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Class Information
Number: 257/698
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With specific electrical feedthrough structure
Description: Subject matter wherein a specific structure is provided for feeding electrical contacts or leads into or out of the housing or package.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459796 |
BGA-type multilayer circuit wiring board |
Dec. 2, 2008 |
| 7459781 |
Fan out type wafer level package structure and method of the same |
Dec. 2, 2008 |
| 7459340 |
Semiconductor device and manufacturing method thereof |
Dec. 2, 2008 |
| 7453141 |
Semiconductor device package, method of manufacturing the same, and semiconductor device |
Nov. 18, 2008 |
| 7453140 |
Semiconductor chip assembly with laterally aligned filler and insulative base |
Nov. 18, 2008 |
| 7449772 |
Chip-type electronic component including thin-film circuit elements |
Nov. 11, 2008 |
| 7446400 |
Chip package structure and fabricating method thereof |
Nov. 4, 2008 |
| 7443018 |
Integrated circuit package system including ribbon bond interconnect |
Oct. 28, 2008 |
| 7436062 |
Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method |
Oct. 14, 2008 |
| 7436056 |
Electronic component package |
Oct. 14, 2008 |
| 7432585 |
Semiconductor device electronic component, circuit board, and electronic device |
Oct. 7, 2008 |
| 7425760 |
Multi-chip module structure with power delivery using flexible cables |
Sep. 16, 2008 |
| 7425758 |
Metal core foldover package structures |
Sep. 16, 2008 |
| 7420286 |
Reduced inductance in ball grid array packages |
Sep. 2, 2008 |
| 7420270 |
Tape wiring substrate and chip-on-film package using the same |
Sep. 2, 2008 |
| 7417198 |
Radiofrequency power semiconductor module with cavity housing, and method for producing it |
Aug. 26, 2008 |
| 7414306 |
Preamplifier integrated circuit on flex circuit for magnetic media storing devices |
Aug. 19, 2008 |
| 7414301 |
Printed circuit board with soldering lands |
Aug. 19, 2008 |
| 7411179 |
Photodetector module with impedance matching |
Aug. 12, 2008 |
| 7408258 |
Interconnection circuit and electronic module utilizing same |
Aug. 5, 2008 |
| 7408257 |
Packaging chip and packaging method thereof |
Aug. 5, 2008 |
| 7408252 |
Semiconductor device and a manufacturing method of the same |
Aug. 5, 2008 |
| 7408249 |
Packaged integrated circuits and methods of producing thereof |
Aug. 5, 2008 |
| 7405474 |
Low cost thermally enhanced semiconductor package |
Jul. 29, 2008 |
| 7405473 |
Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing |
Jul. 29, 2008 |
| 7405470 |
Adaptable electronic storage apparatus |
Jul. 29, 2008 |
| 7402904 |
Semiconductor device having wires that vary in wiring pitch |
Jul. 22, 2008 |
| 7402903 |
Semiconductor device |
Jul. 22, 2008 |
| 7400213 |
System and method for configuring conductors within an integrated circuit to reduce impedance variation caused by connection bumps |
Jul. 15, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7400032 |
Module assembly for stacked BGA packages |
Jul. 15, 2008 |
| 7399990 |
Wafer-level package having test terminal |
Jul. 15, 2008 |
| 7399661 |
Method for making an integrated circuit substrate having embedded back-side access conductors and vias |
Jul. 15, 2008 |
| 7397128 |
Semiconductor device and method of manufacturing the same |
Jul. 8, 2008 |
| 7394028 |
Flexible circuit substrate for flip-chip-on-flex applications |
Jul. 1, 2008 |
| 7391110 |
Apparatus for providing capacitive decoupling between on-die power and ground conductors |
Jun. 24, 2008 |
| 7391100 |
Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area |
Jun. 24, 2008 |
| 7388293 |
Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions |
Jun. 17, 2008 |
| 7385283 |
Three dimensional integrated circuit and method of making the same |
Jun. 10, 2008 |
| 7381591 |
Flip-chip adaptor package for bare die |
Jun. 3, 2008 |
| 7375421 |
High density multilayer circuit module |
May. 20, 2008 |
| 7372153 |
Integrated circuit package bond pad having plurality of conductive members |
May. 13, 2008 |
| 7372143 |
Printed circuit board including via contributing to superior characteristic impedance |
May. 13, 2008 |
| 7368819 |
Multilayer printed wiring board and multilayer printed circuit board |
May. 6, 2008 |
| 7368813 |
Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, an |
May. 6, 2008 |
| 7368319 |
Stacked integrated circuit package-in-package system |
May. 6, 2008 |
| 7365440 |
Semiconductor device and fabrication method thereof |
Apr. 29, 2008 |
| 7361984 |
Chip package structure |
Apr. 22, 2008 |
| 7361983 |
Semiconductor device and semiconductor assembly module with a gap-controlling lead structure |
Apr. 22, 2008 |
| 7358603 |
High density electronic packages |
Apr. 15, 2008 |
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