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Class Information
Number: 257/705
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > Of high thermal conductivity ceramic (e.g., beo)
Description: Subject matter wherein the housing is made of ceramic which has high thermal conductivity to promote heat dissipation from the housing.










Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8703286 Polymer matrices for polymer solder hybrid materials Apr. 22, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8598458 Electronic device and method of manufacturing the same Dec. 3, 2013
8587088 Side-mounted controller and methods for making the same Nov. 19, 2013
8575657 Direct growth of diamond in backside vias for GaN HEMT devices Nov. 5, 2013
8525342 Dual-side interconnected CMOS for stacked integrated circuits Sep. 3, 2013
8502373 3-D integrated circuit lateral heat dissipation Aug. 6, 2013
8492202 Semiconductor device and method of manufacturing the same Jul. 23, 2013
8421219 Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same Apr. 16, 2013
8415207 Module including a sintered joint bonding a semiconductor chip to a copper surface Apr. 9, 2013
8314484 Semiconductor device and method of manufacturing the same Nov. 20, 2012
8309979 Electrically isolated vertical light emitting diode structure Nov. 13, 2012
8283773 Semiconductor device having anti-warping sheet Oct. 9, 2012
8253233 Module including a sintered joint bonding a semiconductor chip to a copper surface Aug. 28, 2012
8232635 Hermetic semiconductor package Jul. 31, 2012
8217512 Thermal interface device Jul. 10, 2012
8193043 High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same Jun. 5, 2012
8183088 Semiconductor die package and method for making the same May. 22, 2012
8080866 3-D integrated semiconductor device comprising intermediate heat spreading capabilities Dec. 20, 2011
8072065 System and method for integrated waveguide packaging Dec. 6, 2011
8035127 Packaging substrate structure with a semiconductor chip embedded therein Oct. 11, 2011
8030757 Forming a semiconductor package including a thermal interface material Oct. 4, 2011
8030754 Chip cooling channels formed in wafer bonding gap Oct. 4, 2011
8022513 Packaging substrate structure with electronic components embedded in a cavity of a metal block and method for fabricating the same Sep. 20, 2011
7948075 Silicon nitride substrate, method of manufacturing the same, and silicon nitride circuit board and semiconductor module using the same May. 24, 2011
7944711 Discrete electronic component and related assembling method May. 17, 2011
7923833 Semiconductor module Apr. 12, 2011
7911051 Electronic circuit arrangement and method for producing an electronic circuit arrangement Mar. 22, 2011
7891836 Semiconductor light-emitting device with improved heatsinking Feb. 22, 2011
7880183 Light emitting device having a plurality of light emitting cells and method of fabricating the same Feb. 1, 2011
7781236 Optical element mounting method and optical element mounting device Aug. 24, 2010
RE41559 Semiconductor device package with improved cooling Aug. 24, 2010
7777325 Power semiconductor module Aug. 17, 2010
7772601 Light emitting device having a plurality of light emitting cells and method of fabricating the same Aug. 10, 2010
7772602 Light emitting device having a plurality of light emitting cells and method of fabricating the same Aug. 10, 2010
7772609 LED package with structure and materials for high heat dissipation Aug. 10, 2010
7755165 iTFC with optimized C(T) Jul. 13, 2010
7750461 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate Jul. 6, 2010
7671455 Semiconductor device package with integrated heat spreader Mar. 2, 2010
7663242 Thermal interface material and solder preforms Feb. 16, 2010
7659614 High temperature, stable SiC device interconnects and packages having low thermal resistance Feb. 9, 2010
7635916 Integrated circuit package with top-side conduction cooling Dec. 22, 2009
7608917 Power semiconductor module Oct. 27, 2009
7582962 Heat dissipation device Sep. 1, 2009
7567599 Semiconductor laser diode device with thermal conductive encapsulating resin and method for manufacturing the same Jul. 28, 2009
7534649 Thermoset polyimides for microelectronic applications May. 19, 2009
7535714 Apparatus and method providing metallic thermal interface between metal capped module and heat sink May. 19, 2009
7504670 Sealing structure for mounting a semiconductor device to a substrate Mar. 17, 2009
7498671 Power semiconductor module Mar. 3, 2009
7466019 Rectangular semi-conducting support for microelectronics and method for making same Dec. 16, 2008

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