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Class Information
Number: 257/696
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With particular lead geometry > External connection to housing > Bent (e.g., j-shaped) lead
Description: Subject matter wherein the leads or contacts which form an external connection to the housing or package include one or more leads which have a curved end portion (e.g., for mounting on the top surface of a printed circuit board).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619307 |
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package |
Nov. 17, 2009 |
| 7615851 |
Integrated circuit package system |
Nov. 10, 2009 |
| 7615852 |
Semiconductor component in a housing with mechanically inforcing flat conductor webs |
Nov. 10, 2009 |
| 7615859 |
Thin semiconductor package having stackable lead frame and method of manufacturing the same |
Nov. 10, 2009 |
| 7612457 |
Semiconductor device including a stress buffer |
Nov. 3, 2009 |
| 7612439 |
Semiconductor package having improved thermal performance |
Nov. 3, 2009 |
| 7612445 |
Circuit apparatus and method of fabricating the apparatus |
Nov. 3, 2009 |
| 7602630 |
Configurable inputs and outputs for memory stacking system and method |
Oct. 13, 2009 |
| 7602052 |
Semiconductor device |
Oct. 13, 2009 |
| 7582951 |
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages |
Sep. 1, 2009 |
| 7579680 |
Packaging system for semiconductor devices |
Aug. 25, 2009 |
| 7576437 |
Printed circuit board of semiconductor package and method for mounting semiconductor package using the same |
Aug. 18, 2009 |
| 7576418 |
Lead frame structure and applications thereof |
Aug. 18, 2009 |
| 7576429 |
Packaged semiconductor device with dual exposed surfaces and method of manufacturing |
Aug. 18, 2009 |
| 7566963 |
Stacked assembly of semiconductor packages with fastening lead-cut ends of leadframe |
Jul. 28, 2009 |
| 7554184 |
Image sensor chip package |
Jun. 30, 2009 |
| 7554136 |
Micro-switch device and method for manufacturing the same |
Jun. 30, 2009 |
| 7550855 |
Vertically spaced plural microsprings |
Jun. 23, 2009 |
| 7541669 |
Semiconductor device package with base features to reduce leakage |
Jun. 2, 2009 |
| 7538415 |
Semiconductor chip assembly with bumped terminal, filler and insulative base |
May. 26, 2009 |
| 7534654 |
Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
May. 19, 2009 |
| 7535084 |
Multi-chip package with a single die pad |
May. 19, 2009 |
| 7535085 |
Semiconductor package having improved adhesiveness and ground bonding |
May. 19, 2009 |
| 7535086 |
Integrated circuit package-on-package stacking system |
May. 19, 2009 |
| 7531895 |
Integrated circuit package and method of manufacture thereof |
May. 12, 2009 |
| 7531893 |
Power semiconductor devices having integrated inductor |
May. 12, 2009 |
| 7525179 |
Lead frame structure with aperture or groove for flip chip in a leaded molded package |
Apr. 28, 2009 |
| 7521781 |
Integrated circuit package system with mold clamp line critical area having widened conductive traces |
Apr. 21, 2009 |
| 7514768 |
Package structure for a semiconductor device incorporating enhanced solder bump structure |
Apr. 7, 2009 |
| 7508061 |
Three-dimensional semiconductor module having multi-sided ground block |
Mar. 24, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7504715 |
Packaging of a microchip device |
Mar. 17, 2009 |
| 7495327 |
Chip stacking structure |
Feb. 24, 2009 |
| 7476966 |
Semiconductor module |
Jan. 13, 2009 |
| 7476962 |
Stack semiconductor package formed by multiple molding and method of manufacturing the same |
Jan. 13, 2009 |
| 7466013 |
Semiconductor die structure featuring a triple pad organization |
Dec. 16, 2008 |
| 7466016 |
Bent lead transistor |
Dec. 16, 2008 |
| 7459770 |
Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure |
Dec. 2, 2008 |
| 7459779 |
Pad arrangement of driver IC chip for LCD and related circuit pattern structure of TAB package |
Dec. 2, 2008 |
| 7452786 |
Method for manufacturing thin film integrated circuit, and element substrate |
Nov. 18, 2008 |
| 7453140 |
Semiconductor chip assembly with laterally aligned filler and insulative base |
Nov. 18, 2008 |
| 7440263 |
Image sensor and method for manufacturing the same |
Oct. 21, 2008 |
| 7425759 |
Semiconductor chip assembly with bumped terminal and filler |
Sep. 16, 2008 |
| 7420216 |
Reflection type light-emitting diode device |
Sep. 2, 2008 |
| 7417310 |
Circuit module having force resistant construction |
Aug. 26, 2008 |
| 7414301 |
Printed circuit board with soldering lands |
Aug. 19, 2008 |
| 7414308 |
Integrated circuit with offset pins |
Aug. 19, 2008 |
| 7399990 |
Wafer-level package having test terminal |
Jul. 15, 2008 |
| 7391100 |
Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area |
Jun. 24, 2008 |
| 7385227 |
Compact light emitting device package with enhanced heat dissipation and method for making the package |
Jun. 10, 2008 |
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