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Class Information
Number: 257/704
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > Cap or lid
Description: Subject matter wherein the housing or package is provided with a cap or lid.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7456483 |
Semiconductor device, manufacturing method of semiconductor device and module for optical device |
Nov. 25, 2008 |
| 7456497 |
Electronic devices and its production methods |
Nov. 25, 2008 |
| 7449366 |
Wafer level packaging cap and fabrication method thereof |
Nov. 11, 2008 |
| 7449773 |
Microelectromechanical device packages with integral heaters |
Nov. 11, 2008 |
| 7446407 |
Chip package structure |
Nov. 4, 2008 |
| 7443024 |
Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same |
Oct. 28, 2008 |
| 7443017 |
Package having bond-sealed underbump |
Oct. 28, 2008 |
| 7443016 |
Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of |
Oct. 28, 2008 |
| 7439616 |
Miniature silicon condenser microphone |
Oct. 21, 2008 |
| 7436056 |
Electronic component package |
Oct. 14, 2008 |
| 7436058 |
Reactive solder material |
Oct. 14, 2008 |
| 7432533 |
Encapsulation of electronic devices with shaped spacers |
Oct. 7, 2008 |
| 7432590 |
Ceramic package, assembled substrate, and manufacturing method therefor |
Oct. 7, 2008 |
| 7429501 |
Lid and method of employing a lid on an integrated circuit |
Sep. 30, 2008 |
| 7429783 |
Image sensor package |
Sep. 30, 2008 |
| 7427807 |
Chip heat dissipation structure and manufacturing method |
Sep. 23, 2008 |
| 7423341 |
Plastic overmolded packages with mechanically decoupled lid attach attachment |
Sep. 9, 2008 |
| 7423334 |
Image sensor module with a protection layer and a method for manufacturing the same |
Sep. 9, 2008 |
| 7417198 |
Radiofrequency power semiconductor module with cavity housing, and method for producing it |
Aug. 26, 2008 |
| 7417307 |
System and method for direct-bonding of substrates |
Aug. 26, 2008 |
| 7417327 |
IC chip package with cover |
Aug. 26, 2008 |
| 7414310 |
Waferscale package system |
Aug. 19, 2008 |
| 7410886 |
Method for fabricating protective caps for protecting elements on a wafer surface |
Aug. 12, 2008 |
| 7408244 |
Semiconductor package and stack arrangement thereof |
Aug. 5, 2008 |
| 7408257 |
Packaging chip and packaging method thereof |
Aug. 5, 2008 |
| 7402899 |
Hermetically sealable silicon system and method of making same |
Jul. 22, 2008 |
| 7402906 |
Enhanced die-down ball grid array and method for making the same |
Jul. 22, 2008 |
| 7399657 |
Ball grid array packages with thermally conductive containers |
Jul. 15, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7400036 |
Semiconductor chip package with a package substrate and a lid cover |
Jul. 15, 2008 |
| 7396704 |
Lid made of resin for case for accommodating solid-state imaging device and solid-state imaging apparatus |
Jul. 8, 2008 |
| 7396698 |
Methods and systems for providing MEMS devices with a top cap and upper sense plate |
Jul. 8, 2008 |
| 7394153 |
Encapsulation of electronic devices |
Jul. 1, 2008 |
| 7387902 |
Methods for packaging image sensitive electronic devices |
Jun. 17, 2008 |
| 7388284 |
Integrated circuit package and method of attaching a lid to a substrate of an integrated circuit |
Jun. 17, 2008 |
| 7388285 |
Hermetically sealed package for optical, electronic, opto-electronic and other devices |
Jun. 17, 2008 |
| 7382046 |
Semiconductor device protection cover, and semiconductor device unit including the cover |
Jun. 3, 2008 |
| 7378748 |
Solid-state imaging device and method for manufacturing the same |
May. 27, 2008 |
| 7378724 |
Cavity structure for semiconductor structures |
May. 27, 2008 |
| 7375331 |
Optically blocked reference pixels for focal plane arrays |
May. 20, 2008 |
| 7372074 |
Surface preparation for selective silicon fusion bonding |
May. 13, 2008 |
| 7372135 |
Multi-chip image sensor module |
May. 13, 2008 |
| 7368808 |
MEMS packaging using a non-silicon substrate for encapsulation and interconnection |
May. 6, 2008 |
| 7368815 |
Semiconductor device which prevents light from entering therein |
May. 6, 2008 |
| 7368816 |
Micro-electro-mechanical system (MEMS) package having metal sealing member |
May. 6, 2008 |
| 7365981 |
Fluid-cooled electronic system |
Apr. 29, 2008 |
| 7365442 |
Encapsulation of thin-film electronic devices |
Apr. 29, 2008 |
| 7365421 |
IC chip package with isolated vias |
Apr. 29, 2008 |
| 7365405 |
Metrology structure and methods |
Apr. 29, 2008 |
| 7357017 |
Wafer level capped sensor |
Apr. 15, 2008 |
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