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Class Information
Number: 257/695
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With particular lead geometry > External connection to housing > Fanned/radial leads
Description: Subject matter wherein the leads or contacts which form an external connection to the housing or package extend radially outward from the package.

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
6833612 Flip-chip image sensor packages Dec. 21, 2004
6794741 Three-dimensional stacked semiconductor package with pillars in pillar cavities Sep. 21, 2004
6774479 Electronic device having a semiconductor chip on a semiconductor chip connection plate and a method for producing the electronic device Aug. 10, 2004
6747344 Lead frame assemblies with voltage reference plane and IC packages including same Jun. 8, 2004
6744123 Film carrier tape for mounting electronic devices thereon and method of manufacturing the same Jun. 1, 2004
6737736 Semiconductor device May. 18, 2004
6686648 Electronic component with stacked semiconductor chips and method of producing the component Feb. 3, 2004
6657286 Microelectronic assembly formation with lead displacement Dec. 2, 2003
6635955 Molded electronic component Oct. 21, 2003
6624521 Flip chip design on a coplanar waveguide with a pseudo-coaxial ground bump configuration Sep. 23, 2003
6603199 Integrated circuit package having die with staggered bond pads and die pad assignment methodology for assembly of staggered die in single-tier ebga packages Aug. 5, 2003
6594811 Routable high-density interfaces for integrated circuit devices Jul. 15, 2003
6545348 Package for a semiconductor device comprising a plurality of interconnection patterns around a semiconductor chip Apr. 8, 2003
6528870 Semiconductor device having a plurality of stacked wiring boards Mar. 4, 2003
6509643 Tab tape with stiffener and semiconductor device using same Jan. 21, 2003
6507104 Semiconductor package with embedded heat-dissipating device Jan. 14, 2003
6501161 Semiconductor package having increased solder joint strength Dec. 31, 2002
6501183 Semiconductor device and a method of manufacturing the same and an electronic device Dec. 31, 2002
6483175 Wiring board and semiconductor device using the same Nov. 19, 2002
6483184 Semiconductor apparatus substrate, semiconductor apparatus, and method of manufacturing thereof and electronic apparatus Nov. 19, 2002
6451626 Three-dimensional stacked semiconductor package Sep. 17, 2002
6437447 Dual-sided chip package without a die pad Aug. 20, 2002
6429534 Interposer tape for semiconductor package Aug. 6, 2002
6407446 Leadframe and semiconductor chip package having cutout portions and increased lead count Jun. 18, 2002
6380617 Electrode terminal connection structure of semiconductor module Apr. 30, 2002
6348729 Semiconductor chip package and manufacturing method thereof Feb. 19, 2002
6331738 Semiconductor device having a BGA structure Dec. 18, 2001
6313524 Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrate Nov. 6, 2001
6297546 Underfill coating for LOC package Oct. 2, 2001
6259022 Chip card micromodule as a surface-mount device Jul. 10, 2001
6201298 Semiconductor device using wiring tape Mar. 13, 2001
6181003 Semiconductor device packaged in plastic package Jan. 30, 2001
6144089 Inner-digitized bond fingers on bus bars of semiconductor device package Nov. 7, 2000
6075286 Stress clip design Jun. 13, 2000
6043108 Lead frame with lead-securing tape bonded to the inner lead sections of plural leads and a method of manufacturing the same Mar. 28, 2000
6037669 Staggered pad array Mar. 14, 2000
6034438 L-connect routing of die surface pads to the die edge for stacking in a 3D array Mar. 7, 2000
6002164 Semiconductor lead frame Dec. 14, 1999
5982043 Semiconductor device having two or more bonding option pads Nov. 9, 1999
5977616 Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die Nov. 2, 1999
5955783 High frequency signal processing chip having signal pins distributed to minimize signal interference Sep. 21, 1999
5923092 Wiring between semiconductor integrated circuit chip electrode pads and a surrounding lead frame Jul. 13, 1999
5903050 Semiconductor package having capacitive extension spokes and method for making the same May. 11, 1999
5869884 Semiconductor device having lead terminal on only one side of a package Feb. 9, 1999
5828116 Semiconductor device with bonded wires Oct. 27, 1998
5828000 Semiconductor device with heat radiating plate and positioning dummy lead and lead frame therefor Oct. 27, 1998
5828126 Chip on board package with top and bottom terminals Oct. 27, 1998
5818105 Semiconductor device with plastic material covering a semiconductor chip mounted on a substrate of the device Oct. 6, 1998
5790383 Printed circuit board Aug. 4, 1998

1 2 3

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