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Class Information
Number: 257/694
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With particular lead geometry > External connection to housing > Axial leads
Description: Subject matter wherein the leads or contacts which form an external connection to the housing or package extend out opposite ends along an axis of symmetry of a housing or package.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7439612 |
Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connector |
Oct. 21, 2008 |
| 7420271 |
Heat conductivity and brightness enhancing structure for light-emitting diode |
Sep. 2, 2008 |
| 7323776 |
Elevated heat dissipating device |
Jan. 29, 2008 |
| 7239008 |
Semiconductor apparatus and method for fabricating the same |
Jul. 3, 2007 |
| 7205658 |
Singulation method used in leadless packaging process |
Apr. 17, 2007 |
| 7190065 |
Circuit substrate, semiconductor module and method of manufacturing circuit substrate |
Mar. 13, 2007 |
| 7173328 |
Integrated circuit package and method having wire-bonded intra-die electrical connections |
Feb. 6, 2007 |
| 7151027 |
Method and device for reducing interface area of a memory device |
Dec. 19, 2006 |
| 7151042 |
Method of improving flash memory performance |
Dec. 19, 2006 |
| 7119423 |
Semiconductor device and method of manufacturing the same, electronic module, and electronic instrument |
Oct. 10, 2006 |
| 7091545 |
Memory device and fabrication method thereof |
Aug. 15, 2006 |
| 7061084 |
Lead-bond type chip package and manufacturing method thereof |
Jun. 13, 2006 |
| 6984884 |
Electric power semiconductor device |
Jan. 10, 2006 |
| 6953989 |
Film carrier tape for mounting electronic devices thereon and final defect marking method using the same |
Oct. 11, 2005 |
| 6946726 |
Chip carrier substrate with a land grid array and external bond terminals |
Sep. 20, 2005 |
| 6919625 |
Surface mount multichip devices |
Jul. 19, 2005 |
| 6836010 |
Semiconductor device include relay chip connecting semiconductor chip pads to external pads |
Dec. 28, 2004 |
| 6835004 |
Opto-electronic component packaging |
Dec. 28, 2004 |
| 6828667 |
Surface mounting type electronic component |
Dec. 7, 2004 |
| 6822164 |
Semiconductor device and electro-optical device including the same |
Nov. 23, 2004 |
| 6809410 |
Power semiconductor module |
Oct. 26, 2004 |
| 6800932 |
Package for semiconductor die containing symmetrical lead and heat sink |
Oct. 5, 2004 |
| 6784464 |
Semiconductor laser device and wire bonding method capable of easily performing reliable wire bonding |
Aug. 31, 2004 |
| 6744122 |
Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
Jun. 1, 2004 |
| 6744133 |
Adhesive film for semiconductor, lead frame and semiconductor device using the same |
Jun. 1, 2004 |
| 6700138 |
Modular semiconductor die package and method of manufacturing thereof |
Mar. 2, 2004 |
| 6686648 |
Electronic component with stacked semiconductor chips and method of producing the component |
Feb. 3, 2004 |
| 6667545 |
Rectifier diode with improved means for tension relief of the connected headwire |
Dec. 23, 2003 |
| 6635955 |
Molded electronic component |
Oct. 21, 2003 |
| 6630727 |
Modularly expandable multi-layered semiconductor component |
Oct. 7, 2003 |
| 6611049 |
Semiconductor device with chamfered substrate and method of making the same |
Aug. 26, 2003 |
| 6538306 |
Electronic part |
Mar. 25, 2003 |
| 6534853 |
Semiconductor wafer designed to avoid probed marks while testing |
Mar. 18, 2003 |
| 6531769 |
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE, SEMICONDUCTOR APPARATUS PROVIDED WITH A PLURALITY OF SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGES, METHOD OF INSPECTING SEMICONDUCTOR INTEGRATED CIRCUIT |
Mar. 11, 2003 |
| 6483182 |
Integrated-circuit case |
Nov. 19, 2002 |
| 6455929 |
Embedded type package of power semiconductor device |
Sep. 24, 2002 |
| 6452802 |
Symmetrical package for semiconductor die |
Sep. 17, 2002 |
| 6424028 |
Semiconductor devices configured to tolerate connection misalignment |
Jul. 23, 2002 |
| 6395982 |
Leaded semiconductor device package for use in nonsoldering assembling |
May. 28, 2002 |
| 6380617 |
Electrode terminal connection structure of semiconductor module |
Apr. 30, 2002 |
| 6351033 |
Multifunction lead frame and integrated circuit package incorporating the same |
Feb. 26, 2002 |
| 6344681 |
Semiconductor package produced by solder plating without solder residue |
Feb. 5, 2002 |
| 6329708 |
Micro ball grid array semiconductor device and semiconductor module |
Dec. 11, 2001 |
| 6329710 |
Integrated circuit package electrical enhancement |
Dec. 11, 2001 |
| 6323545 |
Semiconductor device |
Nov. 27, 2001 |
| 6313523 |
IC die power connection using canted coil spring |
Nov. 6, 2001 |
| 6271584 |
Arrangement of electronic components on a bearer strip |
Aug. 7, 2001 |
| 6271583 |
Semiconductor device having resin encapsulated package structure |
Aug. 7, 2001 |
| 6215175 |
Semiconductor package having metal foil die mounting plate |
Apr. 10, 2001 |
| 6160309 |
Press-fit semiconductor package |
Dec. 12, 2000 |
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