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Class Information
Number: 257/695
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With particular lead geometry > External connection to housing > Fanned/radial leads
Description: Subject matter wherein the leads or contacts which form an external connection to the housing or package extend radially outward from the package.

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
5777382 Plastic packaging for a surface mounted integrated circuit Jul. 7, 1998
5744858 Semiconductor packaging technique yielding increased inner lead count for a given die-receiving area Apr. 28, 1998
5736792 Method of protecting bond wires during molding and handling Apr. 7, 1998
5723902 Surface mounting type electronic component Mar. 3, 1998
5701234 Surface mount component for selectively configuring a printed circuit board and method for using the same Dec. 23, 1997
5684332 Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom Nov. 4, 1997
5525836 Multilayer metal leadframe Jun. 11, 1996
5512782 Semiconductor device for DC/AC converter Apr. 30, 1996
5466968 Leadframe for making semiconductor devices Nov. 14, 1995
5428246 Highly integrated electronic component with heat-conductive plate Jun. 27, 1995
5394298 Semiconductor devices Feb. 28, 1995
5365655 Method of making an electronic module for a memory card and an electronic module thus obtained Nov. 22, 1994
5329423 Compressive bump-and-socket interconnection scheme for integrated circuits Jul. 12, 1994
5308797 Leads for semiconductor chip assembly and method May. 3, 1994
5304844 Semiconductor device and method of producing the same Apr. 19, 1994
5250844 Multiple power/ground planes for tab Oct. 5, 1993
5105261 Semiconductor device package having particular lead structure for mounting multiple circuit boards Apr. 14, 1992
5091822 Radial type of parallel system bus structure with printed, twisted conductor lines Feb. 25, 1992
5088008 Circuit board for mounting electronic components Feb. 11, 1992
5072281 Interconnection lead having individual spiral lead design Dec. 10, 1991
5072279 Electrical interconnection having angular lead design Dec. 10, 1991
5034800 Hollow plastic package for semiconductor devices Jul. 23, 1991
5032895 Semiconductor device and method of producing the same Jul. 16, 1991
5018003 Lead frame and semiconductor device May. 21, 1991
4974057 Semiconductor device package with circuit board and resin Nov. 27, 1990
4951122 Resin-encapsulated semiconductor device Aug. 21, 1990
4949160 Semiconductor device Aug. 14, 1990
4801996 Gigahertz rate integrated circuit package incorporating semiconductive MIS power-line substrate Jan. 31, 1989
4706105 Semiconductor device and method of producing the same Nov. 10, 1987
4661837 Resin-sealed radiation shield for a semiconductor device Apr. 28, 1987
4660069 Device with captivate chip capacitor devices and method of making the same Apr. 21, 1987
4392152 Semiconductor device Jul. 5, 1983
4044374 Semiconductor device header suitable for vacuum tube applications Aug. 23, 1977
4003073 Integrated circuit device employing metal frame means with preformed conductor means Jan. 11, 1977

1 2 3

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