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Class Information
Number: 257/694
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With particular lead geometry > External connection to housing > Axial leads
Description: Subject matter wherein the leads or contacts which form an external connection to the housing or package extend out opposite ends along an axis of symmetry of a housing or package.

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8648450 Semiconductor device including leadframe with a combination of leads and lands Feb. 11, 2014
8455915 Light emitting device Jun. 4, 2013
8395246 Two-sided die in a four-sided leadframe based package Mar. 12, 2013
8357931 Flip chip semiconductor die internal signal access system and method Jan. 22, 2013
8283663 Multichip device Oct. 9, 2012
8233127 Liquid crystal display device Jul. 31, 2012
8188582 Lead frame, semiconductor device using the lead frame, and methods of manufacturing the same May. 29, 2012
8159063 Substrate and package with micro BGA configuration Apr. 17, 2012
8159055 Semiconductor device, lead-frame product used for the same and method for manufacturing the same Apr. 17, 2012
8125072 Device including a ring-shaped metal structure and method Feb. 28, 2012
7964956 Circuit packaging and connectivity Jun. 21, 2011
7884010 Wiring structure and method for fabricating the same Feb. 8, 2011
7855480 Rectifier device for automotive alternator Dec. 21, 2010
7842948 Flip chip semiconductor die internal signal access system and method Nov. 30, 2010
7838395 Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the same Nov. 23, 2010
7821115 Tape carrier package including a heat dissipation element Oct. 26, 2010
7696631 Wire bonding personalization and discrete component attachment on wirebond pads Apr. 13, 2010
7638872 Power semiconductor module Dec. 29, 2009
7602052 Semiconductor device Oct. 13, 2009
7598119 System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices Oct. 6, 2009
7595550 Flex-based circuit module Sep. 29, 2009
7579680 Packaging system for semiconductor devices Aug. 25, 2009
7563648 Semiconductor device package and method for manufacturing same Jul. 21, 2009
7554136 Micro-switch device and method for manufacturing the same Jun. 30, 2009
7504670 Sealing structure for mounting a semiconductor device to a substrate Mar. 17, 2009
7439612 Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connector Oct. 21, 2008
7420271 Heat conductivity and brightness enhancing structure for light-emitting diode Sep. 2, 2008
7323776 Elevated heat dissipating device Jan. 29, 2008
7239008 Semiconductor apparatus and method for fabricating the same Jul. 3, 2007
7205658 Singulation method used in leadless packaging process Apr. 17, 2007
7190065 Circuit substrate, semiconductor module and method of manufacturing circuit substrate Mar. 13, 2007
7173328 Integrated circuit package and method having wire-bonded intra-die electrical connections Feb. 6, 2007
7151027 Method and device for reducing interface area of a memory device Dec. 19, 2006
7151042 Method of improving flash memory performance Dec. 19, 2006
7119423 Semiconductor device and method of manufacturing the same, electronic module, and electronic instrument Oct. 10, 2006
7091545 Memory device and fabrication method thereof Aug. 15, 2006
7061084 Lead-bond type chip package and manufacturing method thereof Jun. 13, 2006
6984884 Electric power semiconductor device Jan. 10, 2006
6953989 Film carrier tape for mounting electronic devices thereon and final defect marking method using the same Oct. 11, 2005
6946726 Chip carrier substrate with a land grid array and external bond terminals Sep. 20, 2005
6919625 Surface mount multichip devices Jul. 19, 2005
6836010 Semiconductor device include relay chip connecting semiconductor chip pads to external pads Dec. 28, 2004
6835004 Opto-electronic component packaging Dec. 28, 2004
6828667 Surface mounting type electronic component Dec. 7, 2004
6822164 Semiconductor device and electro-optical device including the same Nov. 23, 2004
6809410 Power semiconductor module Oct. 26, 2004
6800932 Package for semiconductor die containing symmetrical lead and heat sink Oct. 5, 2004
6784464 Semiconductor laser device and wire bonding method capable of easily performing reliable wire bonding Aug. 31, 2004
6744122 Semiconductor device, method of manufacture thereof, circuit board, and electronic device Jun. 1, 2004
6744133 Adhesive film for semiconductor, lead frame and semiconductor device using the same Jun. 1, 2004

1 2 3

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