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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
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Class Information
Number: 257/701
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material
Description: Subject matter wherein the housing or package is made of an electrically insulating material.


Sub-classes under this class:

Class Number Class Name Patents
257/704 Cap or lid 874
257/703 Composite ceramic, or single ceramic with metal 353
257/705 Of high thermal conductivity ceramic (e.g., beo) 224
257/702 Of insulating material other than ceramic 357
257/706 With heat sink 1,385


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

Patent Number Title Of Patent Date Issued
7626266 Semiconductor integrated circuit device having a plurality of functional circuits with low power consumption Dec. 1, 2009
7622750 Optical device package and optical semiconductor device using the same Nov. 24, 2009
7619316 Semiconductor package and method for manufacturing the same Nov. 17, 2009
7615482 Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength Nov. 10, 2009
7615860 Rigid-flex printed circuit board with weakening structure Nov. 10, 2009
7615835 Package for semiconductor acceleration sensor Nov. 10, 2009
7595553 Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus Sep. 29, 2009
7595997 Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component Sep. 29, 2009
7592704 Etched interposer for integrated circuit devices Sep. 22, 2009
7582964 Semiconductor package having non-ceramic based window frame Sep. 1, 2009
7579684 Methods for packing microfeature devices and microfeature devices formed by such methods Aug. 25, 2009
7573135 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film Aug. 11, 2009
7567599 Semiconductor laser diode device with thermal conductive encapsulating resin and method for manufacturing the same Jul. 28, 2009
7566969 Semiconductor device with improved arrangement of a through-hole in a wiring substrate Jul. 28, 2009
7566964 Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures Jul. 28, 2009
7563651 Method of fabricating a substrate with a concave surface Jul. 21, 2009
7564131 Semiconductor package and method of making a semiconductor package Jul. 21, 2009
7557449 Flexible via design to improve reliability Jul. 7, 2009
7557455 System and apparatus that reduce corrosion of an integrated circuit through its bond pads Jul. 7, 2009
7554193 Semiconductor device Jun. 30, 2009
7550845 Ball grid array package with separated stiffener layer Jun. 23, 2009
7550830 Stacked semiconductor package having fan-out structure through wire bonding Jun. 23, 2009
7550319 Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof Jun. 23, 2009
7550321 Substrate having a functionally gradient coefficient of thermal expansion Jun. 23, 2009
7545029 Stack microelectronic assemblies Jun. 9, 2009
7545027 Wafer level package having redistribution interconnection layer and method of forming the same Jun. 9, 2009
7538417 Semiconductor device with signal line having decreased characteristic impedance May. 26, 2009
7534649 Thermoset polyimides for microelectronic applications May. 19, 2009
7535095 Printed wiring board and method for producing the same May. 19, 2009
7528467 IC substrate with over voltage protection function May. 5, 2009
7528478 Semiconductor devices having post passivation interconnections and a buffer layer May. 5, 2009
7525192 Printed circuit board with quartz crystal oscillator Apr. 28, 2009
7525188 Multilayer circuit board and production method for same Apr. 28, 2009
7525190 Printed wiring board with wiring pattern having narrow width portion Apr. 28, 2009
7521781 Integrated circuit package system with mold clamp line critical area having widened conductive traces Apr. 21, 2009
7518200 Semiconductor integrated circuit chip with a nano-structure-surface passivation film Apr. 14, 2009
7518232 Plasma display panel Apr. 14, 2009
7514781 Circuit substrate and manufacturing method thereof Apr. 7, 2009
7511365 Thermal enhanced low profile package structure Mar. 31, 2009
7511368 Carrier device for electronic chip Mar. 31, 2009
7508072 Semiconductor device with pad electrode for testing and manufacturing method of the same Mar. 24, 2009
7508067 Semiconductor insulation structure Mar. 24, 2009
7504670 Sealing structure for mounting a semiconductor device to a substrate Mar. 17, 2009
7504735 Manufacturing method of resin-molding type semiconductor device, and wiring board therefor Mar. 17, 2009
7501695 High frequency integrated circuit (HFIC) microsystems assembly and method for fabricating the same Mar. 10, 2009
7501701 Rewiring substrate strip having a plurality of semiconductor component positions Mar. 10, 2009
7498670 Semiconductor structures having electrophoretically insulated vias Mar. 3, 2009
7495337 Dual-gate device and method Feb. 24, 2009
7489032 Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same Feb. 10, 2009
7489036 Thin-film device Feb. 10, 2009

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