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Class Information
Number: 257/699
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With specific electrical feedthrough structure > Housing entirely of metal except for feedthrough structure
Description: Subject matter under 698 wherein the housing or package is made entirely of metal except for the portion wherein the electrical contacts or leads are fed through.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7598610 |
Plate structure having chip embedded therein and the manufacturing method of the same |
Oct. 6, 2009 |
| 7595540 |
Semiconductor device and method of manufacturing the same |
Sep. 29, 2009 |
| 7576423 |
Semiconductor device |
Aug. 18, 2009 |
| 7521789 |
Electrical assembly having heat sink protrusions |
Apr. 21, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7478474 |
Method of manufacturing shielded electronic circuit units |
Jan. 20, 2009 |
| 7411288 |
Semiconductor device |
Aug. 12, 2008 |
| 7408258 |
Interconnection circuit and electronic module utilizing same |
Aug. 5, 2008 |
| 7298046 |
Semiconductor package having non-ceramic based window frame |
Nov. 20, 2007 |
| 7247938 |
Carrier, method of manufacturing a carrier and an electronic device |
Jul. 24, 2007 |
| 7244965 |
Power surface mount light emitting die package |
Jul. 17, 2007 |
| 7242085 |
Semiconductor device including a semiconductor chip mounted on a metal base |
Jul. 10, 2007 |
| 7239024 |
Semiconductor package with recess for die |
Jul. 3, 2007 |
| 7221048 |
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier |
May. 22, 2007 |
| 7205645 |
Wiring board, semiconductor device, and method of manufacturing wiring board |
Apr. 17, 2007 |
| 7205648 |
Flip-chip light emitting diode package structure |
Apr. 17, 2007 |
| 7081661 |
High-frequency module and method for manufacturing the same |
Jul. 25, 2006 |
| 7067912 |
Wired circuit board |
Jun. 27, 2006 |
| 7061096 |
Multi-surface IC packaging structures and methods for their manufacture |
Jun. 13, 2006 |
| 7012192 |
Feedthrough terminal assembly with lead wire bonding pad for human implant applications |
Mar. 14, 2006 |
| 6982486 |
Cavity ball grid array apparatus having improved inductance characteristics and method of fabricating the same |
Jan. 3, 2006 |
| 6967390 |
Electronic component and method of manufacturing same |
Nov. 22, 2005 |
| 6917099 |
Die carrier with fluid chamber |
Jul. 12, 2005 |
| 6891258 |
Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit |
May. 10, 2005 |
| 6882040 |
Semiconductor device |
Apr. 19, 2005 |
| 6879033 |
Semiconductor device |
Apr. 12, 2005 |
| 6864424 |
Electronic component and package |
Mar. 8, 2005 |
| 6853066 |
Semiconductor device |
Feb. 8, 2005 |
| 6809407 |
Semiconductor device |
Oct. 26, 2004 |
| 6806561 |
Electronic apparatus |
Oct. 19, 2004 |
| 6791178 |
Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices |
Sep. 14, 2004 |
| 6784522 |
Electronic semiconductor device having a thermal spreader |
Aug. 31, 2004 |
| 6777792 |
Semiconductor device and package with high heat radiation effect |
Aug. 17, 2004 |
| 6753600 |
Structure of a substrate for a high density semiconductor package |
Jun. 22, 2004 |
| 6740971 |
Cavity ball grid array apparatus having improved inductance characteristics |
May. 25, 2004 |
| 6700182 |
Thermally conductive substrate, thermally conductive substrate manufacturing method and power module |
Mar. 2, 2004 |
| 6677669 |
Semiconductor package including two semiconductor die disposed within a common clip |
Jan. 13, 2004 |
| 6664622 |
Header for electronic components board in surface mount and through-hole assemble |
Dec. 16, 2003 |
| 6653916 |
Microwave monolithic integrated circuit (MMIC) carrier interface |
Nov. 25, 2003 |
| 6586833 |
Packaged power devices having vertical power mosfets therein that are flip-chip mounted to slotted gate electrode strip lines |
Jul. 1, 2003 |
| 6566742 |
Structure for mounting components |
May. 20, 2003 |
| 6559529 |
Press-fit diode for universal mounting |
May. 6, 2003 |
| 6555903 |
Package structure of hybrid device in optical signal transmitter |
Apr. 29, 2003 |
| 6528867 |
Integrated circuit devices including connection components mechanically and electrically attached to semiconductor dice |
Mar. 4, 2003 |
| 6498294 |
Package for high frequency device |
Dec. 24, 2002 |
| 6483184 |
Semiconductor apparatus substrate, semiconductor apparatus, and method of manufacturing thereof and electronic apparatus |
Nov. 19, 2002 |
| 6479889 |
Semiconductor device package, and fabrication method thereof |
Nov. 12, 2002 |
| 6472724 |
Electronic device structure capable of preventing malfunction caused by electromagnetic wave coming from outside |
Oct. 29, 2002 |
| 6455929 |
Embedded type package of power semiconductor device |
Sep. 24, 2002 |
| 6452261 |
Flat semiconductor device and power converter employing the same |
Sep. 17, 2002 |
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