. 14, 2004 |
| 6787711 |
Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device |
Sep. 7, 2004 |
| 6787870 |
Semiconductor component with integrated circuit, cooling body, and temperature sensor |
Sep. 7, 2004 |
| 6787896 |
Semiconductor die package with increased thermal conduction |
Sep. 7, 2004 |
| 6783692 |
Heat softening thermally conductive compositions and methods for their preparation |
Aug. 31, 2004 |
| 6784536 |
Symmetric stack up structure for organic BGA chip carriers |
Aug. 31, 2004 |
| 6784537 |
Semiconductor device of surface-mounting type |
Aug. 31, 2004 |
| 6784540 |
Semiconductor device package with improved cooling |
Aug. 31, 2004 |
| 6784541 |
Semiconductor module and mounting method for same |
Aug. 31, 2004 |
| 6779593 |
High performance cooling device with heat spreader |
Aug. 24, 2004 |
| 6780678 |
Cooling of optoelectronic elements |
Aug. 24, 2004 |
| 6776224 |
Heating dissipating device for electronic elements |
Aug. 17, 2004 |
| 6777817 |
Reworkable and thermally conductive adhesive and use thereof |
Aug. 17, 2004 |
| 6777819 |
Semiconductor package with flash-proof device |
Aug. 17, 2004 |
| 6775138 |
Heat sink clip with plurality of pressing portions |
Aug. 10, 2004 |
| 6775140 |
Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices |
Aug. 10, 2004 |
| 6773964 |
Integrated circuit package including sealed gaps and prevention of vapor induced failures and method of manufacturing the same |
Aug. 10, 2004 |
| 6770966 |
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat |
Aug. 3, 2004 |
| 6770967 |
Remote thermal vias for densely packed electrical assemblage |
Aug. 3, 2004 |
| 6771502 |
Heat sink made from longer and shorter graphite sheets |
Aug. 3, 2004 |
| 6771508 |
Method and apparatus for cooling an electronic component |
Aug. 3, 2004 |
| 6765290 |
Arrangement for back-biasing multiple integrated circuit substrates at maximum supply voltage among all circuits |
Jul. 20, 2004 |
| 6760223 |
Apparatus and method for contacting device with delicate light-transparent pane |
Jul. 6, 2004 |
| 6756668 |
Semiconductor package having thermal interface material (TIM) |
Jun. 29, 2004 |
| 6756669 |
Heat spreader with down set leg attachment feature |
Jun. 29, 2004 |
| 6757170 |
Heat sink and package surface design |
Jun. 29, 2004 |
| 6753596 |
Resin-sealed semiconductor device |
Jun. 22, 2004 |
| 6754078 |
Heat dissipating device with slanting engaged heat dissipating sheets and bottom plate |
Jun. 22, 2004 |
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