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Class Information
Number: 257/706
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > With heat sink
Description: Subject matter wherein the insulating housing has a heat sink to dissipate heat.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7408258 |
Interconnection circuit and electronic module utilizing same |
Aug. 5, 2008 |
| 7405448 |
Semiconductor device having a resistance for equalizing the current distribution |
Jul. 29, 2008 |
| 7399657 |
Ball grid array packages with thermally conductive containers |
Jul. 15, 2008 |
| 7397137 |
Direct FET device for high frequency application |
Jul. 8, 2008 |
| 7396700 |
Method for fabricating thermally enhanced semiconductor device |
Jul. 8, 2008 |
| 7394659 |
Apparatus and methods for cooling semiconductor integrated circuit package structures |
Jul. 1, 2008 |
| 7388286 |
Semiconductor package having enhanced heat dissipation and method of fabricating the same |
Jun. 17, 2008 |
| 7382047 |
Heat dissipation device |
Jun. 3, 2008 |
| 7378731 |
Heat spreader and package structure utilizing the same |
May. 27, 2008 |
| 7378730 |
Thermal interconnect systems methods of production and uses thereof |
May. 27, 2008 |
| 7375970 |
High density memory module using stacked printed circuit boards |
May. 20, 2008 |
| 7375966 |
Automatic transmission electronic control device |
May. 20, 2008 |
| 7372147 |
Supporting a circuit package including a substrate having a solder column array |
May. 13, 2008 |
| 7372146 |
Semiconductor module |
May. 13, 2008 |
| 7365988 |
Cycling LED heat spreader |
Apr. 29, 2008 |
| 7365986 |
Semiconductor cooling device and stack of semiconductor cooling devices |
Apr. 29, 2008 |
| 7365422 |
Package of leadframe with heatsinks |
Apr. 29, 2008 |
| 7361944 |
Electrical device with a plurality of thin-film device layers |
Apr. 22, 2008 |
| 7358605 |
Heat dissipation structure for electronic device |
Apr. 15, 2008 |
| 7358604 |
Multichip circuit module and method for the production thereof |
Apr. 15, 2008 |
| 7355856 |
Method and apparatus for increasing natural convection efficiency in long heat sinks |
Apr. 8, 2008 |
| 7355276 |
Thermally-enhanced circuit assembly |
Apr. 8, 2008 |
| 7352062 |
Integrated circuit package design |
Apr. 1, 2008 |
| 7348665 |
Liquid metal thermal interface for an integrated circuit device |
Mar. 25, 2008 |
| 7348604 |
Light-emitting module |
Mar. 25, 2008 |
| 7345885 |
Heat spreader with multiple stacked printed circuit boards |
Mar. 18, 2008 |
| 7345364 |
Structure and method for improved heat conduction for semiconductor devices |
Mar. 18, 2008 |
| 7342305 |
Thermally enhanced cavity-down integrated circuit package |
Mar. 11, 2008 |
| 7342304 |
Semiconductor package with heat dissipating structure |
Mar. 11, 2008 |
| 7339266 |
Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof |
Mar. 4, 2008 |
| 7335983 |
Carbon nanotube micro-chimney and thermo siphon die-level cooling |
Feb. 26, 2008 |
| 7335982 |
Chip package structure and chip packaging process |
Feb. 26, 2008 |
| 7333331 |
Power unit device and power converter device |
Feb. 19, 2008 |
| 7332807 |
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same |
Feb. 19, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7329948 |
Microelectronic devices and methods |
Feb. 12, 2008 |
| 7329947 |
Heat treatment jig for semiconductor substrate |
Feb. 12, 2008 |
| 7327577 |
Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers |
Feb. 5, 2008 |
| 7327028 |
Embedded heat spreader for folded stacked chip-scale package |
Feb. 5, 2008 |
| 7327027 |
Thermal interface structure with integrated liquid cooling and methods |
Feb. 5, 2008 |
| 7327025 |
Heat spreader for thermally enhanced semiconductor package |
Feb. 5, 2008 |
| 7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
Jan. 29, 2008 |
| 7323255 |
Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate |
Jan. 29, 2008 |
| 7321492 |
Heat sink module for an electronic device |
Jan. 22, 2008 |
| 7321161 |
LED package assembly with datum reference feature |
Jan. 22, 2008 |
| 7319592 |
Recyclable protective cover for a heat-conductive medium |
Jan. 15, 2008 |
| 7317247 |
Semiconductor package having heat spreader and package stack using the same |
Jan. 8, 2008 |
| RE39957 |
Method of making semiconductor package with heat spreader |
Dec. 25, 2007 |
| 7312526 |
Semiconductor device and method of manufacturing thereof |
Dec. 25, 2007 |
| 7312400 |
Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method |
Dec. 25, 2007 |
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