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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.










Sub-classes under this class:

Class Number Class Name Patents
257/707 Directly attached to semiconductor device 1,417


Patents under this class:

Patent Number Title Of Patent Date Issued
8710644 Semiconductor unit having a power semiconductor and semiconductor apparatus using the same Apr. 29, 2014
8710640 Integrated circuit packaging system with heat slug and method of manufacture thereof Apr. 29, 2014
8710514 Power surface mount light emitting die package Apr. 29, 2014
8703286 Polymer matrices for polymer solder hybrid materials Apr. 22, 2014
8692362 Semiconductor structure having conductive vias and method for manufacturing the same Apr. 8, 2014
8686558 Thermally and electrically enhanced ball grid array package Apr. 1, 2014
8686556 Wafer level applied thermal heat sink Apr. 1, 2014
8680674 Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices Mar. 25, 2014
8680670 Multi-chip module system with removable socketed modules Mar. 25, 2014
8679899 Multipath soldered thermal interface between a chip and its heat sink Mar. 25, 2014
RE44811 High power light emitting diode package Mar. 18, 2014
8674499 Heat radiation component and semiconductor package including same Mar. 18, 2014
8673691 Method for manufacturing a semiconductor device Mar. 18, 2014
8659900 Circuit board including a heat radiating plate Feb. 25, 2014
8659146 Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing Feb. 25, 2014
8653651 Semiconductor apparatus and method for manufacturing the same Feb. 18, 2014
8648478 Flexible heat sink having ventilation ports and semiconductor package including the same Feb. 11, 2014
8643170 Method of assembling semiconductor device including insulating substrate and heat sink Feb. 4, 2014
8629555 Fixture for semiconductor device and assembly of semiconductor device Jan. 14, 2014
8629541 Semiconductor package for controlling warpage Jan. 14, 2014
8629476 Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus Jan. 14, 2014
8624366 Semiconductor package structure and method of fabricating the same Jan. 7, 2014
8618653 Integrated circuit package system with wafer scale heat slug Dec. 31, 2013
8618652 Forming functionalized carrier structures with coreless packages Dec. 31, 2013
8618585 Semiconductor apparatus including cooling base with projections Dec. 31, 2013
8611091 Thermal module for solar inverter Dec. 17, 2013
8610263 Semiconductor device module Dec. 17, 2013
8610262 Ball grid array package with improved thermal characteristics Dec. 17, 2013
8610138 LED package having an array of light emitting cells coupled in series Dec. 17, 2013
8604610 Flexible power module semiconductor packages Dec. 10, 2013
8604608 Semiconductor module Dec. 10, 2013
8604607 Semiconductor module and semiconductor device Dec. 10, 2013
8604606 Heat sink package Dec. 10, 2013
8598701 Semiconductor device Dec. 3, 2013
8598700 Active thermal control for stacked IC devices Dec. 3, 2013
8598616 Light emitting device and light unit using the same Dec. 3, 2013
8597986 System in package and method of fabricating same Dec. 3, 2013
8592851 Optical semiconductor device and circuit Nov. 26, 2013
8587110 Semiconductor module having a semiconductor chip stack and method Nov. 19, 2013
8587105 Semiconductor device Nov. 19, 2013
8586418 Method for the production of an electronic component and electronic component produced according to this method Nov. 19, 2013
8581406 Flip chip mounted monolithic microwave integrated circuit (MMIC) structure Nov. 12, 2013
8581390 Semiconductor device with heat dissipation Nov. 12, 2013
8581385 Semiconductor chip to dissipate heat, semiconductor package including the same, and stack package using the same Nov. 12, 2013
8581374 Placing heat sink into packaging by strip formation assembly Nov. 12, 2013
8576567 Semiconductor device and display apparatus Nov. 5, 2013
8575769 Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation Nov. 5, 2013
8575657 Direct growth of diamond in backside vias for GaN HEMT devices Nov. 5, 2013
8564957 Cooling structure for electronic equipment Oct. 22, 2013
8564955 Coupling heat sink to integrated circuit chip with thermal interface material Oct. 22, 2013











 
 
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