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Class Information
Number: 257/698
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With specific electrical feedthrough structure
Description: Subject matter wherein a specific structure is provided for feeding electrical contacts or leads into or out of the housing or package.










Sub-classes under this class:

Class Number Class Name Patents
257/699 Housing entirely of metal except for feedthrough structure 145


Patents under this class:

Patent Number Title Of Patent Date Issued
8710652 Embedded package and method for manufacturing the same Apr. 29, 2014
8710648 Wafer level packaging structure with large contact area and preparation method thereof Apr. 29, 2014
8710647 Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering Apr. 29, 2014
8704358 Method for forming an integrated circuit Apr. 22, 2014
8704357 Semiconductor device and power supply unit utilizing the same Apr. 22, 2014
8703518 Packaged microelectronic imagers and methods of packaging microelectronic imagers Apr. 22, 2014
8681510 Circuit board Mar. 25, 2014
8680691 Semiconductor device having semiconductor member and mounting member Mar. 25, 2014
8680652 Stack package Mar. 25, 2014
8669665 Flip-chip mounting substrate and flip-chip mounting method Mar. 11, 2014
8664764 Semiconductor device including a core substrate and a semiconductor element Mar. 4, 2014
8664761 Semiconductor structure and manufacturing method of the same Mar. 4, 2014
8659143 Stub minimization for wirebond assemblies without windows Feb. 25, 2014
8659142 Stub minimization for wirebond assemblies without windows Feb. 25, 2014
8659141 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Feb. 25, 2014
8659140 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Feb. 25, 2014
8659139 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Feb. 25, 2014
8659019 Semiconductor device Feb. 25, 2014
8653649 Device housing package and mounting structure Feb. 18, 2014
8653648 Zigzag pattern for TSV copper adhesion Feb. 18, 2014
8653645 Semiconductor device comprising stacked LSI having circuit blocks connected by power supply and signal line through vias Feb. 18, 2014
8653644 Packaged semiconductor chips with array Feb. 18, 2014
8653636 Contactless communication medium Feb. 18, 2014
8648459 Nitride based semiconductor package and method of manufacturing the same and bonding substrate Feb. 11, 2014
8643189 Packaged semiconductor die with power rail pads Feb. 4, 2014
8643184 Crosstalk polarity reversal and cancellation through substrate material tuning Feb. 4, 2014
8643167 Semiconductor package with through silicon vias and method for making the same Feb. 4, 2014
8643165 Semiconductor device having agglomerate terminals Feb. 4, 2014
8637972 Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel Jan. 28, 2014
8637397 Method for manufacturing a through hole electrode substrate Jan. 28, 2014
8633583 Semiconductor package substrate and methods for forming same, in particular for MEMS devices Jan. 21, 2014
8629563 Method for packaging semiconductor dies having through-silicon vias Jan. 14, 2014
8629547 Semiconductor chip package Jan. 14, 2014
8629060 Methods of forming through substrate interconnects Jan. 14, 2014
8624701 Assembled circuit and electronic component Jan. 7, 2014
8624383 Integrated circuit package and method for fabrication thereof Jan. 7, 2014
8624381 Integrated antennas in wafer level package Jan. 7, 2014
8618651 Buried TSVs used for decaps Dec. 31, 2013
8614502 Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device Dec. 24, 2013
8610261 Power semiconductor device Dec. 17, 2013
8610257 Semiconductor device and method for producing such a device Dec. 17, 2013
8610161 Light emitting diode optical emitter with transparent electrical connectors Dec. 17, 2013
8604619 Through silicon via keep out zone formation along different crystal orientations Dec. 10, 2013
8604604 Conductive interconnects Dec. 10, 2013
8604603 Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers Dec. 10, 2013
8604594 Structures for preventing cross-talk between through-silicon vias and integrated circuits Dec. 10, 2013
8604491 Wafer level photonic device die structure and method of making the same Dec. 10, 2013
8598709 Method and system for routing electrical connections of semiconductor chips Dec. 3, 2013
8598698 Package substrate with an embedded stiffener Dec. 3, 2013
8598692 Semiconductor device and method for manufacturing same Dec. 3, 2013











 
 
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