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Browse by Category: Main > Physics
Class Information
Number: 257/703
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > Composite ceramic, or single ceramic with metal
Description: Subject matter wherein the housing is a composite made up of at least two ceramic materials (e.g., alumina and beryllia) or of a single ceramic material with a metal.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8659900 Circuit board including a heat radiating plate Feb. 25, 2014
8642408 Semiconductor device Feb. 4, 2014
8633583 Semiconductor package substrate and methods for forming same, in particular for MEMS devices Jan. 21, 2014
8624339 Vibrating device and electronic apparatus Jan. 7, 2014
8598465 Hermetic circuit ring for BCB WSA circuits Dec. 3, 2013
8597979 Panel-level package fabrication of 3D active semiconductor and passive circuit components Dec. 3, 2013
8593817 Power semiconductor module and method for operating a power semiconductor module Nov. 26, 2013
8578591 Method for manufacturing a stacked device conductive path connectivity Nov. 12, 2013
8563869 Circuit board and semiconductor module using this, production method for circuit board Oct. 22, 2013
8564118 Power module substrate, power module, and method for manufacturing power module substrate Oct. 22, 2013
8513800 Semiconductor device and method for manufacturing the same Aug. 20, 2013
8487439 Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board Jul. 16, 2013
8466548 Semiconductor device including excess solder Jun. 18, 2013
8450843 Semiconductor device and method for designing the same May. 28, 2013
8448326 Method of manufacturing an accelerometer May. 28, 2013
8441114 Electronic circuit composed of sub-circuits and method for producing May. 14, 2013
8436461 Semiconductor device May. 7, 2013
8421215 Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board Apr. 16, 2013
8415207 Module including a sintered joint bonding a semiconductor chip to a copper surface Apr. 9, 2013
8378473 Semiconductor device having semiconductor chip within multilayer substrate Feb. 19, 2013
8373195 Light-emitting diode lamp with low thermal resistance Feb. 12, 2013
8342384 Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate Jan. 1, 2013
8324727 Low profile discrete electronic components and applications of same Dec. 4, 2012
8304660 Fully reflective and highly thermoconductive electronic module and method of manufacturing the same Nov. 6, 2012
8268437 Method for producing ceramic sheet, ceramic substrate using ceramic sheet obtained by such method, and use thereof Sep. 18, 2012
8253233 Module including a sintered joint bonding a semiconductor chip to a copper surface Aug. 28, 2012
8237235 Metal-ceramic multilayer structure Aug. 7, 2012
8232629 Semiconductor device Jul. 31, 2012
8232635 Hermetic semiconductor package Jul. 31, 2012
8188561 Integral topside vacuum package May. 29, 2012
8183088 Semiconductor die package and method for making the same May. 22, 2012
8164178 Chip-type semiconductor ceramic electronic component Apr. 24, 2012
8164177 Electronic component module and method for production thereof Apr. 24, 2012
8164176 Semiconductor module arrangement Apr. 24, 2012
8120175 Soft error rate mitigation by interconnect structure Feb. 21, 2012
8121331 Surface mount silicon condenser microphone package Feb. 21, 2012
8101966 Light-emitting diode lamp with low thermal resistance Jan. 24, 2012
8093682 Resistance memory element Jan. 10, 2012
8093692 Semiconductor device packaging including a power semiconductor element Jan. 10, 2012
8089148 Circuit board and semiconductor device having the same Jan. 3, 2012
8071187 Method for fabricating metallized ceramics substrate, metallized ceramics substrate fabricated by the method, and package Dec. 6, 2011
8067842 Integrated circuit package, notably for image sensor, and method of positioning Nov. 29, 2011
8044500 Power module substrate, method for manufacturing power module substrate, and power module Oct. 25, 2011
8039949 Ball grid array package having one or more stiffeners Oct. 18, 2011
8030749 Semiconductor device Oct. 4, 2011
8003438 Circuit module and manufacturing method thereof Aug. 23, 2011
7986214 Electrical assembly with PTC resistor elements Jul. 26, 2011
7948069 Surface mountable hermetically sealed package May. 24, 2011
7948075 Silicon nitride substrate, method of manufacturing the same, and silicon nitride circuit board and semiconductor module using the same May. 24, 2011

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