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Class Information
Number: 257/704
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > Cap or lid
Description: Subject matter wherein the housing or package is provided with a cap or lid.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 8106501 |
Semiconductor die package including low stress configuration |
Jan. 31, 2012 |
| 8103025 |
Surface mountable transducer system |
Jan. 24, 2012 |
| 8102041 |
Integrated circuit package |
Jan. 24, 2012 |
| 8102015 |
Microphone package with minimum footprint size and thickness |
Jan. 24, 2012 |
| 8094454 |
Immersion cooling apparatus for a power semiconductor device |
Jan. 10, 2012 |
| 8093714 |
Chip assembly with chip-scale packaging |
Jan. 10, 2012 |
| 8092734 |
Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers |
Jan. 10, 2012 |
| 8090229 |
Method and device for providing electronic circuitry on a backplate |
Jan. 3, 2012 |
| 8084297 |
Method of implementing a capacitor in an integrated circuit |
Dec. 27, 2011 |
| 8080869 |
Wafer level package structure and production method therefor |
Dec. 20, 2011 |
| 8076771 |
Semiconductor device having metal cap divided by slit |
Dec. 13, 2011 |
| 8071187 |
Method for fabricating metallized ceramics substrate, metallized ceramics substrate fabricated by the method, and package |
Dec. 6, 2011 |
| 8067833 |
Low noise high thermal conductivity mixed signal package |
Nov. 29, 2011 |
| 8063482 |
Heat spreader as mechanical reinforcement for ultra-thin die |
Nov. 22, 2011 |
| 8053872 |
Integrated shield for a no-lead semiconductor device package |
Nov. 8, 2011 |
| 8049318 |
Semiconductor light emitting device |
Nov. 1, 2011 |
| 8044428 |
Package and semiconductor device for preventing occurrence of false connection |
Oct. 25, 2011 |
| 8043880 |
Microelectronic device |
Oct. 25, 2011 |
| 8039950 |
Solder material lining a cover wafer attached to wafer substrate |
Oct. 18, 2011 |
| 8035221 |
Clip mount for integrated circuit leadframes |
Oct. 11, 2011 |
| 8030757 |
Forming a semiconductor package including a thermal interface material |
Oct. 4, 2011 |
| 8026595 |
Semiconductor device having hermitically sealed active area and electrodes |
Sep. 27, 2011 |
| 8026594 |
Sensor device and production method therefor |
Sep. 27, 2011 |
| 8023268 |
Printed circuit board unit and semiconductor package |
Sep. 20, 2011 |
| 8021925 |
Thermal paste containment for semiconductor modules |
Sep. 20, 2011 |
| 8018072 |
Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate |
Sep. 13, 2011 |
| 8018052 |
Integrated circuit package system with side substrate having a top layer |
Sep. 13, 2011 |
| 8018050 |
Integrated circuit package with integrated heat sink |
Sep. 13, 2011 |
| 8018049 |
Silicon condenser microphone and manufacturing method |
Sep. 13, 2011 |
| 8017435 |
Method for packaging electronic devices and integrated circuits |
Sep. 13, 2011 |
| 8013435 |
Semiconductor module |
Sep. 6, 2011 |
| 8013404 |
Folded lead-frame packages for MEMS devices |
Sep. 6, 2011 |
| 8003442 |
Integrated cirucit package and method for fabrication thereof |
Aug. 23, 2011 |
| 7999394 |
Void reduction in indium thermal interface material |
Aug. 16, 2011 |
| 7999374 |
Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same |
Aug. 16, 2011 |
| 7999366 |
Micro-component packaging process and set of micro-components resulting from this process |
Aug. 16, 2011 |
| 7994636 |
Flip chip interconnection structure |
Aug. 9, 2011 |
| 7994044 |
Semiconductor chip with contoured solder structure opening |
Aug. 9, 2011 |
| 7990025 |
Silicon package with embedded oscillator |
Aug. 2, 2011 |
| 7989938 |
Semiconductor device for fingerprint recognition |
Aug. 2, 2011 |
| 7986043 |
Integrated circuit package on package system |
Jul. 26, 2011 |
| 7986038 |
Electronic device and lid |
Jul. 26, 2011 |
| 7982291 |
Method for manufacturing a microelectromechanical component, and a microelectromechanical component |
Jul. 19, 2011 |
| 7977162 |
Semiconductor device, method for the same, and heat radiator |
Jul. 12, 2011 |
| 7968979 |
Integrated circuit package system with conformal shielding and method of manufacture thereof |
Jun. 28, 2011 |
| 7968961 |
Solid-state image pickup device and method for manufacturing the same |
Jun. 28, 2011 |
| 7964954 |
Integrated circuit having a semiconductor sensor device with embedded column-like spacers |
Jun. 21, 2011 |
| 7960826 |
Dielectric layer structure |
Jun. 14, 2011 |
| 7960739 |
Optical module and production method therefor |
Jun. 14, 2011 |
| 7952189 |
Hermetic packaging and method of manufacture and use therefore |
May. 31, 2011 |
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