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Class Information
Number: 257/701
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material
Description: Subject matter wherein the housing or package is made of an electrically insulating material.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7446383 |
Electronic device mountable onto a substrate using surface mount techniques, and method |
Nov. 4, 2008 |
| 7443020 |
Minimizing number of masks to be changed when changing existing connectivity in an integrated circuit |
Oct. 28, 2008 |
| 7436057 |
Elastomer interposer with voids in a compressive loading system |
Oct. 14, 2008 |
| 7432589 |
Semiconductor device |
Oct. 7, 2008 |
| 7432590 |
Ceramic package, assembled substrate, and manufacturing method therefor |
Oct. 7, 2008 |
| 7428255 |
Semiconductor laser |
Sep. 23, 2008 |
| 7425761 |
Method of manufacturing a dielectric film in a capacitor |
Sep. 16, 2008 |
| 7423333 |
Cerdip type of solid-state image sensing device, structure and method for gripping cerdip type of solid-state image sensing device |
Sep. 9, 2008 |
| 7423340 |
Semiconductor package free of substrate and fabrication method thereof |
Sep. 9, 2008 |
| 7417313 |
Method for manufacturing an adhesive substrate with a die-cavity sidewall |
Aug. 26, 2008 |
| 7413931 |
Semiconductor device manufacturing method |
Aug. 19, 2008 |
| 7411295 |
Circuit board, device mounting structure, device mounting method, and electronic apparatus |
Aug. 12, 2008 |
| 7408244 |
Semiconductor package and stack arrangement thereof |
Aug. 5, 2008 |
| 7408259 |
Sheet to form a protective film for chips |
Aug. 5, 2008 |
| 7402457 |
Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces |
Jul. 22, 2008 |
| 7402905 |
Methods of fabrication of wafer-level vacuum packaged devices |
Jul. 22, 2008 |
| 7402906 |
Enhanced die-down ball grid array and method for making the same |
Jul. 22, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7397125 |
Semiconductor device with bonding pad support structure |
Jul. 8, 2008 |
| 7397118 |
Ceramic chip-type electronic component and method of making the same |
Jul. 8, 2008 |
| 7397074 |
RF field heated diodes for providing thermally assisted switching to magnetic memory elements |
Jul. 8, 2008 |
| 7388293 |
Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions |
Jun. 17, 2008 |
| 7387945 |
Semiconductor chip, semiconductor device and electronic equipment including warpage control film, and manufacturing method of same |
Jun. 17, 2008 |
| 7385283 |
Three dimensional integrated circuit and method of making the same |
Jun. 10, 2008 |
| 7382056 |
Integrated passive devices |
Jun. 3, 2008 |
| 7372143 |
Printed circuit board including via contributing to superior characteristic impedance |
May. 13, 2008 |
| 7372145 |
Bonded assembly having improved adhesive bond strength |
May. 13, 2008 |
| 7372153 |
Integrated circuit package bond pad having plurality of conductive members |
May. 13, 2008 |
| 7365420 |
Semiconductor packages and methods for making and using same |
Apr. 29, 2008 |
| 7361991 |
Closed air gap interconnect structure |
Apr. 22, 2008 |
| 7355275 |
Chip package and fabricating method thereof |
Apr. 8, 2008 |
| 7352060 |
Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate |
Apr. 1, 2008 |
| 7352061 |
Flexible core for enhancement of package interconnect reliability |
Apr. 1, 2008 |
| 7345362 |
Electronic component and method for manufacturing the same |
Mar. 18, 2008 |
| 7339260 |
Wiring board providing impedance matching |
Mar. 4, 2008 |
| 7335981 |
Methods for creating electrophoretically insulated vias in semiconductive substrates |
Feb. 26, 2008 |
| 7335980 |
Hardmask for reliability of silicon based dielectrics |
Feb. 26, 2008 |
| 7332799 |
Packaged chip having features for improved signal transmission on the package |
Feb. 19, 2008 |
| 7327019 |
Semiconductor device of a charge storage type |
Feb. 5, 2008 |
| 7327032 |
Semiconductor package accomplishing fan-out structure through wire bonding |
Feb. 5, 2008 |
| 7327018 |
Chip package structure, package substrate and manufacturing method thereof |
Feb. 5, 2008 |
| 7321167 |
Flex tape architecture for integrated circuit signal ingress/egress |
Jan. 22, 2008 |
| 7317243 |
Encapsulated lead having step configuration |
Jan. 8, 2008 |
| 7317255 |
Reliable printed wiring board assembly employing packages with solder joints |
Jan. 8, 2008 |
| 7312523 |
Enhanced via structure for organic module performance |
Dec. 25, 2007 |
| 7312524 |
Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made |
Dec. 25, 2007 |
| 7312528 |
Semiconductor device having antenna connection electrodes |
Dec. 25, 2007 |
| 7309917 |
Multilayer board and a semiconductor device |
Dec. 18, 2007 |
| 7307003 |
Method of forming a multi-layer semiconductor structure incorporating a processing handle member |
Dec. 11, 2007 |
| 7307293 |
Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths |
Dec. 11, 2007 |
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