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Class Information
Number: 257/703
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > Composite ceramic, or single ceramic with metal
Description: Subject matter wherein the housing is a composite made up of at least two ceramic materials (e.g., alumina and beryllia) or of a single ceramic material with a metal.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7608917 |
Power semiconductor module |
Oct. 27, 2009 |
| 7598610 |
Plate structure having chip embedded therein and the manufacturing method of the same |
Oct. 6, 2009 |
| 7586188 |
Chip package and coreless package substrate thereof |
Sep. 8, 2009 |
| 7578058 |
Production method of a multilayer ceramic substrate |
Aug. 25, 2009 |
| 7569925 |
Module with built-in component |
Aug. 4, 2009 |
| 7550830 |
Stacked semiconductor package having fan-out structure through wire bonding |
Jun. 23, 2009 |
| 7547957 |
Thin film capacitors and methods of making the same |
Jun. 16, 2009 |
| 7538045 |
Coating process to enable electrophoretic deposition |
May. 26, 2009 |
| 7521791 |
Method and apparatus for dissipating heat from an integrated circuit |
Apr. 21, 2009 |
| 7514782 |
Semiconductor device |
Apr. 7, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7482685 |
Ceramic circuit board, method for making the same, and power module |
Jan. 27, 2009 |
| 7476969 |
Semiconductor packages for surface mounting and method of producing same |
Jan. 13, 2009 |
| 7467457 |
Method of coupling a device to a mating part |
Dec. 23, 2008 |
| 7453144 |
Thin film capacitors and methods of making the same |
Nov. 18, 2008 |
| 7446406 |
Circuit device and manufacturing method thereof |
Nov. 4, 2008 |
| 7414823 |
Holder for use in semiconductor or liquid-crystal manufacturing device and semiconductor or liquid-crystal manufacturing device in which the holder is installed |
Aug. 19, 2008 |
| 7405474 |
Low cost thermally enhanced semiconductor package |
Jul. 29, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7388293 |
Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions |
Jun. 17, 2008 |
| 7387827 |
Interconnection designs and materials having improved strength and fatigue life |
Jun. 17, 2008 |
| 7382042 |
COF flexible printed wiring board and method of producing the wiring board |
Jun. 3, 2008 |
| 7375412 |
iTFC with optimized C(T) |
May. 20, 2008 |
| 7368819 |
Multilayer printed wiring board and multilayer printed circuit board |
May. 6, 2008 |
| 7352061 |
Flexible core for enhancement of package interconnect reliability |
Apr. 1, 2008 |
| 7342303 |
Semiconductor device having RF shielding and method therefor |
Mar. 11, 2008 |
| 7327032 |
Semiconductor package accomplishing fan-out structure through wire bonding |
Feb. 5, 2008 |
| 7323255 |
Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate |
Jan. 29, 2008 |
| 7304378 |
Aluminum/ceramic bonding substrate |
Dec. 4, 2007 |
| 7291904 |
Downsized package for electric wave device |
Nov. 6, 2007 |
| 7274099 |
Method of embedding semiconductor chip in support plate |
Sep. 25, 2007 |
| 7256431 |
Insulating substrate and semiconductor device having a thermally sprayed circuit pattern |
Aug. 14, 2007 |
| 7253504 |
Integrated circuit package and method |
Aug. 7, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7226654 |
Laminated wiring board and its mounting structure |
Jun. 5, 2007 |
| 7224046 |
Multilayer wiring board incorporating carbon fibers and glass fibers |
May. 29, 2007 |
| 7221048 |
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier |
May. 22, 2007 |
| 7208829 |
Semiconductor component |
Apr. 24, 2007 |
| 7205650 |
Composite devices of laminate type and processes |
Apr. 17, 2007 |
| 7198968 |
Method of fabricating thin film transistor array substrate |
Apr. 3, 2007 |
| 7186629 |
Protecting thin semiconductor wafers during back-grinding in high-volume production |
Mar. 6, 2007 |
| 7183640 |
Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards |
Feb. 27, 2007 |
| 7173322 |
COF flexible printed wiring board and method of producing the wiring board |
Feb. 6, 2007 |
| 7170186 |
Laminated radiation member, power semiconductor apparatus, and method for producing the same |
Jan. 30, 2007 |
| 7154169 |
Substrate for IC package |
Dec. 26, 2006 |
| 7148554 |
Discrete electronic component arrangement including anchoring, thermally conductive pad |
Dec. 12, 2006 |
| 7135955 |
Electrical component with a negative temperature coefficient |
Nov. 14, 2006 |
| 7132737 |
Package for electronic component and method of manufacturing piezoelectric device |
Nov. 7, 2006 |
| 7132743 |
Integrated circuit package substrate having a thin film capacitor structure |
Nov. 7, 2006 |
| 7126215 |
Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist |
Oct. 24, 2006 |
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