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Class Information
Number: 257/693
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With particular lead geometry > External connection to housing
Description: Subject matter wherein the contact or lead having a specified geometry comprises an electrical connection for connecting the package or housing and its contained active solid-state device to other electrical devices or circuits.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459385 |
Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler |
Dec. 2, 2008 |
| 7456494 |
Surface mount electronic component and process for manufacturing same |
Nov. 25, 2008 |
| 7449370 |
Production process for manufacturing such semiconductor package |
Nov. 11, 2008 |
| 7446398 |
Bump pattern design for flip chip semiconductor package |
Nov. 4, 2008 |
| 7446403 |
Carrier structure stacking system and method |
Nov. 4, 2008 |
| 7429797 |
Electronic device and carrier substrate |
Sep. 30, 2008 |
| 7425758 |
Metal core foldover package structures |
Sep. 16, 2008 |
| 7425757 |
Semiconductor power module |
Sep. 16, 2008 |
| 7414306 |
Preamplifier integrated circuit on flex circuit for magnetic media storing devices |
Aug. 19, 2008 |
| 7414307 |
Electronic device and pressure sensor |
Aug. 19, 2008 |
| 7397116 |
Semiconductor apparatus and production method thereof suitable for electric power devices |
Jul. 8, 2008 |
| 7394151 |
Semiconductor package with plated connection |
Jul. 1, 2008 |
| 7394164 |
Semiconductor device having bumps in a same row for staggered probing |
Jul. 1, 2008 |
| 7391108 |
Package of solid-state imaging device |
Jun. 24, 2008 |
| 7388293 |
Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions |
Jun. 17, 2008 |
| 7385279 |
Semiconductor device and a method of manufacturing the same |
Jun. 10, 2008 |
| 7378728 |
Electronic component mounting package and package assembled substrate |
May. 27, 2008 |
| 7372169 |
Arrangement of conductive pads on grid array package and on circuit board |
May. 13, 2008 |
| 7371687 |
Electronic circuit device |
May. 13, 2008 |
| 7368821 |
BGA semiconductor chip package and mounting structure thereof |
May. 6, 2008 |
| 7368666 |
Surface-mounting type electronic circuit unit without detachment of solder |
May. 6, 2008 |
| 7368805 |
Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device |
May. 6, 2008 |
| 7361984 |
Chip package structure |
Apr. 22, 2008 |
| 7361983 |
Semiconductor device and semiconductor assembly module with a gap-controlling lead structure |
Apr. 22, 2008 |
| 7352054 |
Semiconductor device having conducting portion of upper and lower conductive layers |
Apr. 1, 2008 |
| 7348661 |
Array capacitor apparatuses to filter input/output signal |
Mar. 25, 2008 |
| 7348597 |
Apparatus for performing high frequency electronic package testing |
Mar. 25, 2008 |
| 7342267 |
MOSFET package |
Mar. 11, 2008 |
| 7335977 |
Semiconductor chip mounting arrangement |
Feb. 26, 2008 |
| 7329946 |
I/O architecture for integrated circuit package |
Feb. 12, 2008 |
| 7329945 |
Flip-chip adaptor package for bare die |
Feb. 12, 2008 |
| 7327006 |
Semiconductor package |
Feb. 5, 2008 |
| 7327023 |
Semiconductor component with plastic housing, and process for producing the same |
Feb. 5, 2008 |
| 7323778 |
Semiconductor device with improved design freedom of external terminal |
Jan. 29, 2008 |
| 7317243 |
Encapsulated lead having step configuration |
Jan. 8, 2008 |
| 7317245 |
Method for manufacturing a semiconductor device substrate |
Jan. 8, 2008 |
| 7312521 |
Semiconductor device with holding member |
Dec. 25, 2007 |
| 7312528 |
Semiconductor device having antenna connection electrodes |
Dec. 25, 2007 |
| 7309915 |
Semiconductor chip having pads with plural junctions for different assembly methods |
Dec. 18, 2007 |
| 7307341 |
Integrated packaged having magnetic components |
Dec. 11, 2007 |
| 7291911 |
Semiconductor device and manufacturing method thereof |
Nov. 6, 2007 |
| 7291927 |
Dual chips stacked packaging structure |
Nov. 6, 2007 |
| 7288846 |
Semiconductor chip having pads with plural junctions for different assembly methods |
Oct. 30, 2007 |
| 7286365 |
Electronic substrate for a three-dimensional electronic module |
Oct. 23, 2007 |
| 7279778 |
Semiconductor package having a high-speed signal input/output terminal |
Oct. 9, 2007 |
| 7268422 |
Method of making a semiconductor device adapted to remove noise from a signal |
Sep. 11, 2007 |
| 7268408 |
Wiring board, method for manufacturing wiring board and electronic component using wiring board |
Sep. 11, 2007 |
| 7258549 |
Connection member and mount assembly and production method of the same |
Aug. 21, 2007 |
| 7247934 |
Multi-chip semiconductor package |
Jul. 24, 2007 |
| 7247944 |
Connector assembly |
Jul. 24, 2007 |
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