| |
 |
|
Class Information
Number: 257/705
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > Of high thermal conductivity ceramic (e.g., beo)
Description: Subject matter wherein the housing is made of ceramic which has high thermal conductivity to promote heat dissipation from the housing.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7432591 |
Thermal enhanced plastic ball grid array with heat sink attachment option |
Oct. 7, 2008 |
| 7429789 |
Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same |
Sep. 30, 2008 |
| 7375412 |
iTFC with optimized C(T) |
May. 20, 2008 |
| 7372700 |
Plasma display device |
May. 13, 2008 |
| 7297988 |
Flip chip type nitride semiconductor light emitting device |
Nov. 20, 2007 |
| 7294925 |
Optical scanner package having heating dam |
Nov. 13, 2007 |
| 7250323 |
Methods of making energy conversion devices with a substantially contiguous depletion regions |
Jul. 31, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7224057 |
Thermal enhance package with universal heat spreader |
May. 29, 2007 |
| 7221048 |
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier |
May. 22, 2007 |
| 7211891 |
Electronic heat pump device, laser component, optical pickup and electronic equipment |
May. 1, 2007 |
| 7208829 |
Semiconductor component |
Apr. 24, 2007 |
| 7205650 |
Composite devices of laminate type and processes |
Apr. 17, 2007 |
| 7166914 |
Semiconductor package with heat sink |
Jan. 23, 2007 |
| 7164199 |
Device packages with low stress assembly process |
Jan. 16, 2007 |
| 7144757 |
Circuit suitable for vertical integration and method of producing same |
Dec. 5, 2006 |
| 7135768 |
Hermetic seal |
Nov. 14, 2006 |
| 7105920 |
Substrate design to improve chip package reliability |
Sep. 12, 2006 |
| 7067903 |
Heat spreader and semiconductor device and package using the same |
Jun. 27, 2006 |
| 7053493 |
Semiconductor device having stiffener |
May. 30, 2006 |
| 7049695 |
Method and device for heat dissipation in semiconductor modules |
May. 23, 2006 |
| 7023089 |
Low temperature packaging apparatus and method |
Apr. 4, 2006 |
| 7005738 |
Semiconductor package with lid heat spreader |
Feb. 28, 2006 |
| 7002247 |
Thermal interposer for thermal management of semiconductor devices |
Feb. 21, 2006 |
| 6987315 |
Ceramic multilayer substrate |
Jan. 17, 2006 |
| 6953291 |
Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection |
Oct. 11, 2005 |
| 6921969 |
Semiconductor module and method of producing a semiconductor module |
Jul. 26, 2005 |
| 6919630 |
Semiconductor package with heat spreader |
Jul. 19, 2005 |
| 6914325 |
Power semiconductor module |
Jul. 5, 2005 |
| 6894373 |
Surface-mounting type of electronic circuit unit suitable for miniaturization and a method for fabricating the unit |
May. 17, 2005 |
| 6891263 |
Ceramic substrate for a semiconductor production/inspection device |
May. 10, 2005 |
| 6888236 |
Ceramic substrate for manufacture/inspection of semiconductor |
May. 3, 2005 |
| 6888231 |
Surface mounting semiconductor device |
May. 3, 2005 |
| 6858929 |
Semiconductor package with lid heat spreader |
Feb. 22, 2005 |
| 6856015 |
Semiconductor package with heat sink |
Feb. 15, 2005 |
| 6856076 |
Plasma display device having efficient heat conductivity |
Feb. 15, 2005 |
| 6853088 |
Semiconductor module and method for fabricating the semiconductor module |
Feb. 8, 2005 |
| 6849938 |
Ceramic substrate for semiconductor production and inspection |
Feb. 1, 2005 |
| 6849941 |
Heat sink and heat spreader assembly |
Feb. 1, 2005 |
| 6836014 |
Optical testing of integrated circuits with temperature control |
Dec. 28, 2004 |
| 6825555 |
Hot plate |
Nov. 30, 2004 |
| 6818979 |
High-frequency semiconductor device |
Nov. 16, 2004 |
| 6815810 |
High-frequency semiconductor device |
Nov. 9, 2004 |
| 6798060 |
Power device and direct aluminum bonded substrate thereof |
Sep. 28, 2004 |
| 6794747 |
Semiconductor device |
Sep. 21, 2004 |
| 6791164 |
Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages |
Sep. 14, 2004 |
| 6791179 |
Monolithic semiconducting ceramic electronic component |
Sep. 14, 2004 |
| 6791180 |
Ceramic circuit board and power module |
Sep. 14, 2004 |
| 6787884 |
Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production |
Sep. 7, 2004 |
| 6784551 |
Electronic device having a trimming possibility and at least one semiconductor chip and method for producing the electronic device |
Aug. 31, 2004 |
|
|
|
