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Browse by Category: Main > Physics
Class Information
Number: 257/704
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > Cap or lid
Description: Subject matter wherein the housing or package is provided with a cap or lid.










Patents under this class:

Patent Number Title Of Patent Date Issued
8704360 Top port surface mount silicon condenser microphone package Apr. 22, 2014
8703540 Chip-scale semiconductor die packaging method Apr. 22, 2014
8703286 Polymer matrices for polymer solder hybrid materials Apr. 22, 2014
8686555 Integrated heater on MEMS cap for wafer scale packaged MEMS sensors Apr. 1, 2014
8680672 Semiconductor package with sleeve member and fan wheel for heat dissipation Mar. 25, 2014
8680669 Electronic component, electronic module, and method for manufacturing the same Mar. 25, 2014
8674498 MEMS package and method for the production thereof Mar. 18, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8664683 Carrier and optical semiconductor device based on such a carrier Mar. 4, 2014
8656740 Manufacturing method of glass-sealed package, and glass substrate Feb. 25, 2014
8652883 Methods of manufacture of bottom port surface mount silicon condenser microphone packages Feb. 18, 2014
8643169 Semiconductor sensor device with over-molded lid Feb. 4, 2014
8637978 System-in-a-package based flash memory card Jan. 28, 2014
8633064 Methods of manufacture of top port multipart surface mount silicon condenser microphone package Jan. 21, 2014
8629552 Top port multi-part surface mount silicon condenser microphone package Jan. 14, 2014
8629551 Bottom port surface mount silicon condenser microphone package Jan. 14, 2014
8629005 Methods of manufacture of bottom port surface mount silicon condenser microphone packages Jan. 14, 2014
8627566 Method for packaging a microelectromechanical system (MEMS) device Jan. 14, 2014
8624387 Top port multi-part surface mount silicon condenser microphone package Jan. 7, 2014
8624386 Bottom port multi-part surface mount silicon condenser microphone package Jan. 7, 2014
8624385 Top port surface mount silicon condenser microphone package Jan. 7, 2014
8624384 Bottom port surface mount silicon condenser microphone package Jan. 7, 2014
8624383 Integrated circuit package and method for fabrication thereof Jan. 7, 2014
8623710 Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages Jan. 7, 2014
8623709 Methods of manufacture of top port surface mount silicon condenser microphone packages Jan. 7, 2014
8617934 Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages Dec. 31, 2013
8610006 Lid for micro-electro-mechanical device and method for fabricating the same Dec. 17, 2013
8604607 Semiconductor module and semiconductor device Dec. 10, 2013
8604605 Microelectronic assembly with multi-layer support structure Dec. 10, 2013
8599571 Memory card Dec. 3, 2013
8597979 Panel-level package fabrication of 3D active semiconductor and passive circuit components Dec. 3, 2013
8592970 Multichip electronic packages and methods of manufacture Nov. 26, 2013
8592959 Semiconductor device mounted on a wiring board having a cap Nov. 26, 2013
8592926 Substrate bonding with metal germanium silicon material Nov. 26, 2013
8590136 Method of fabricating a dual single-crystal backplate microphone Nov. 26, 2013
8587114 Multichip electronic packages and methods of manufacture Nov. 19, 2013
8587107 Silicon carbide semiconductor Nov. 19, 2013
8575748 Wafer-level packaging with compression-controlled seal ring bonding Nov. 5, 2013
8575747 Clip interconnect with encapsulation material locking feature Nov. 5, 2013
8571249 Silicon microphone package Oct. 29, 2013
8564117 Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing Oct. 22, 2013
8558371 Method for wafer level package and semiconductor device fabricated using the same Oct. 15, 2013
8558361 Power semiconductor module Oct. 15, 2013
8552539 Shielded package having shield lid Oct. 8, 2013
8546934 Method for manufacturing semiconductor devices having a glass substrate Oct. 1, 2013
8546933 Semiconductor apparatus including resin case Oct. 1, 2013
8546903 Ionic isolation ring Oct. 1, 2013
8525324 Semiconductor package and method of fabricating the same Sep. 3, 2013
8525323 Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package Sep. 3, 2013
8519529 Semiconductor package with lid bonded on wiring board and method of manufacturing the same Aug. 27, 2013











 
 
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