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Class Information
Number: 257/698
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With specific electrical feedthrough structure
Description: Subject matter wherein a specific structure is provided for feeding electrical contacts or leads into or out of the housing or package.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615870 |
Semiconductor device, manufacturing method thereof, and connection method of circuit board |
Nov. 10, 2009 |
| 7615852 |
Semiconductor component in a housing with mechanically inforcing flat conductor webs |
Nov. 10, 2009 |
| 7615842 |
Inductor integrated chip |
Nov. 10, 2009 |
| 7615406 |
Electronic device package manufacturing method and electronic device package |
Nov. 10, 2009 |
| 7612457 |
Semiconductor device including a stress buffer |
Nov. 3, 2009 |
| 7612441 |
Image-sensing chip package module adapted to dual-side soldering |
Nov. 3, 2009 |
| 7612439 |
Semiconductor package having improved thermal performance |
Nov. 3, 2009 |
| 7612333 |
Imaging apparatus and photoelectric conversion element package retaining unit |
Nov. 3, 2009 |
| 7608863 |
Submount assembly and method of preparing optical module |
Oct. 27, 2009 |
| 7608789 |
Component arrangement provided with a carrier substrate |
Oct. 27, 2009 |
| 7605463 |
Interposer and method for producing the same and electronic device |
Oct. 20, 2009 |
| 7605462 |
Universal substrate for a semiconductor device having selectively activated fuses |
Oct. 20, 2009 |
| 7595553 |
Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus |
Sep. 29, 2009 |
| 7592702 |
Via heat sink material |
Sep. 22, 2009 |
| 7589415 |
Semiconductor chip and semiconductor device using the same, and method of fabricating semiconductor chip |
Sep. 15, 2009 |
| 7589414 |
I/O Architecture for integrated circuit package |
Sep. 15, 2009 |
| 7589411 |
Device for electrical connection of an integrated circuit chip |
Sep. 15, 2009 |
| 7586187 |
Interconnect structure with stress buffering ability and the manufacturing method thereof |
Sep. 8, 2009 |
| 7586181 |
Semiconductor device and method for manufacturing |
Sep. 8, 2009 |
| 7582961 |
Package structure with circuits directly connected to semiconductor chip |
Sep. 1, 2009 |
| 7576422 |
Semiconductor device |
Aug. 18, 2009 |
| 7573135 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
Aug. 11, 2009 |
| 7566969 |
Semiconductor device with improved arrangement of a through-hole in a wiring substrate |
Jul. 28, 2009 |
| 7566960 |
Interposing structure |
Jul. 28, 2009 |
| 7560810 |
Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
Jul. 14, 2009 |
| 7554198 |
Flexible joint methodology to attach a die on an organic substrate |
Jun. 30, 2009 |
| 7554189 |
Wireless communication module |
Jun. 30, 2009 |
| 7554187 |
Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure |
Jun. 30, 2009 |
| 7550855 |
Vertically spaced plural microsprings |
Jun. 23, 2009 |
| 7550830 |
Stacked semiconductor package having fan-out structure through wire bonding |
Jun. 23, 2009 |
| 7547965 |
Package and package module of the package |
Jun. 16, 2009 |
| 7547961 |
IC card with bonding wire connections of different lengths |
Jun. 16, 2009 |
| 7545036 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements |
Jun. 9, 2009 |
| 7545035 |
Semiconductor device having several assembled integrated-circuit chips and method of assembling and electrically connecting the integrated-circuit chips |
Jun. 9, 2009 |
| 7541662 |
Packaging chip having inductor therein |
Jun. 2, 2009 |
| 7538418 |
IC card |
May. 26, 2009 |
| 7535113 |
Reduced inductance in ball grid array packages |
May. 19, 2009 |
| 7535106 |
Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate |
May. 19, 2009 |
| 7535094 |
Substrate structure, a method and an arrangement for producing such substrate structure |
May. 19, 2009 |
| 7535093 |
Method and apparatus for packaging circuit devices |
May. 19, 2009 |
| 7535090 |
LSI package provided with interface module |
May. 19, 2009 |
| 7535087 |
Semiconductor device with lead frames |
May. 19, 2009 |
| 7528474 |
Stacked semiconductor package assembly having hollowed substrate |
May. 5, 2009 |
| 7528467 |
IC substrate with over voltage protection function |
May. 5, 2009 |
| 7525189 |
Semiconductor device, wiring board, and manufacturing method thereof |
Apr. 28, 2009 |
| 7525188 |
Multilayer circuit board and production method for same |
Apr. 28, 2009 |
| 7525179 |
Lead frame structure with aperture or groove for flip chip in a leaded molded package |
Apr. 28, 2009 |
| 7521807 |
Semiconductor device with inclined through holes |
Apr. 21, 2009 |
| 7521788 |
Semiconductor module with conductive element between chip packages |
Apr. 21, 2009 |
| 7521781 |
Integrated circuit package system with mold clamp line critical area having widened conductive traces |
Apr. 21, 2009 |
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