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Browse by Category: Main > Physics
Class Information
Number: 257/695
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With particular lead geometry > External connection to housing > Fanned/radial leads
Description: Subject matter wherein the leads or contacts which form an external connection to the housing or package extend radially outward from the package.










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8659139 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Feb. 25, 2014
8659141 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Feb. 25, 2014
8659140 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Feb. 25, 2014
8659142 Stub minimization for wirebond assemblies without windows Feb. 25, 2014
8659143 Stub minimization for wirebond assemblies without windows Feb. 25, 2014
8653646 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Feb. 18, 2014
8648458 Leadframe circuit and method therefor Feb. 11, 2014
8633407 Semiconductor device capable of switching operation modes Jan. 21, 2014
RE44699 Semiconductor integrated circuit having pads layout for increasing signal integrity and reducing chip size Jan. 14, 2014
8502377 Package substrate for bump on trace interconnection Aug. 6, 2013
8450841 Bonded wire semiconductor device May. 28, 2013
8395246 Two-sided die in a four-sided leadframe based package Mar. 12, 2013
8344269 Semiconductor device capable of switching operation modes Jan. 1, 2013
RE43818 Fabrication of an integrated circuit package Nov. 20, 2012
8304886 Semiconductor device having integral structure of contact pad and conductive line Nov. 6, 2012
8283663 Multichip device Oct. 9, 2012
8233127 Liquid crystal display device Jul. 31, 2012
8188582 Lead frame, semiconductor device using the lead frame, and methods of manufacturing the same May. 29, 2012
8159063 Substrate and package with micro BGA configuration Apr. 17, 2012
8110913 Integrated circuit package system with integral inner lead and paddle Feb. 7, 2012
8106418 Light emitting device Jan. 31, 2012
8067831 Integrated circuit package system with planar interconnects Nov. 29, 2011
7825445 Magnetoresistive memory elements with separate read and write current paths Nov. 2, 2010
7781873 Encapsulated leadframe semiconductor package for random access memory integrated circuits Aug. 24, 2010
7763812 Semiconductor device capable of switching operation modes Jul. 27, 2010
7618845 Fabrication of an integrated circuit package Nov. 17, 2009
7579680 Packaging system for semiconductor devices Aug. 25, 2009
7554136 Micro-switch device and method for manufacturing the same Jun. 30, 2009
7511368 Carrier device for electronic chip Mar. 31, 2009
7504670 Sealing structure for mounting a semiconductor device to a substrate Mar. 17, 2009
7459770 Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure Dec. 2, 2008
7459780 Fan-out wire structure Dec. 2, 2008
7420271 Heat conductivity and brightness enhancing structure for light-emitting diode Sep. 2, 2008
7378727 Memory device and a method of forming a memory device May. 27, 2008
7348494 Signal layer interconnects Mar. 25, 2008
7329946 I/O architecture for integrated circuit package Feb. 12, 2008
7323776 Elevated heat dissipating device Jan. 29, 2008
7239008 Semiconductor apparatus and method for fabricating the same Jul. 3, 2007
7115977 Multi-chip package type semiconductor device Oct. 3, 2006
7109573 Thermally enhanced component substrate Sep. 19, 2006
7102211 Semiconductor device and hybrid integrated circuit device Sep. 5, 2006
7012325 Ultra-thin semiconductor package device and method for manufacturing the same Mar. 14, 2006
6992372 Film carrier tape for mounting electronic devices thereon Jan. 31, 2006
6984884 Electric power semiconductor device Jan. 10, 2006
6975020 Semiconductor integrated circuit having pads layout for increasing signal integrity and reducing chip size Dec. 13, 2005
6965154 Semiconductor device Nov. 15, 2005
6946726 Chip carrier substrate with a land grid array and external bond terminals Sep. 20, 2005
6897556 I/O architecture for integrated circuit package May. 24, 2005
6885051 Minimally spaced MRAM structures Apr. 26, 2005
6861750 Ball grid array package with multiple interposers Mar. 1, 2005

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