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Class Information
Number: 257/702
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > Of insulating material other than ceramic
Description: Subject matter under 701 wherein the housing is made of electrically insulating material other than ceramic (e.g., the housing is made of glass or of a single crystal insulator material).










Patents under this class:
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Patent Number Title Of Patent Date Issued
8704359 Method for manufacturing an electronic module and an electronic module Apr. 22, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8664759 Integrated circuit with heat conducting structures for localized thermal control Mar. 4, 2014
8659158 Thermally inkjettable acrylic dielectric ink formulation and process Feb. 25, 2014
8653655 Semiconductor device and manufacturing method thereof Feb. 18, 2014
8653650 Semiconductor device with acene heat spreader Feb. 18, 2014
8643165 Semiconductor device having agglomerate terminals Feb. 4, 2014
8629539 Methods and apparatus for magnetic sensor having non-conductive die paddle Jan. 14, 2014
8624382 Packaging substrate and method of fabricating the same Jan. 7, 2014
8602315 Molded chip card and method for manufacturing same Dec. 10, 2013
8575746 Chip on flexible printed circuit type semiconductor package Nov. 5, 2013
8561291 Method for producing a number of chip cards Oct. 22, 2013
8558370 Semiconductor device with antenna Oct. 15, 2013
8552498 Semiconductor device and method for manufacturing the same Oct. 8, 2013
8524534 Semiconductor device and manufacturing method thereof Sep. 3, 2013
8508038 Method for producing an integrated circuit and resulting film chip Aug. 13, 2013
8486755 Magnetic field sensors and methods for fabricating the magnetic field sensors Jul. 16, 2013
8476737 Environment-resistant module, micropackage and methods of manufacturing same Jul. 2, 2013
8450151 Micro surface mount device packaging May. 28, 2013
8450852 Wiring substrate May. 28, 2013
8436479 Semiconductor device having a chip bonding using a resin adhesive film and method of manufacturing the same May. 7, 2013
8384205 Electronic device package and method of manufacture Feb. 26, 2013
8384209 Semiconductor device and method for manufacturing semiconductor device Feb. 26, 2013
8384211 Semiconductor apparatus with improved efficiency of thermal radiation Feb. 26, 2013
8378498 Chip assembly with a coreless substrate employing a patterned adhesive layer Feb. 19, 2013
8378473 Semiconductor device having semiconductor chip within multilayer substrate Feb. 19, 2013
8368201 Method for embedding a component in a base Feb. 5, 2013
8338931 Semiconductor device and product tracing system utilizing the semiconductor device having top and bottom fibrous sealing layers Dec. 25, 2012
8310069 Semiconductor package having marking layer Nov. 13, 2012
8278147 Semiconductor device and manufacturing method thereof Oct. 2, 2012
8268673 Stacked electronic component and manufacturing method thereof Sep. 18, 2012
8269332 Semiconductor element mounting board Sep. 18, 2012
8269337 Packaging substrate having through-holed interposer embedded therein and fabrication method thereof Sep. 18, 2012
8247700 Wired circuit board Aug. 21, 2012
8203849 Semiconductor device and manufacture method thereof Jun. 19, 2012
8183088 Semiconductor die package and method for making the same May. 22, 2012
8174112 Integrated circuit device with low capacitance and high thermal conductivity interface May. 8, 2012
8143693 Semiconductor device including redistribution line structure and method of fabricating the same Mar. 27, 2012
8129828 Wiring substrate with reinforcement Mar. 6, 2012
8110918 Flexible substrate for a semiconductor package, method of manufacturing the same, and semiconductor package including flexible substrate Feb. 7, 2012
8110906 Semiconductor device including isolation layer Feb. 7, 2012
8101517 Semiconductor device and method for making same Jan. 24, 2012
8093505 Layered electronic circuit device Jan. 10, 2012
8049326 Environment-resistant module, micropackage and methods of manufacturing same Nov. 1, 2011
8044505 Prepreg, method for manufacturing prepreg, substrate, and semiconductor device Oct. 25, 2011
8039949 Ball grid array package having one or more stiffeners Oct. 18, 2011
8035220 Semiconductor packaging device Oct. 11, 2011
8030749 Semiconductor device Oct. 4, 2011
8018048 Semiconductor device Sep. 13, 2011
8013355 High power light emitting diode Sep. 6, 2011

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