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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/697
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With particular lead geometry > External connection to housing > Pin grid type
Description: Subject matter wherein the leads or contacts which form an external connection to the housing or package are in the form of a grid or matrix of elongated pins.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8704356 High temperature interconnect assemblies for high temperature electronics utilizing transition pads Apr. 22, 2014
8664750 Semiconductor substrate, package and device Mar. 4, 2014
8659140 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Feb. 25, 2014
8659141 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Feb. 25, 2014
8659142 Stub minimization for wirebond assemblies without windows Feb. 25, 2014
8659143 Stub minimization for wirebond assemblies without windows Feb. 25, 2014
8659144 Power and ground planes in package substrate Feb. 25, 2014
8659139 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Feb. 25, 2014
8653646 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Feb. 18, 2014
8610261 Power semiconductor device Dec. 17, 2013
8592691 Printed wiring board Nov. 26, 2013
8575745 Power semiconductor device, printed wiring board, and mechanism for connecting the power semiconductor device and the printed wiring board Nov. 5, 2013
8558368 Bi-directional, reverse blocking battery switch Oct. 15, 2013
8541873 Microelectronic packages having cavities for receiving microelectronic elements Sep. 24, 2013
8519527 Isostress grid array and method of fabrication thereof Aug. 27, 2013
8513109 Method of manufacturing an interconnect structure for a semiconductor device Aug. 20, 2013
8502385 Power semiconductor device Aug. 6, 2013
8497575 Semiconductor packaging system with an aligned interconnect and method of manufacture thereof Jul. 30, 2013
8420955 Lead pin for package substrate Apr. 16, 2013
8399981 Ball grid array with improved single-ended and differential signal performance Mar. 19, 2013
8368227 Semiconductor element and package having semiconductor element Feb. 5, 2013
8330272 Microelectronic packages with dual or multiple-etched flip-chip connectors Dec. 11, 2012
8319333 Power semiconductor module Nov. 27, 2012
8314347 Wiring board with lead pins and method of producing the same Nov. 20, 2012
8299603 Power semiconductor device Oct. 30, 2012
8294259 Interconnect pattern for transceiver package Oct. 23, 2012
8278752 Microelectronic package and method for a compression-based mid-level interconnect Oct. 2, 2012
8269335 Multilayer semiconductor device and electronic equipment Sep. 18, 2012
8258618 Power semiconductor module Sep. 4, 2012
8253236 Power semiconductor device Aug. 28, 2012
8247898 Semiconductor device and semiconductor device mounted structure Aug. 21, 2012
8242608 Universal bump array structure Aug. 14, 2012
8232141 Integrated circuit packaging system with conductive pillars and method of manufacture thereof Jul. 31, 2012
8232634 Semiconductor device having a pin mounted heat sink Jul. 31, 2012
8232205 Methods of manufacturing a honeycomb extrusion die Jul. 31, 2012
8212350 Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates Jul. 3, 2012
8198723 Low inductance power distribution system for an integrated circuit chip Jun. 12, 2012
8199519 Chip adapter Jun. 12, 2012
8188589 Substrate with pin, manufacturing method thereof, and semiconductor product May. 29, 2012
8169068 IO cell with multiple IO ports and related techniques for layout area saving May. 1, 2012
8159063 Substrate and package with micro BGA configuration Apr. 17, 2012
8159064 Lead pin for package substrate, and method for manufacturing package substrate with the same Apr. 17, 2012
8154134 Packaged electronic devices with face-up die having TSV connection to leads and die pad Apr. 10, 2012
8143715 Semiconductor package transformer Mar. 27, 2012
8129834 Integral metal structure with conductive post portions Mar. 6, 2012
8120166 Semiconductor package and method of manufacturing the same, and semiconductor device and method of manufacturing the same Feb. 21, 2012
8110917 Package substrate with a conductive connecting pin Feb. 7, 2012
8097945 Bi-directional, reverse blocking battery switch Jan. 17, 2012
8093728 Connection by fitting together two soldered inserts Jan. 10, 2012
8049311 Electronic component and method for its production Nov. 1, 2011

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