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Browse by Category: Main > Physics
Class Information
Number: 257/700
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package)
Description: Subject matter wherein the housing or package combined with a contact or lead structure is in the form of a multiple layered insulating composite with plural electrical connection layers located between layers of insulator material.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710658 Under bump passive components in wafer level packaging Apr. 29, 2014
8710649 Wafer level package and fabrication method Apr. 29, 2014
8710514 Power surface mount light emitting die package Apr. 29, 2014
8704359 Method for manufacturing an electronic module and an electronic module Apr. 22, 2014
8703542 Wafer-level packaging mechanisms Apr. 22, 2014
8693203 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices Apr. 8, 2014
8686571 Bonding layer structure and method for wafer to wafer bonding Apr. 1, 2014
8686554 Vertically mountable semiconductor device package Apr. 1, 2014
8685796 Electronic device and method of manufacturing the same Apr. 1, 2014
8665605 Substrate structure and package structure using the same Mar. 4, 2014
8664768 Interposer having a defined through via pattern Mar. 4, 2014
8664750 Semiconductor substrate, package and device Mar. 4, 2014
8664113 Multilayer interconnect structure and method for integrated circuits Mar. 4, 2014
8664044 Method of fabricating land grid array semiconductor package Mar. 4, 2014
8658473 Ultrathin buried die module and method of manufacturing thereof Feb. 25, 2014
8653662 Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits Feb. 18, 2014
8643168 Integrated circuit package with input capacitance compensation Feb. 4, 2014
8638567 Circuit manufacturing and design techniques for reference plane voids with strip segment Jan. 28, 2014
8633595 Semiconductor device having groove-shaped via-hole Jan. 21, 2014
8633594 Semiconductor device having groove-shaped via-hole Jan. 21, 2014
8633584 Electronic assembly with electronic compontent and interconnection assembly connected via conductive bump and mating well Jan. 21, 2014
8629556 Semiconductor device Jan. 14, 2014
8624701 Assembled circuit and electronic component Jan. 7, 2014
8624375 Semiconductor package for selecting semiconductor chip from a chip stack Jan. 7, 2014
8624374 Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof Jan. 7, 2014
8618652 Forming functionalized carrier structures with coreless packages Dec. 31, 2013
8614502 Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device Dec. 24, 2013
8604621 Semiconductor device and information processing system including the same Dec. 10, 2013
8598699 Semiconductor device having a ground metal layer through which at least one hole is formed, and a ground patch disposed in the at least one hole Dec. 3, 2013
8598465 Hermetic circuit ring for BCB WSA circuits Dec. 3, 2013
8592691 Printed wiring board Nov. 26, 2013
8587116 Semiconductor module comprising an insert Nov. 19, 2013
8587105 Semiconductor device Nov. 19, 2013
8581389 Uniformity control for IC passivation structure Nov. 12, 2013
8581388 Multilayered wiring substrate Nov. 12, 2013
8575761 Segmented supply rail configuration for a digital integrated circuit Nov. 5, 2013
8569880 Multilayer printed wiring board Oct. 29, 2013
8569790 Light emitting diode package having interconnection structures Oct. 29, 2013
8569142 Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same Oct. 29, 2013
8564118 Power module substrate, power module, and method for manufacturing power module substrate Oct. 22, 2013
8558359 Semiconductor package having lead frames Oct. 15, 2013
8552549 Semiconductor device, and inspection method thereof Oct. 8, 2013
8546922 Wiring board Oct. 1, 2013
8546921 Hybrid multilayer substrate Oct. 1, 2013
8536695 Chip-last embedded interconnect structures Sep. 17, 2013
8531022 Routable array metal integrated circuit package Sep. 10, 2013
8525341 Printed circuit board having different sub-core layers and semicondutor package comprising the same Sep. 3, 2013
8525336 Semiconductor package and method of fabricating the same Sep. 3, 2013
8525322 Semiconductor package having a plurality of input/output members Sep. 3, 2013
8525247 Non-volatile memory device having variable resistance element Sep. 3, 2013











 
 
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