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Browse by Category: Main > Physics
Class Information
Number: 257/696
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With particular lead geometry > External connection to housing > Bent (e.g., j-shaped) lead
Description: Subject matter wherein the leads or contacts which form an external connection to the housing or package include one or more leads which have a curved end portion (e.g., for mounting on the top surface of a printed circuit board).










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Patent Number Title Of Patent Date Issued
8710644 Semiconductor unit having a power semiconductor and semiconductor apparatus using the same Apr. 29, 2014
8710666 Semiconductor device and method for fabricating the same Apr. 29, 2014
8680668 Device including a semiconductor chip and metal foils Mar. 25, 2014
RE44811 High power light emitting diode package Mar. 18, 2014
8664755 Power module package and method for manufacturing the same Mar. 4, 2014
8656581 Method of fabricating a circuit apparatus Feb. 25, 2014
8653636 Contactless communication medium Feb. 18, 2014
8643153 Semiconductor device with staggered leads Feb. 4, 2014
8643189 Packaged semiconductor die with power rail pads Feb. 4, 2014
8637977 Semiconductor device and method of packaging a semiconductor device with a clip Jan. 28, 2014
8637973 Packaged microelectronic components with terminals exposed through encapsulant Jan. 28, 2014
8610138 LED package having an array of light emitting cells coupled in series Dec. 17, 2013
8598709 Method and system for routing electrical connections of semiconductor chips Dec. 3, 2013
8592967 Semiconductor apparatus and power supply circuit Nov. 26, 2013
8586857 Combined diode, lead assembly incorporating an expansion joint Nov. 19, 2013
8586417 Isostress grid array and method of fabrication thereof Nov. 19, 2013
8575742 Semiconductor device with increased I/O leadframe including power bars Nov. 5, 2013
8559238 Configurable inputs and outputs for memory stacking system and method Oct. 15, 2013
8558359 Semiconductor package having lead frames Oct. 15, 2013
8546849 High voltage cascoded III-nitride rectifier package utilizing clips on package surface Oct. 1, 2013
8546943 Ball grid array substrate with insulating layer and semiconductor chip package Oct. 1, 2013
8519546 Stacked multi-die electronic device with interposed electrically conductive strap Aug. 27, 2013
8519527 Isostress grid array and method of fabrication thereof Aug. 27, 2013
8502371 Integrated circuit package system with extended corner leads Aug. 6, 2013
8486757 Semiconductor device and method of packaging a semiconductor device with a clip Jul. 16, 2013
8482109 Integrated circuit packaging system with dual connection and method of manufacture thereof Jul. 9, 2013
8466546 Chip-scale package Jun. 18, 2013
8455988 Integrated circuit package system with bumped lead and nonbumped lead Jun. 4, 2013
8455915 Light emitting device Jun. 4, 2013
8426978 Semiconductor device including a first wiring having a bending portion and a via including the bending portion Apr. 23, 2013
8421210 Integrated circuit packaging system with dual side connection and method of manufacture thereof Apr. 16, 2013
8415803 Method and system for routing electrical connections of semiconductor chips Apr. 9, 2013
8410601 RF package Apr. 2, 2013
8405230 Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof Mar. 26, 2013
8404520 Package-on-package assembly with wire bond vias Mar. 26, 2013
8399992 Package-on-package type semiconductor package Mar. 19, 2013
8395246 Two-sided die in a four-sided leadframe based package Mar. 12, 2013
8381393 Patch on interposer through PGA interconnect structures Feb. 26, 2013
8358017 Semiconductor package featuring flip-chip die sandwiched between metal layers Jan. 22, 2013
8339800 Circuit module Dec. 25, 2012
8334589 Power block and power semiconductor module using same Dec. 18, 2012
8329579 Through substrate VIAS Dec. 11, 2012
8330270 Integrated circuit package having a plurality of spaced apart pad portions Dec. 11, 2012
8319323 Electronic package having down-set leads and method Nov. 27, 2012
8310041 Stacked semiconductor package and stacking method thereof Nov. 13, 2012
8299602 Semiconductor device including leadframe with increased I/O Oct. 30, 2012
8294257 Power block and power semiconductor module using same Oct. 23, 2012
8294258 Power semiconductor module Oct. 23, 2012
8283760 Lead frame interconnect scheme with high power density Oct. 9, 2012
8278752 Microelectronic package and method for a compression-based mid-level interconnect Oct. 2, 2012

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