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Class Information
Number: 257/704
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > Cap or lid
Description: Subject matter wherein the housing or package is provided with a cap or lid.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619308 |
Multi-lid semiconductor package |
Nov. 17, 2009 |
| 7618575 |
Method for wafer scale molding of protective caps |
Nov. 17, 2009 |
| 7615404 |
High-contrast laser mark on substrate surfaces |
Nov. 10, 2009 |
| 7615482 |
Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength |
Nov. 10, 2009 |
| 7615861 |
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards |
Nov. 10, 2009 |
| 7615842 |
Inductor integrated chip |
Nov. 10, 2009 |
| 7607355 |
Semiconductor device |
Oct. 27, 2009 |
| 7596850 |
Method for temporarily inactivating a wireless communication device |
Oct. 6, 2009 |
| 7598125 |
Method for wafer level packaging and fabricating cap structures |
Oct. 6, 2009 |
| 7598580 |
Image sensor module package structure with supporting element |
Oct. 6, 2009 |
| 7595540 |
Semiconductor device and method of manufacturing the same |
Sep. 29, 2009 |
| 7582951 |
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages |
Sep. 1, 2009 |
| 7579685 |
Wafer level packaging cap and fabrication method thereof |
Aug. 25, 2009 |
| 7579688 |
Heat radiation structure of semiconductor device, and manufacturing method thereof |
Aug. 25, 2009 |
| 7576425 |
Conducting layer in chip package module |
Aug. 18, 2009 |
| 7576427 |
Cold weld hermetic MEMS package and method of manufacture |
Aug. 18, 2009 |
| 7569926 |
Wafer level hermetic bond using metal alloy with raised feature |
Aug. 4, 2009 |
| 7564111 |
Imaging apparatus |
Jul. 21, 2009 |
| 7564123 |
Semiconductor package with fastened leads |
Jul. 21, 2009 |
| 7560811 |
Semiconductor device |
Jul. 14, 2009 |
| 7557441 |
Package of MEMS device and method for fabricating the same |
Jul. 7, 2009 |
| 7554189 |
Wireless communication module |
Jun. 30, 2009 |
| 7554136 |
Micro-switch device and method for manufacturing the same |
Jun. 30, 2009 |
| 7550831 |
Electronic device and semiconductor device |
Jun. 23, 2009 |
| 7547582 |
Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies |
Jun. 16, 2009 |
| 7541669 |
Semiconductor device package with base features to reduce leakage |
Jun. 2, 2009 |
| 7541662 |
Packaging chip having inductor therein |
Jun. 2, 2009 |
| 7538421 |
Flip-chip package structure with stiffener |
May. 26, 2009 |
| 7534636 |
Lids for wafer-scale optoelectronic packages |
May. 19, 2009 |
| 7534653 |
Chip packaging process |
May. 19, 2009 |
| 7535096 |
Glass substrate and capacitance-type pressure sensor using the same |
May. 19, 2009 |
| 7535097 |
Semiconductor device and method of manufacturing the same |
May. 19, 2009 |
| 7531229 |
Microstructured component and method for its manufacture |
May. 12, 2009 |
| 7528481 |
Wafer level packaging cap and fabrication method thereof |
May. 5, 2009 |
| 7521789 |
Electrical assembly having heat sink protrusions |
Apr. 21, 2009 |
| 7521790 |
Semiconductor device module and manufacturing method of semiconductor device module |
Apr. 21, 2009 |
| 7518157 |
Optoelectronic component assembly |
Apr. 14, 2009 |
| 7518205 |
Semiconductor package and method for manufacturing the same |
Apr. 14, 2009 |
| 7518233 |
Sealing structure for multi-chip module |
Apr. 14, 2009 |
| 7514718 |
LED package, manufacturing method thereof, and LED array module using the same |
Apr. 7, 2009 |
| 7511373 |
Cap package for micro electro-mechanical system |
Mar. 31, 2009 |
| 7510108 |
Method of making an electronic assembly |
Mar. 31, 2009 |
| 7508056 |
Surface mount hermetic package for power semiconductor die |
Mar. 24, 2009 |
| 7508063 |
Low cost hermetically sealed package |
Mar. 24, 2009 |
| 7508064 |
Package for sealing an integrated circuit die |
Mar. 24, 2009 |
| 7508065 |
Device package and methods for the fabrication and testing thereof |
Mar. 24, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7498673 |
Heatplates for heatsink attachment for semiconductor chips |
Mar. 3, 2009 |
| 7495333 |
Seal cover structure comprising a nickel-tin (Ni--Sn) alloy barrier layer formed between a nickel (Ni) plating layer and a gold-tin (Au--Sn) brazing layer having Sn content of 20.65 to 25 WT % |
Feb. 24, 2009 |
| 7492040 |
Glass lid, and package provided with such a lid, for the encapsulation of electronic components |
Feb. 17, 2009 |
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