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Class Information
Number: 257/700
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package)
Description: Subject matter wherein the housing or package combined with a contact or lead structure is in the form of a multiple layered insulating composite with plural electrical connection layers located between layers of insulator material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619316 |
Semiconductor package and method for manufacturing the same |
Nov. 17, 2009 |
| 7615411 |
Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof |
Nov. 10, 2009 |
| 7607560 |
Semiconductor die attachment for high vacuum tubes |
Oct. 27, 2009 |
| 7605464 |
Semiconductor device |
Oct. 20, 2009 |
| 7605463 |
Interposer and method for producing the same and electronic device |
Oct. 20, 2009 |
| 7605460 |
Method and apparatus for a power distribution system |
Oct. 20, 2009 |
| 7605075 |
Multilayer circuit board and method of manufacturing the same |
Oct. 20, 2009 |
| 7598609 |
Structure of polymer-matrix conductive film and method for fabricating the same |
Oct. 6, 2009 |
| 7595997 |
Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component |
Sep. 29, 2009 |
| 7595268 |
Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same |
Sep. 29, 2009 |
| 7589424 |
Thin silicon based substrate |
Sep. 15, 2009 |
| 7589416 |
Substrate, electronic component, and manufacturing method of these |
Sep. 15, 2009 |
| RE40887 |
Semiconductor chip with redistribution metal layer |
Sep. 1, 2009 |
| 7582973 |
Flip-chip type assembly |
Sep. 1, 2009 |
| 7582964 |
Semiconductor package having non-ceramic based window frame |
Sep. 1, 2009 |
| 7582961 |
Package structure with circuits directly connected to semiconductor chip |
Sep. 1, 2009 |
| 7576424 |
Semiconductor device |
Aug. 18, 2009 |
| 7573135 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
Aug. 11, 2009 |
| 7572681 |
Embedded electronic component package |
Aug. 11, 2009 |
| 7569925 |
Module with built-in component |
Aug. 4, 2009 |
| 7569924 |
Semiconductor device and manufacturing method thereof |
Aug. 4, 2009 |
| 7566969 |
Semiconductor device with improved arrangement of a through-hole in a wiring substrate |
Jul. 28, 2009 |
| 7566960 |
Interposing structure |
Jul. 28, 2009 |
| 7564131 |
Semiconductor package and method of making a semiconductor package |
Jul. 21, 2009 |
| 7560810 |
Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
Jul. 14, 2009 |
| 7557455 |
System and apparatus that reduce corrosion of an integrated circuit through its bond pads |
Jul. 7, 2009 |
| 7557449 |
Flexible via design to improve reliability |
Jul. 7, 2009 |
| 7557440 |
Wiring board and ceramic chip to be embedded |
Jul. 7, 2009 |
| 7554176 |
Integrated circuits having a multi-layer structure with a seal ring |
Jun. 30, 2009 |
| 7550847 |
Packaged microelectronic devices and methods for packaging microelectronic devices |
Jun. 23, 2009 |
| 7550830 |
Stacked semiconductor package having fan-out structure through wire bonding |
Jun. 23, 2009 |
| 7547957 |
Thin film capacitors and methods of making the same |
Jun. 16, 2009 |
| 7545663 |
Semiconductor storage device |
Jun. 9, 2009 |
| 7541670 |
Semiconductor device having terminals |
Jun. 2, 2009 |
| 7541278 |
Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment |
Jun. 2, 2009 |
| 7538415 |
Semiconductor chip assembly with bumped terminal, filler and insulative base |
May. 26, 2009 |
| 7535106 |
Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate |
May. 19, 2009 |
| 7535094 |
Substrate structure, a method and an arrangement for producing such substrate structure |
May. 19, 2009 |
| 7528480 |
Circuit board, semiconductor device, and manufacturing method of circuit board |
May. 5, 2009 |
| 7528479 |
Multilayer substrate for digital tuner and multilayer substrate |
May. 5, 2009 |
| 7528478 |
Semiconductor devices having post passivation interconnections and a buffer layer |
May. 5, 2009 |
| 7528467 |
IC substrate with over voltage protection function |
May. 5, 2009 |
| 7525190 |
Printed wiring board with wiring pattern having narrow width portion |
Apr. 28, 2009 |
| 7525189 |
Semiconductor device, wiring board, and manufacturing method thereof |
Apr. 28, 2009 |
| 7521805 |
Post passivation interconnection schemes on top of the IC chips |
Apr. 21, 2009 |
| 7521796 |
Method of making the semiconductor device, circuit board, and electronic instrument |
Apr. 21, 2009 |
| 7521795 |
Semiconductor package |
Apr. 21, 2009 |
| 7521781 |
Integrated circuit package system with mold clamp line critical area having widened conductive traces |
Apr. 21, 2009 |
| 7518232 |
Plasma display panel |
Apr. 14, 2009 |
| 7518231 |
Differential chip performance within a multi-chip package |
Apr. 14, 2009 |
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