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Browse by Category: Main > Physics
Class Information
Number: 257/704
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > Cap or lid
Description: Subject matter wherein the housing or package is provided with a cap or lid.










Patents under this class:

Patent Number Title Of Patent Date Issued
8324737 Modified chip attach process Dec. 4, 2012
8324728 Wafer level packaging using flip chip mounting Dec. 4, 2012
8324024 Method for production of packaged electronic components, and a packaged electronic component Dec. 4, 2012
8323998 Methods and apparatus for forming uniform layers of phosphor material on an LED encapsulation structure Dec. 4, 2012
8314486 Integrated circuit packaging system with shield and method of manufacture thereof Nov. 20, 2012
8310036 Chips having rear contacts connected by through vias to front contacts Nov. 13, 2012
8304891 Semiconductor package device, semiconductor package structure, and fabrication methods thereof Nov. 6, 2012
8288861 Encapsulation for an organic electronic component, its production process and its use Oct. 16, 2012
8288860 Memory device system with stacked packages Oct. 16, 2012
8288857 Anti-tamper microchip package based on thermal nanofluids or fluids Oct. 16, 2012
8288851 Method and system for hermetically sealing packages for optics Oct. 16, 2012
8278567 Electronic device and method of manufacturing the same Oct. 2, 2012
8278154 Method of fabricating a semiconductor device package including a heat radiation plate Oct. 2, 2012
8269340 Curvilinear heat spreader/lid with improved heat dissipation Sep. 18, 2012
8269320 Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof Sep. 18, 2012
8268670 Method of semiconductor device protection Sep. 18, 2012
8264848 Electrical assembly having impedance controlled signal traces Sep. 11, 2012
8264059 Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield Sep. 11, 2012
8258013 Integrated circuit assembly having vented heat-spreader Sep. 4, 2012
8253240 Cap member and semiconductor device employing same Aug. 28, 2012
8253042 Housing comprising an electronic component Aug. 28, 2012
8247889 Package having an inner shield and method for making the same Aug. 21, 2012
8238107 Cap for MEMS package Aug. 7, 2012
8237256 Integrated package Aug. 7, 2012
8232635 Hermetic semiconductor package Jul. 31, 2012
8232615 Packaged device with acoustic transducer and amplifier Jul. 31, 2012
8222811 Electroluminescent display, illumination or indicating device, and its fabrication process Jul. 17, 2012
8222730 Magnetic particle-based composite materials for semiconductor packages Jul. 17, 2012
8217473 Micro electro-mechanical system packaging and interconnect Jul. 10, 2012
8216887 Semiconductor chip package with stiffener frame and configured lid Jul. 10, 2012
8212351 Structure for encapsulating microelectronic devices Jul. 3, 2012
8212344 Microelectromechanical semiconductor component with cavity structure and method for producing the same Jul. 3, 2012
8202765 Achieving mechanical and thermal stability in a multi-chip package Jun. 19, 2012
8198712 Hermetically sealed semiconductor device module Jun. 12, 2012
8193633 Heat conductive sheet and method for producing same, and powder module Jun. 5, 2012
8193631 Semiconductor device and method of manufacturing the semiconductor device Jun. 5, 2012
8183088 Semiconductor die package and method for making the same May. 22, 2012
8174113 Methods of fabricating robust integrated heat spreader designs and structures formed thereby May. 8, 2012
8174112 Integrated circuit device with low capacitance and high thermal conductivity interface May. 8, 2012
8173912 Housing comprising a device for fixing an electronic component May. 8, 2012
8164181 Semiconductor device packaging structure Apr. 24, 2012
8164180 Functional element package and fabrication method therefor Apr. 24, 2012
8164179 Chip scale package structure with can attachment Apr. 24, 2012
8154119 Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing Apr. 10, 2012
8154115 Package structure having MEMS element and fabrication method thereof Apr. 10, 2012
8148811 Semiconductor device and manufacturing method thereof Apr. 3, 2012
8138597 Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layer Mar. 20, 2012
8129827 Integrated circuit package system with package encapsulation having recess Mar. 6, 2012
8129801 Discrete stress isolator attachment structures for MEMS sensor packages Mar. 6, 2012
8125076 Semiconductor package system with substrate heat sink Feb. 28, 2012











 
 
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