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Class Information
Number: 257/702
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material > Of insulating material other than ceramic
Description: Subject matter under 701 wherein the housing is made of electrically insulating material other than ceramic (e.g., the housing is made of glass or of a single crystal insulator material).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618575 |
Method for wafer scale molding of protective caps |
Nov. 17, 2009 |
| 7615860 |
Rigid-flex printed circuit board with weakening structure |
Nov. 10, 2009 |
| 7582976 |
Semiconductor device tape carrier, manufacturing method for semiconductor device, semiconductor device, and semiconductor module device |
Sep. 1, 2009 |
| 7567599 |
Semiconductor laser diode device with thermal conductive encapsulating resin and method for manufacturing the same |
Jul. 28, 2009 |
| 7550845 |
Ball grid array package with separated stiffener layer |
Jun. 23, 2009 |
| 7521276 |
Compliant terminal mountings with vented spaces and methods |
Apr. 21, 2009 |
| 7518238 |
Mounting flexible circuits onto integrated circuit substrates |
Apr. 14, 2009 |
| 7518200 |
Semiconductor integrated circuit chip with a nano-structure-surface passivation film |
Apr. 14, 2009 |
| 7514781 |
Circuit substrate and manufacturing method thereof |
Apr. 7, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7495332 |
Multilayer printed wiring board |
Feb. 24, 2009 |
| 7485976 |
Tamper resistant packaging and approach |
Feb. 3, 2009 |
| 7470984 |
Perpendicularly oriented electrically active element method and system |
Dec. 30, 2008 |
| 7466022 |
Wafer-level seal for non-silicon-based devices |
Dec. 16, 2008 |
| 7459782 |
Stiffener for flip chip BGA package |
Dec. 2, 2008 |
| 7429789 |
Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same |
Sep. 30, 2008 |
| 7408244 |
Semiconductor package and stack arrangement thereof |
Aug. 5, 2008 |
| 7405474 |
Low cost thermally enhanced semiconductor package |
Jul. 29, 2008 |
| 7405475 |
Method and system of tape automated bonding |
Jul. 29, 2008 |
| 7402457 |
Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces |
Jul. 22, 2008 |
| 7402905 |
Methods of fabrication of wafer-level vacuum packaged devices |
Jul. 22, 2008 |
| 7388293 |
Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions |
Jun. 17, 2008 |
| 7387945 |
Semiconductor chip, semiconductor device and electronic equipment including warpage control film, and manufacturing method of same |
Jun. 17, 2008 |
| 7385288 |
Electronic packaging using conductive interproser connector |
Jun. 10, 2008 |
| 7339260 |
Wiring board providing impedance matching |
Mar. 4, 2008 |
| 7332799 |
Packaged chip having features for improved signal transmission on the package |
Feb. 19, 2008 |
| 7329947 |
Heat treatment jig for semiconductor substrate |
Feb. 12, 2008 |
| 7327018 |
Chip package structure, package substrate and manufacturing method thereof |
Feb. 5, 2008 |
| 7327019 |
Semiconductor device of a charge storage type |
Feb. 5, 2008 |
| 7317255 |
Reliable printed wiring board assembly employing packages with solder joints |
Jan. 8, 2008 |
| 7315086 |
Chip-on-board package having flip chip assembly structure and manufacturing method thereof |
Jan. 1, 2008 |
| 7312520 |
Interface module for connecting LSI packages, and LSI-incorporating apparatus |
Dec. 25, 2007 |
| 7309914 |
Inverted CSP stacking system and method |
Dec. 18, 2007 |
| 7304369 |
Integral charge storage basement and wideband embedded decoupling structure for integrated circuit |
Dec. 4, 2007 |
| 7301107 |
Semiconductor device having reduced intra-level and inter-level capacitance |
Nov. 27, 2007 |
| 7301228 |
Semiconductor device, method for manufacturing same and thin plate interconnect line member |
Nov. 27, 2007 |
| 7291922 |
Substrate with many via contact means disposed therein |
Nov. 6, 2007 |
| 7291912 |
Circuit board |
Nov. 6, 2007 |
| 7291906 |
Stack package and fabricating method thereof |
Nov. 6, 2007 |
| 7287320 |
Method for programming a routing layout design through one via layer |
Oct. 30, 2007 |
| 7282797 |
Graded liquid crystal polymer package |
Oct. 16, 2007 |
| 7282806 |
Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material |
Oct. 16, 2007 |
| 7276787 |
Silicon chip carrier with conductive through-vias and method for fabricating same |
Oct. 2, 2007 |
| 7265449 |
Tape circuit substrate, semiconductor chip package including the same, and liquid crystal display device including the semiconductor chip package |
Sep. 4, 2007 |
| 7253504 |
Integrated circuit package and method |
Aug. 7, 2007 |
| 7250673 |
Signal isolation in a package substrate |
Jul. 31, 2007 |
| 7247948 |
Semiconductor device and method for fabricating the semiconductor device |
Jul. 24, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7226653 |
Printed circuit board and method for producing a printed circuit board |
Jun. 5, 2007 |
| 7227179 |
Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
Jun. 5, 2007 |
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