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Class Information
Number: 257/693
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With particular lead geometry > External connection to housing
Description: Subject matter wherein the contact or lead having a specified geometry comprises an electrical connection for connecting the package or housing and its contained active solid-state device to other electrical devices or circuits.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615854 |
Semiconductor package that includes stacked semiconductor die |
Nov. 10, 2009 |
| 7615406 |
Electronic device package manufacturing method and electronic device package |
Nov. 10, 2009 |
| 7615857 |
Modular three-dimensional chip multiprocessor |
Nov. 10, 2009 |
| 7608863 |
Submount assembly and method of preparing optical module |
Oct. 27, 2009 |
| 7605462 |
Universal substrate for a semiconductor device having selectively activated fuses |
Oct. 20, 2009 |
| 7595268 |
Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same |
Sep. 29, 2009 |
| 7595550 |
Flex-based circuit module |
Sep. 29, 2009 |
| 7592681 |
Solid-state imaging apparatus |
Sep. 22, 2009 |
| 7589413 |
Semiconductor device comprising a vertical semiconductor component and method for producing the same |
Sep. 15, 2009 |
| 7589412 |
Semiconductor device |
Sep. 15, 2009 |
| 7589414 |
I/O Architecture for integrated circuit package |
Sep. 15, 2009 |
| 7586185 |
Semiconductor device having a functional surface |
Sep. 8, 2009 |
| 7586186 |
Ball grid array |
Sep. 8, 2009 |
| 7579680 |
Packaging system for semiconductor devices |
Aug. 25, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7569923 |
Recyclying faulty multi-die packages |
Aug. 4, 2009 |
| 7563647 |
Integrated circuit package system with interconnect support |
Jul. 21, 2009 |
| 7554136 |
Micro-switch device and method for manufacturing the same |
Jun. 30, 2009 |
| 7550855 |
Vertically spaced plural microsprings |
Jun. 23, 2009 |
| 7550838 |
Semiconductor device |
Jun. 23, 2009 |
| 7547965 |
Package and package module of the package |
Jun. 16, 2009 |
| 7545036 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements |
Jun. 9, 2009 |
| 7525200 |
Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device |
Apr. 28, 2009 |
| 7514800 |
Semiconductor device and wire bonding method therefor |
Apr. 7, 2009 |
| 7511369 |
BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same |
Mar. 31, 2009 |
| 7508680 |
Adjustable-inductance filter, tape distribution substrate comprising the filter, and display panel assembly comprising the tape distribution substrate |
Mar. 24, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7495329 |
Semiconductor memory card |
Feb. 24, 2009 |
| 7495341 |
Methods and apparatus for packaging integrated circuit devices |
Feb. 24, 2009 |
| 7489021 |
Lead frame with included passive devices |
Feb. 10, 2009 |
| 7488994 |
Coiled circuit device and method of making the same |
Feb. 10, 2009 |
| 7485959 |
Structure for joining a semiconductor package to a substrate using a solder column |
Feb. 3, 2009 |
| 7482680 |
Customized non-volatile memory device packages |
Jan. 27, 2009 |
| 7476965 |
Electronic device with integrated heat distributor |
Jan. 13, 2009 |
| 7468549 |
Method for producing a package for an electronic circuit and a substrate for a package |
Dec. 23, 2008 |
| 7462940 |
Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same |
Dec. 9, 2008 |
| 7459385 |
Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler |
Dec. 2, 2008 |
| 7456494 |
Surface mount electronic component and process for manufacturing same |
Nov. 25, 2008 |
| 7449370 |
Production process for manufacturing such semiconductor package |
Nov. 11, 2008 |
| 7446398 |
Bump pattern design for flip chip semiconductor package |
Nov. 4, 2008 |
| 7446403 |
Carrier structure stacking system and method |
Nov. 4, 2008 |
| 7429797 |
Electronic device and carrier substrate |
Sep. 30, 2008 |
| 7425757 |
Semiconductor power module |
Sep. 16, 2008 |
| 7425758 |
Metal core foldover package structures |
Sep. 16, 2008 |
| 7414306 |
Preamplifier integrated circuit on flex circuit for magnetic media storing devices |
Aug. 19, 2008 |
| 7414307 |
Electronic device and pressure sensor |
Aug. 19, 2008 |
| 7397116 |
Semiconductor apparatus and production method thereof suitable for electric power devices |
Jul. 8, 2008 |
| 7394151 |
Semiconductor package with plated connection |
Jul. 1, 2008 |
| 7394164 |
Semiconductor device having bumps in a same row for staggered probing |
Jul. 1, 2008 |
| 7391108 |
Package of solid-state imaging device |
Jun. 24, 2008 |
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