 |
|
 |
| |
 |
|
Class Information
Number: 257/701
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > Insulating material
Description: Subject matter wherein the housing or package is made of an electrically insulating material.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7626266 |
Semiconductor integrated circuit device having a plurality of functional circuits with low power consumption |
Dec. 1, 2009 |
| 7622750 |
Optical device package and optical semiconductor device using the same |
Nov. 24, 2009 |
| 7619316 |
Semiconductor package and method for manufacturing the same |
Nov. 17, 2009 |
| 7615482 |
Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength |
Nov. 10, 2009 |
| 7615860 |
Rigid-flex printed circuit board with weakening structure |
Nov. 10, 2009 |
| 7615835 |
Package for semiconductor acceleration sensor |
Nov. 10, 2009 |
| 7595553 |
Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus |
Sep. 29, 2009 |
| 7595997 |
Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component |
Sep. 29, 2009 |
| 7592704 |
Etched interposer for integrated circuit devices |
Sep. 22, 2009 |
| 7582964 |
Semiconductor package having non-ceramic based window frame |
Sep. 1, 2009 |
| 7579684 |
Methods for packing microfeature devices and microfeature devices formed by such methods |
Aug. 25, 2009 |
| 7573135 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
Aug. 11, 2009 |
| 7567599 |
Semiconductor laser diode device with thermal conductive encapsulating resin and method for manufacturing the same |
Jul. 28, 2009 |
| 7566969 |
Semiconductor device with improved arrangement of a through-hole in a wiring substrate |
Jul. 28, 2009 |
| 7566964 |
Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures |
Jul. 28, 2009 |
| 7563651 |
Method of fabricating a substrate with a concave surface |
Jul. 21, 2009 |
| 7564131 |
Semiconductor package and method of making a semiconductor package |
Jul. 21, 2009 |
| 7557449 |
Flexible via design to improve reliability |
Jul. 7, 2009 |
| 7557455 |
System and apparatus that reduce corrosion of an integrated circuit through its bond pads |
Jul. 7, 2009 |
| 7554193 |
Semiconductor device |
Jun. 30, 2009 |
| 7550845 |
Ball grid array package with separated stiffener layer |
Jun. 23, 2009 |
| 7550830 |
Stacked semiconductor package having fan-out structure through wire bonding |
Jun. 23, 2009 |
| 7550319 |
Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof |
Jun. 23, 2009 |
| 7550321 |
Substrate having a functionally gradient coefficient of thermal expansion |
Jun. 23, 2009 |
| 7545029 |
Stack microelectronic assemblies |
Jun. 9, 2009 |
| 7545027 |
Wafer level package having redistribution interconnection layer and method of forming the same |
Jun. 9, 2009 |
| 7538417 |
Semiconductor device with signal line having decreased characteristic impedance |
May. 26, 2009 |
| 7534649 |
Thermoset polyimides for microelectronic applications |
May. 19, 2009 |
| 7535095 |
Printed wiring board and method for producing the same |
May. 19, 2009 |
| 7528467 |
IC substrate with over voltage protection function |
May. 5, 2009 |
| 7528478 |
Semiconductor devices having post passivation interconnections and a buffer layer |
May. 5, 2009 |
| 7525192 |
Printed circuit board with quartz crystal oscillator |
Apr. 28, 2009 |
| 7525188 |
Multilayer circuit board and production method for same |
Apr. 28, 2009 |
| 7525190 |
Printed wiring board with wiring pattern having narrow width portion |
Apr. 28, 2009 |
| 7521781 |
Integrated circuit package system with mold clamp line critical area having widened conductive traces |
Apr. 21, 2009 |
| 7518200 |
Semiconductor integrated circuit chip with a nano-structure-surface passivation film |
Apr. 14, 2009 |
| 7518232 |
Plasma display panel |
Apr. 14, 2009 |
| 7514781 |
Circuit substrate and manufacturing method thereof |
Apr. 7, 2009 |
| 7511365 |
Thermal enhanced low profile package structure |
Mar. 31, 2009 |
| 7511368 |
Carrier device for electronic chip |
Mar. 31, 2009 |
| 7508072 |
Semiconductor device with pad electrode for testing and manufacturing method of the same |
Mar. 24, 2009 |
| 7508067 |
Semiconductor insulation structure |
Mar. 24, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7504735 |
Manufacturing method of resin-molding type semiconductor device, and wiring board therefor |
Mar. 17, 2009 |
| 7501695 |
High frequency integrated circuit (HFIC) microsystems assembly and method for fabricating the same |
Mar. 10, 2009 |
| 7501701 |
Rewiring substrate strip having a plurality of semiconductor component positions |
Mar. 10, 2009 |
| 7498670 |
Semiconductor structures having electrophoretically insulated vias |
Mar. 3, 2009 |
| 7495337 |
Dual-gate device and method |
Feb. 24, 2009 |
| 7489032 |
Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same |
Feb. 10, 2009 |
| 7489036 |
Thin-film device |
Feb. 10, 2009 |
|
|
|
 |
|
 |
|
| |
Randomly Featured Patents |
|
