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Class Information
Number: 257/695
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With particular lead geometry > External connection to housing > Fanned/radial leads
Description: Subject matter wherein the leads or contacts which form an external connection to the housing or package extend radially outward from the package.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459780 |
Fan-out wire structure |
Dec. 2, 2008 |
| 7459770 |
Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure |
Dec. 2, 2008 |
| 7420271 |
Heat conductivity and brightness enhancing structure for light-emitting diode |
Sep. 2, 2008 |
| 7378727 |
Memory device and a method of forming a memory device |
May. 27, 2008 |
| 7348494 |
Signal layer interconnects |
Mar. 25, 2008 |
| 7329946 |
I/O architecture for integrated circuit package |
Feb. 12, 2008 |
| 7323776 |
Elevated heat dissipating device |
Jan. 29, 2008 |
| 7239008 |
Semiconductor apparatus and method for fabricating the same |
Jul. 3, 2007 |
| 7115977 |
Multi-chip package type semiconductor device |
Oct. 3, 2006 |
| 7109573 |
Thermally enhanced component substrate |
Sep. 19, 2006 |
| 7102211 |
Semiconductor device and hybrid integrated circuit device |
Sep. 5, 2006 |
| 7012325 |
Ultra-thin semiconductor package device and method for manufacturing the same |
Mar. 14, 2006 |
| 6992372 |
Film carrier tape for mounting electronic devices thereon |
Jan. 31, 2006 |
| 6984884 |
Electric power semiconductor device |
Jan. 10, 2006 |
| 6975020 |
Semiconductor integrated circuit having pads layout for increasing signal integrity and reducing chip size |
Dec. 13, 2005 |
| 6965154 |
Semiconductor device |
Nov. 15, 2005 |
| 6946726 |
Chip carrier substrate with a land grid array and external bond terminals |
Sep. 20, 2005 |
| 6897556 |
I/O architecture for integrated circuit package |
May. 24, 2005 |
| 6885051 |
Minimally spaced MRAM structures |
Apr. 26, 2005 |
| 6861750 |
Ball grid array package with multiple interposers |
Mar. 1, 2005 |
| 6833612 |
Flip-chip image sensor packages |
Dec. 21, 2004 |
| 6794741 |
Three-dimensional stacked semiconductor package with pillars in pillar cavities |
Sep. 21, 2004 |
| 6774479 |
Electronic device having a semiconductor chip on a semiconductor chip connection plate and a method for producing the electronic device |
Aug. 10, 2004 |
| 6747344 |
Lead frame assemblies with voltage reference plane and IC packages including same |
Jun. 8, 2004 |
| 6744123 |
Film carrier tape for mounting electronic devices thereon and method of manufacturing the same |
Jun. 1, 2004 |
| 6737736 |
Semiconductor device |
May. 18, 2004 |
| 6686648 |
Electronic component with stacked semiconductor chips and method of producing the component |
Feb. 3, 2004 |
| 6657286 |
Microelectronic assembly formation with lead displacement |
Dec. 2, 2003 |
| 6635955 |
Molded electronic component |
Oct. 21, 2003 |
| 6624521 |
Flip chip design on a coplanar waveguide with a pseudo-coaxial ground bump configuration |
Sep. 23, 2003 |
| 6614073 |
SEMICONDUCTOR CHIP WITH A BASE ELECTRODE AND AN EMITTER ELECTRODE EXPOSED ON ONE OF A PAIR OF OPPOSITE LATERAL FACES AND A COLLECTOR ELECTRODE EXPOSED ON A REMAINING ONE OF THE PAIR OF THE OPP |
Sep. 2, 2003 |
| 6603199 |
Integrated circuit package having die with staggered bond pads and die pad assignment methodology for assembly of staggered die in single-tier ebga packages |
Aug. 5, 2003 |
| 6594811 |
Routable high-density interfaces for integrated circuit devices |
Jul. 15, 2003 |
| 6545348 |
Package for a semiconductor device comprising a plurality of interconnection patterns around a semiconductor chip |
Apr. 8, 2003 |
| 6528870 |
Semiconductor device having a plurality of stacked wiring boards |
Mar. 4, 2003 |
| 6509643 |
Tab tape with stiffener and semiconductor device using same |
Jan. 21, 2003 |
| 6507104 |
Semiconductor package with embedded heat-dissipating device |
Jan. 14, 2003 |
| 6501183 |
Semiconductor device and a method of manufacturing the same and an electronic device |
Dec. 31, 2002 |
| 6501161 |
Semiconductor package having increased solder joint strength |
Dec. 31, 2002 |
| 6483184 |
Semiconductor apparatus substrate, semiconductor apparatus, and method of manufacturing thereof and electronic apparatus |
Nov. 19, 2002 |
| 6483175 |
Wiring board and semiconductor device using the same |
Nov. 19, 2002 |
| 6451626 |
Three-dimensional stacked semiconductor package |
Sep. 17, 2002 |
| 6437447 |
Dual-sided chip package without a die pad |
Aug. 20, 2002 |
| 6429534 |
Interposer tape for semiconductor package |
Aug. 6, 2002 |
| 6407446 |
Leadframe and semiconductor chip package having cutout portions and increased lead count |
Jun. 18, 2002 |
| 6380617 |
Electrode terminal connection structure of semiconductor module |
Apr. 30, 2002 |
| 6348729 |
Semiconductor chip package and manufacturing method thereof |
Feb. 19, 2002 |
| 6331738 |
Semiconductor device having a BGA structure |
Dec. 18, 2001 |
| 6313524 |
Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrate |
Nov. 6, 2001 |
| 6297546 |
Underfill coating for LOC package |
Oct. 2, 2001 |
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