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Class Information
Number: 257/701
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material
Description: Subject matter wherein the housing or package is made of an electrically insulating material.

Sub-classes under this class:

Class Number Class Name Patents
257/704 Cap or lid 1,201
257/703 Composite ceramic, or single ceramic with metal 434
257/705 Of high thermal conductivity ceramic (e.g., beo) 266
257/702 Of insulating material other than ceramic 460
257/706 With heat sink 1,876

Patents under this class:

Patent Number Title Of Patent Date Issued
8710658 Under bump passive components in wafer level packaging Apr. 29, 2014
8710648 Wafer level packaging structure with large contact area and preparation method thereof Apr. 29, 2014
8704359 Method for manufacturing an electronic module and an electronic module Apr. 22, 2014
8686571 Bonding layer structure and method for wafer to wafer bonding Apr. 1, 2014
8680692 Carrier, semiconductor package and fabrication method thereof Mar. 25, 2014
8674509 Integrated circuit die assembly with heat spreader Mar. 18, 2014
8664759 Integrated circuit with heat conducting structures for localized thermal control Mar. 4, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8664750 Semiconductor substrate, package and device Mar. 4, 2014
8664047 Integrated circuit tampering protection and reverse engineering prevention coatings and methods Mar. 4, 2014
8659158 Thermally inkjettable acrylic dielectric ink formulation and process Feb. 25, 2014
8656740 Manufacturing method of glass-sealed package, and glass substrate Feb. 25, 2014
8653655 Semiconductor device and manufacturing method thereof Feb. 18, 2014
8642902 Surface mountable device Feb. 4, 2014
8642388 Method for manufacturing light emitting diodes including forming circuit structures with a connecting section Feb. 4, 2014
8637980 Adhesive applications using alkali silicate glass for electronics Jan. 28, 2014
8633595 Semiconductor device having groove-shaped via-hole Jan. 21, 2014
8633594 Semiconductor device having groove-shaped via-hole Jan. 21, 2014
8624382 Packaging substrate and method of fabricating the same Jan. 7, 2014
8618650 Flange package for a semiconductor device Dec. 31, 2013
8610265 Compliant core peripheral lead semiconductor test socket Dec. 17, 2013
8610145 Light emitting device Dec. 17, 2013
8609464 Method for shielding semiconductor device Dec. 17, 2013
8604605 Microelectronic assembly with multi-layer support structure Dec. 10, 2013
8602315 Molded chip card and method for manufacturing same Dec. 10, 2013
8581373 Tape package Nov. 12, 2013
8578591 Method for manufacturing a stacked device conductive path connectivity Nov. 12, 2013
8575761 Segmented supply rail configuration for a digital integrated circuit Nov. 5, 2013
8569892 Semiconductor device and manufacturing method thereof Oct. 29, 2013
8558371 Method for wafer level package and semiconductor device fabricated using the same Oct. 15, 2013
8552498 Semiconductor device and method for manufacturing the same Oct. 8, 2013
8546903 Ionic isolation ring Oct. 1, 2013
8545987 Thermal interface material with thin transfer film or metallization Oct. 1, 2013
8536696 Conductive pin attached to package substrate Sep. 17, 2013
8525341 Printed circuit board having different sub-core layers and semicondutor package comprising the same Sep. 3, 2013
8524534 Semiconductor device and manufacturing method thereof Sep. 3, 2013
8508412 Semiconductor package and semiconductor device Aug. 13, 2013
8508050 Wiring substrate, semiconductor device, and method for manufacturing wiring substrate Aug. 13, 2013
8508037 Bumpless build-up layer and laminated core hybrid structures and methods of assembling same Aug. 13, 2013
8508036 Ultra-thin near-hermetic package based on rainier Aug. 13, 2013
8497575 Semiconductor packaging system with an aligned interconnect and method of manufacture thereof Jul. 30, 2013
8487428 Method and system for providing a reliable semiconductor assembly Jul. 16, 2013
8476737 Environment-resistant module, micropackage and methods of manufacturing same Jul. 2, 2013
8467192 Method for producing a rollable web and a rollable web Jun. 18, 2013
8461676 Soldering relief method and semiconductor device employing same Jun. 11, 2013
8456000 Semiconductor module and an electronic system including the same Jun. 4, 2013
8450853 Semiconductor device and a method of manufacturing the same, and an electronic device May. 28, 2013
8450852 Wiring substrate May. 28, 2013
8446003 Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate May. 21, 2013
8435605 Flexible substrates having a thin-film barrier May. 7, 2013

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