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Class Information
Number: 257/696
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With particular lead geometry > External connection to housing > Bent (e.g., j-shaped) lead
Description: Subject matter wherein the leads or contacts which form an external connection to the housing or package include one or more leads which have a curved end portion (e.g., for mounting on the top surface of a printed circuit board).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459770 |
Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure |
Dec. 2, 2008 |
| 7459779 |
Pad arrangement of driver IC chip for LCD and related circuit pattern structure of TAB package |
Dec. 2, 2008 |
| 7452786 |
Method for manufacturing thin film integrated circuit, and element substrate |
Nov. 18, 2008 |
| 7453140 |
Semiconductor chip assembly with laterally aligned filler and insulative base |
Nov. 18, 2008 |
| 7440263 |
Image sensor and method for manufacturing the same |
Oct. 21, 2008 |
| 7425759 |
Semiconductor chip assembly with bumped terminal and filler |
Sep. 16, 2008 |
| 7420216 |
Reflection type light-emitting diode device |
Sep. 2, 2008 |
| 7417310 |
Circuit module having force resistant construction |
Aug. 26, 2008 |
| 7414301 |
Printed circuit board with soldering lands |
Aug. 19, 2008 |
| 7414308 |
Integrated circuit with offset pins |
Aug. 19, 2008 |
| 7399990 |
Wafer-level package having test terminal |
Jul. 15, 2008 |
| 7391100 |
Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area |
Jun. 24, 2008 |
| 7385227 |
Compact light emitting device package with enhanced heat dissipation and method for making the package |
Jun. 10, 2008 |
| 7375421 |
High density multilayer circuit module |
May. 20, 2008 |
| 7375418 |
Interposer stacking system and method |
May. 20, 2008 |
| 7372153 |
Integrated circuit package bond pad having plurality of conductive members |
May. 13, 2008 |
| 7361983 |
Semiconductor device and semiconductor assembly module with a gap-controlling lead structure |
Apr. 22, 2008 |
| 7352054 |
Semiconductor device having conducting portion of upper and lower conductive layers |
Apr. 1, 2008 |
| 7335975 |
Integrated circuit stacking system and method |
Feb. 26, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
Jan. 29, 2008 |
| 7319265 |
Semiconductor chip assembly with precision-formed metal pillar |
Jan. 15, 2008 |
| 7307288 |
Semiconductor device and manufacturing method thereof |
Dec. 11, 2007 |
| 7304376 |
Microelectronic assemblies with springs |
Dec. 4, 2007 |
| 7279784 |
Semiconductor package |
Oct. 9, 2007 |
| 7279787 |
Microelectronic complex having clustered conductive members |
Oct. 9, 2007 |
| 7276920 |
Packaging and interconnection of contact structure |
Oct. 2, 2007 |
| 7256482 |
Integrated circuit chip packaging assembly |
Aug. 14, 2007 |
| 7256489 |
Semiconductor apparatus |
Aug. 14, 2007 |
| 7253505 |
IC substrate with over voltage protection function |
Aug. 7, 2007 |
| 7253514 |
Self-supporting connecting element for a semiconductor chip |
Aug. 7, 2007 |
| 7247936 |
Tape circuit substrate having wavy beam leads and semiconductor chip package using the same |
Jul. 24, 2007 |
| 7247934 |
Multi-chip semiconductor package |
Jul. 24, 2007 |
| 7242078 |
Surface mount multichip devices |
Jul. 10, 2007 |
| 7239008 |
Semiconductor apparatus and method for fabricating the same |
Jul. 3, 2007 |
| 7227198 |
Half-bridge package |
Jun. 5, 2007 |
| 7227249 |
Three-dimensional stacked semiconductor package with chips on opposite sides of lead |
Jun. 5, 2007 |
| 7227251 |
Semiconductor device and a memory system including a plurality of IC chips in a common package |
Jun. 5, 2007 |
| 7224053 |
Semiconductor device responsive to different levels of input and output signals and signal processing system using the same |
May. 29, 2007 |
| 7224047 |
Semiconductor device package with reduced leakage |
May. 29, 2007 |
| 7215021 |
Electronic device |
May. 8, 2007 |
| 7208772 |
High power light emitting diode package |
Apr. 24, 2007 |
| 7190060 |
Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same |
Mar. 13, 2007 |
| 7161237 |
Flip chip packaging using recessed interposer terminals |
Jan. 9, 2007 |
| 7148564 |
Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness |
Dec. 12, 2006 |
| 7145227 |
Stacked memory and manufacturing method thereof |
Dec. 5, 2006 |
| 7138707 |
Semiconductor package including leads and conductive posts for providing increased functionality |
Nov. 21, 2006 |
| 7135761 |
Robust power semiconductor package |
Nov. 14, 2006 |
| 7135754 |
Chip type solid electrolytic capacitor having a small size and a simple structure |
Nov. 14, 2006 |
| 7131192 |
Method of manufacturing printed circuit boards using miniature contact block packagings |
Nov. 7, 2006 |
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