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Class Information
Number: 257/703
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > Composite ceramic, or single ceramic with metal
Description: Subject matter wherein the housing is a composite made up of at least two ceramic materials (e.g., alumina and beryllia) or of a single ceramic material with a metal.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7453144 |
Thin film capacitors and methods of making the same |
Nov. 18, 2008 |
| 7446406 |
Circuit device and manufacturing method thereof |
Nov. 4, 2008 |
| 7414823 |
Holder for use in semiconductor or liquid-crystal manufacturing device and semiconductor or liquid-crystal manufacturing device in which the holder is installed |
Aug. 19, 2008 |
| 7405474 |
Low cost thermally enhanced semiconductor package |
Jul. 29, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7387827 |
Interconnection designs and materials having improved strength and fatigue life |
Jun. 17, 2008 |
| 7388293 |
Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions |
Jun. 17, 2008 |
| 7382042 |
COF flexible printed wiring board and method of producing the wiring board |
Jun. 3, 2008 |
| 7375412 |
iTFC with optimized C(T) |
May. 20, 2008 |
| 7368819 |
Multilayer printed wiring board and multilayer printed circuit board |
May. 6, 2008 |
| 7352061 |
Flexible core for enhancement of package interconnect reliability |
Apr. 1, 2008 |
| 7342303 |
Semiconductor device having RF shielding and method therefor |
Mar. 11, 2008 |
| 7327032 |
Semiconductor package accomplishing fan-out structure through wire bonding |
Feb. 5, 2008 |
| 7323255 |
Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate |
Jan. 29, 2008 |
| 7304378 |
Aluminum/ceramic bonding substrate |
Dec. 4, 2007 |
| 7291904 |
Downsized package for electric wave device |
Nov. 6, 2007 |
| 7274099 |
Method of embedding semiconductor chip in support plate |
Sep. 25, 2007 |
| 7256431 |
Insulating substrate and semiconductor device having a thermally sprayed circuit pattern |
Aug. 14, 2007 |
| 7253504 |
Integrated circuit package and method |
Aug. 7, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7226654 |
Laminated wiring board and its mounting structure |
Jun. 5, 2007 |
| 7224046 |
Multilayer wiring board incorporating carbon fibers and glass fibers |
May. 29, 2007 |
| 7221048 |
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier |
May. 22, 2007 |
| 7208829 |
Semiconductor component |
Apr. 24, 2007 |
| 7205650 |
Composite devices of laminate type and processes |
Apr. 17, 2007 |
| 7198968 |
Method of fabricating thin film transistor array substrate |
Apr. 3, 2007 |
| 7186629 |
Protecting thin semiconductor wafers during back-grinding in high-volume production |
Mar. 6, 2007 |
| 7183640 |
Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards |
Feb. 27, 2007 |
| 7173322 |
COF flexible printed wiring board and method of producing the wiring board |
Feb. 6, 2007 |
| 7170186 |
Laminated radiation member, power semiconductor apparatus, and method for producing the same |
Jan. 30, 2007 |
| 7154169 |
Substrate for IC package |
Dec. 26, 2006 |
| 7148554 |
Discrete electronic component arrangement including anchoring, thermally conductive pad |
Dec. 12, 2006 |
| 7135955 |
Electrical component with a negative temperature coefficient |
Nov. 14, 2006 |
| 7132743 |
Integrated circuit package substrate having a thin film capacitor structure |
Nov. 7, 2006 |
| 7132737 |
Package for electronic component and method of manufacturing piezoelectric device |
Nov. 7, 2006 |
| 7126215 |
Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist |
Oct. 24, 2006 |
| 7105909 |
Configuration and method for manufacturing filters comprising LC circuit |
Sep. 12, 2006 |
| 7105920 |
Substrate design to improve chip package reliability |
Sep. 12, 2006 |
| 7099131 |
Surge absorber and surge absorber array |
Aug. 29, 2006 |
| 7098532 |
Ceramic package and chip resistor, and methods for production of the same |
Aug. 29, 2006 |
| 7095108 |
Array capacitors in interposers, and methods of using same |
Aug. 22, 2006 |
| 7091589 |
Multilayer wiring board and manufacture method thereof |
Aug. 15, 2006 |
| 7088003 |
Structures and methods for integration of ultralow-k dielectrics with improved reliability |
Aug. 8, 2006 |
| 7081661 |
High-frequency module and method for manufacturing the same |
Jul. 25, 2006 |
| 7078794 |
Chip package and process for forming the same |
Jul. 18, 2006 |
| 7071551 |
Device used to produce or examine semiconductors |
Jul. 4, 2006 |
| 7061100 |
Semiconductor built-in millimeter-wave band module |
Jun. 13, 2006 |
| 7053493 |
Semiconductor device having stiffener |
May. 30, 2006 |
| 7049695 |
Method and device for heat dissipation in semiconductor modules |
May. 23, 2006 |
| 7045440 |
Method of fabricating radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates |
May. 16, 2006 |
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