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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619259 |
Semiconductor device integrated with heat sink and method of fabricating the same |
Nov. 17, 2009 |
| 7615862 |
Heat dissipating package structure and method for fabricating the same |
Nov. 10, 2009 |
| 7615861 |
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards |
Nov. 10, 2009 |
| 7608923 |
Electronic device with flexible heat spreader |
Oct. 27, 2009 |
| 7608917 |
Power semiconductor module |
Oct. 27, 2009 |
| 7608915 |
Heat dissipation semiconductor package |
Oct. 27, 2009 |
| 7608315 |
Insulator with high thermal conductivity and method for producing the same |
Oct. 27, 2009 |
| 7606038 |
Method for producing a printed circuit board with a heat radiating structure and a printed circuit board with a heat radiating structure |
Oct. 20, 2009 |
| 7598535 |
Light-emitting diode assembly and method of fabrication |
Oct. 6, 2009 |
| 7598119 |
System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices |
Oct. 6, 2009 |
| 7595993 |
Mounting structure with heat sink for electronic component and female securing member for same |
Sep. 29, 2009 |
| 7592695 |
Compound heat sink |
Sep. 22, 2009 |
| 7589402 |
Semiconductor module and manufacturing method thereof |
Sep. 15, 2009 |
| 7586964 |
Laser package and laser module |
Sep. 8, 2009 |
| 7586191 |
Integrated circuit apparatus with heat spreader |
Sep. 8, 2009 |
| 7586189 |
Heat dissipation structure accommodated in electronic control device |
Sep. 8, 2009 |
| 7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Sep. 8, 2009 |
| 7586125 |
Light emitting diode package structure and fabricating method thereof |
Sep. 8, 2009 |
| 7585702 |
Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate |
Sep. 8, 2009 |
| 7579697 |
Arrangement for high frequency application |
Aug. 25, 2009 |
| 7579688 |
Heat radiation structure of semiconductor device, and manufacturing method thereof |
Aug. 25, 2009 |
| 7579686 |
Thermal interface material with hotspot heat remover |
Aug. 25, 2009 |
| 7579675 |
Semiconductor device having surface mountable external contact areas and method for producing the same |
Aug. 25, 2009 |
| 7579672 |
Semiconductor package with electromagnetic shielding capabilities |
Aug. 25, 2009 |
| 7576432 |
Using external radiators with electroosmotic pumps for cooling integrated circuits |
Aug. 18, 2009 |
| 7574793 |
Process of forming a laminate ceramic circuit board |
Aug. 18, 2009 |
| 7573717 |
Cycling LED heat spreader |
Aug. 11, 2009 |
| 7569929 |
Semiconductor device |
Aug. 4, 2009 |
| 7569928 |
Assembly structure of electronic element and heat sink |
Aug. 4, 2009 |
| 7569927 |
RF power transistor package |
Aug. 4, 2009 |
| 7564690 |
Method for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers |
Jul. 21, 2009 |
| 7564129 |
Power semiconductor module, and power semiconductor device having the module mounted therein |
Jul. 21, 2009 |
| 7564124 |
Semiconductor die package including stacked dice and heat sink structures |
Jul. 21, 2009 |
| 7564123 |
Semiconductor package with fastened leads |
Jul. 21, 2009 |
| 7557438 |
Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same |
Jul. 7, 2009 |
| 7554806 |
Interface module-mounted LSI package |
Jun. 30, 2009 |
| 7554191 |
Semiconductor device having a heatsink plate with bored portions |
Jun. 30, 2009 |
| 7554190 |
Liquid metal thermal interface material system |
Jun. 30, 2009 |
| 7550839 |
Integrated circuit package and system interface |
Jun. 23, 2009 |
| 7547966 |
Power semiconductor module |
Jun. 16, 2009 |
| 7547964 |
Device packages having a III-nitride based power semiconductor device |
Jun. 16, 2009 |
| 7547922 |
Light-emitting diode assembly |
Jun. 16, 2009 |
| 7547583 |
Light emitting diode package with direct leadframe heat dissipation |
Jun. 16, 2009 |
| 7546943 |
Apparatus, system, and method for positioning a printed circuit board component |
Jun. 16, 2009 |
| 7545033 |
Low cost power semiconductor module without substrate |
Jun. 9, 2009 |
| 7545032 |
Integrated circuit package system with stiffener |
Jun. 9, 2009 |
| 7541669 |
Semiconductor device package with base features to reduce leakage |
Jun. 2, 2009 |
| 7541220 |
Integrated circuit device having flexible leadframe |
Jun. 2, 2009 |
| 7538427 |
Microchannel structure and manufacturing method therefor, light source device, and projector |
May. 26, 2009 |
| 7538423 |
Heat sink, electronic device, method of manufacturing heat sink, and method of manufacturing electronic device |
May. 26, 2009 |
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