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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
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Class Information
Number: 257/701
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material
Description: Subject matter wherein the housing or package is made of an electrically insulating material.


Sub-classes under this class:

Class Number Class Name Patents
257/704 Cap or lid 813
257/703 Composite ceramic, or single ceramic with metal 339
257/705 Of high thermal conductivity ceramic (e.g., beo) 216
257/702 Of insulating material other than ceramic 343
257/706 With heat sink 1,282


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Patent Number Title Of Patent Date Issued
7446383 Electronic device mountable onto a substrate using surface mount techniques, and method Nov. 4, 2008
7443020 Minimizing number of masks to be changed when changing existing connectivity in an integrated circuit Oct. 28, 2008
7436057 Elastomer interposer with voids in a compressive loading system Oct. 14, 2008
7432589 Semiconductor device Oct. 7, 2008
7432590 Ceramic package, assembled substrate, and manufacturing method therefor Oct. 7, 2008
7428255 Semiconductor laser Sep. 23, 2008
7425761 Method of manufacturing a dielectric film in a capacitor Sep. 16, 2008
7423333 Cerdip type of solid-state image sensing device, structure and method for gripping cerdip type of solid-state image sensing device Sep. 9, 2008
7423340 Semiconductor package free of substrate and fabrication method thereof Sep. 9, 2008
7417313 Method for manufacturing an adhesive substrate with a die-cavity sidewall Aug. 26, 2008
7413931 Semiconductor device manufacturing method Aug. 19, 2008
7411295 Circuit board, device mounting structure, device mounting method, and electronic apparatus Aug. 12, 2008
7408244 Semiconductor package and stack arrangement thereof Aug. 5, 2008
7408259 Sheet to form a protective film for chips Aug. 5, 2008
7402457 Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces Jul. 22, 2008
7402905 Methods of fabrication of wafer-level vacuum packaged devices Jul. 22, 2008
7402906 Enhanced die-down ball grid array and method for making the same Jul. 22, 2008
7400035 Semiconductor device having multilayer printed wiring board Jul. 15, 2008
7397125 Semiconductor device with bonding pad support structure Jul. 8, 2008
7397118 Ceramic chip-type electronic component and method of making the same Jul. 8, 2008
7397074 RF field heated diodes for providing thermally assisted switching to magnetic memory elements Jul. 8, 2008
7388293 Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions Jun. 17, 2008
7387945 Semiconductor chip, semiconductor device and electronic equipment including warpage control film, and manufacturing method of same Jun. 17, 2008
7385283 Three dimensional integrated circuit and method of making the same Jun. 10, 2008
7382056 Integrated passive devices Jun. 3, 2008
7372143 Printed circuit board including via contributing to superior characteristic impedance May. 13, 2008
7372145 Bonded assembly having improved adhesive bond strength May. 13, 2008
7372153 Integrated circuit package bond pad having plurality of conductive members May. 13, 2008
7365420 Semiconductor packages and methods for making and using same Apr. 29, 2008
7361991 Closed air gap interconnect structure Apr. 22, 2008
7355275 Chip package and fabricating method thereof Apr. 8, 2008
7352060 Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate Apr. 1, 2008
7352061 Flexible core for enhancement of package interconnect reliability Apr. 1, 2008
7345362 Electronic component and method for manufacturing the same Mar. 18, 2008
7339260 Wiring board providing impedance matching Mar. 4, 2008
7335981 Methods for creating electrophoretically insulated vias in semiconductive substrates Feb. 26, 2008
7335980 Hardmask for reliability of silicon based dielectrics Feb. 26, 2008
7332799 Packaged chip having features for improved signal transmission on the package Feb. 19, 2008
7327019 Semiconductor device of a charge storage type Feb. 5, 2008
7327032 Semiconductor package accomplishing fan-out structure through wire bonding Feb. 5, 2008
7327018 Chip package structure, package substrate and manufacturing method thereof Feb. 5, 2008
7321167 Flex tape architecture for integrated circuit signal ingress/egress Jan. 22, 2008
7317243 Encapsulated lead having step configuration Jan. 8, 2008
7317255 Reliable printed wiring board assembly employing packages with solder joints Jan. 8, 2008
7312523 Enhanced via structure for organic module performance Dec. 25, 2007
7312524 Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made Dec. 25, 2007
7312528 Semiconductor device having antenna connection electrodes Dec. 25, 2007
7309917 Multilayer board and a semiconductor device Dec. 18, 2007
7307003 Method of forming a multi-layer semiconductor structure incorporating a processing handle member Dec. 11, 2007
7307293 Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths Dec. 11, 2007

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