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Class Information
Number: 257/700
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package)
Description: Subject matter wherein the housing or package combined with a contact or lead structure is in the form of a multiple layered insulating composite with plural electrical connection layers located between layers of insulator material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459791 |
Post passivation interconnection schemes on top of IC chip |
Dec. 2, 2008 |
| 7459790 |
Post passivation interconnection schemes on top of the IC chips |
Dec. 2, 2008 |
| 7459781 |
Fan out type wafer level package structure and method of the same |
Dec. 2, 2008 |
| 7459385 |
Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler |
Dec. 2, 2008 |
| 7453144 |
Thin film capacitors and methods of making the same |
Nov. 18, 2008 |
| 7453143 |
High speed electronics interconnect and method of manufacture |
Nov. 18, 2008 |
| 7449773 |
Microelectromechanical device packages with integral heaters |
Nov. 11, 2008 |
| 7449772 |
Chip-type electronic component including thin-film circuit elements |
Nov. 11, 2008 |
| 7446404 |
Three-dimensional package and method of making the same |
Nov. 4, 2008 |
| 7443035 |
Method of forming a penetration electrode and substrate having a penetration electrode |
Oct. 28, 2008 |
| 7443034 |
Post passivation interconnection schemes on top of the IC chips |
Oct. 28, 2008 |
| 7443033 |
Post passivation interconnection schemes on top of the IC chips |
Oct. 28, 2008 |
| 7443021 |
Electronic component packaging structure and method for producing the same |
Oct. 28, 2008 |
| 7443020 |
Minimizing number of masks to be changed when changing existing connectivity in an integrated circuit |
Oct. 28, 2008 |
| 7442626 |
Rectangular contact used as a low voltage fuse element |
Oct. 28, 2008 |
| 7439627 |
Post passivation interconnection schemes on top of the IC chips |
Oct. 21, 2008 |
| 7439626 |
Post passivation interconnection schemes on top of IC chip |
Oct. 21, 2008 |
| 7439615 |
Semiconductor component comprising an integrated semiconductor chip and a chip housing, and electronic device |
Oct. 21, 2008 |
| 7439614 |
Circuit device with dummy elements |
Oct. 21, 2008 |
| 7429793 |
Semiconductor device having an electronic circuit disposed therein |
Sep. 30, 2008 |
| 7425759 |
Semiconductor chip assembly with bumped terminal and filler |
Sep. 16, 2008 |
| 7423332 |
Vertical laminated electrical switch circuit |
Sep. 9, 2008 |
| 7420272 |
Two-sided wafer escape package |
Sep. 2, 2008 |
| 7417317 |
Post passivation interconnection schemes on top of the IC chips |
Aug. 26, 2008 |
| 7414309 |
Encapsulated electronic part packaging structure |
Aug. 19, 2008 |
| 7414306 |
Preamplifier integrated circuit on flex circuit for magnetic media storing devices |
Aug. 19, 2008 |
| 7411295 |
Circuit board, device mounting structure, device mounting method, and electronic apparatus |
Aug. 12, 2008 |
| 7411289 |
Integrated circuit package with partially exposed contact pads and process for fabricating the same |
Aug. 12, 2008 |
| 7411228 |
Integrated circuit chip and manufacturing process thereof |
Aug. 12, 2008 |
| 7410837 |
Method of manufacturing mounting substrate |
Aug. 12, 2008 |
| 7405474 |
Low cost thermally enhanced semiconductor package |
Jul. 29, 2008 |
| 7402442 |
Physically highly secure multi-chip assembly |
Jul. 22, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7397125 |
Semiconductor device with bonding pad support structure |
Jul. 8, 2008 |
| 7397118 |
Ceramic chip-type electronic component and method of making the same |
Jul. 8, 2008 |
| 7397117 |
Chip package with die and substrate |
Jul. 8, 2008 |
| 7397103 |
Semiconductor with damage detection circuitry |
Jul. 8, 2008 |
| 7394156 |
Semiconductor integrated circuit device and method of producing the same |
Jul. 1, 2008 |
| 7391116 |
Fretting and whisker resistant coating system and method |
Jun. 24, 2008 |
| 7391114 |
Electrode pad section for external connection |
Jun. 24, 2008 |
| 7391110 |
Apparatus for providing capacitive decoupling between on-die power and ground conductors |
Jun. 24, 2008 |
| 7382052 |
Post passivation interconnection schemes on top of IC chip |
Jun. 3, 2008 |
| 7380994 |
Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers |
Jun. 3, 2008 |
| 7378745 |
Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns |
May. 27, 2008 |
| 7378729 |
Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom |
May. 27, 2008 |
| 7378616 |
Heating apparatus and method for semiconductor devices |
May. 27, 2008 |
| 7375412 |
iTFC with optimized C(T) |
May. 20, 2008 |
| 7375411 |
Method and structure for forming relatively dense conductive layers |
May. 20, 2008 |
| 7375022 |
Method of manufacturing wiring board |
May. 20, 2008 |
| 7372161 |
Post passivation interconnection schemes on top of the IC chips |
May. 13, 2008 |
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