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Class Information
Number: 257/693
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With particular lead geometry > External connection to housing
Description: Subject matter wherein the contact or lead having a specified geometry comprises an electrical connection for connecting the package or housing and its contained active solid-state device to other electrical devices or circuits.










Sub-classes under this class:

Class Number Class Name Patents
257/694 Axial leads 117
257/696 Bent (e.g., j-shaped) lead 715
257/695 Fanned/radial leads 134
257/697 Pin grid type 465


Patents under this class:

Patent Number Title Of Patent Date Issued
8710681 Isolation rings for blocking the interface between package components and the respective molding compound Apr. 29, 2014
8710645 Area reduction for surface mount package chips Apr. 29, 2014
8710644 Semiconductor unit having a power semiconductor and semiconductor apparatus using the same Apr. 29, 2014
8692361 Electric device package comprising a laminate and method of making an electric device package comprising a laminate Apr. 8, 2014
8681509 Printed circuit board Mar. 25, 2014
RE44811 High power light emitting diode package Mar. 18, 2014
8659143 Stub minimization for wirebond assemblies without windows Feb. 25, 2014
8659142 Stub minimization for wirebond assemblies without windows Feb. 25, 2014
8659141 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Feb. 25, 2014
8659140 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Feb. 25, 2014
8659139 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Feb. 25, 2014
8659135 Semiconductor device stack and method for its production Feb. 25, 2014
8653646 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Feb. 18, 2014
8653636 Contactless communication medium Feb. 18, 2014
8648457 Wiring pattern for touch integrated circuit Feb. 11, 2014
8643189 Packaged semiconductor die with power rail pads Feb. 4, 2014
8637973 Packaged microelectronic components with terminals exposed through encapsulant Jan. 28, 2014
8633507 LED with versatile mounting ways Jan. 21, 2014
8629001 Semiconductor device and method of manufacturing semiconductor device Jan. 14, 2014
8624381 Integrated antennas in wafer level package Jan. 7, 2014
8623711 Integrated circuit packaging system with package-on-package and method of manufacture thereof Jan. 7, 2014
8618643 Semiconductor device and lead frame used for the same Dec. 31, 2013
8610261 Power semiconductor device Dec. 17, 2013
8604603 Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers Dec. 10, 2013
8598697 Power semiconductor module, method for producing a power semiconductor module and a housing element for a power semiconductor module Dec. 3, 2013
8592969 Semiconductor device with protective screen Nov. 26, 2013
8587107 Silicon carbide semiconductor Nov. 19, 2013
8575745 Power semiconductor device, printed wiring board, and mechanism for connecting the power semiconductor device and the printed wiring board Nov. 5, 2013
8569885 Stacked semiconductor packages and related methods Oct. 29, 2013
8564115 Package structure having micro-electromechanical element Oct. 22, 2013
8564114 Semiconductor package thermal tape window frame for heat sink attachment Oct. 22, 2013
8558369 Integrated circuit packaging system with interconnects and method of manufacture thereof Oct. 15, 2013
8558359 Semiconductor package having lead frames Oct. 15, 2013
8552547 Electronic device package and method for forming the same Oct. 8, 2013
8546943 Ball grid array substrate with insulating layer and semiconductor chip package Oct. 1, 2013
8536573 Plating process and structure Sep. 17, 2013
8525331 Chip design having integrated fuse and method for the production thereof Sep. 3, 2013
8525322 Semiconductor package having a plurality of input/output members Sep. 3, 2013
8519546 Stacked multi-die electronic device with interposed electrically conductive strap Aug. 27, 2013
8508035 Circuit connector apparatus and method therefor Aug. 13, 2013
8508032 Chip packaging Aug. 13, 2013
8508028 Chip package and method for forming the same Aug. 13, 2013
8502385 Power semiconductor device Aug. 6, 2013
8502363 Semiconductor device packages with solder joint enhancement element and related methods Aug. 6, 2013
8498127 Thermal interface material for reducing thermal resistance and method of making the same Jul. 30, 2013
8497574 High power semiconductor package with conductive clips and flip chip driver IC Jul. 30, 2013
8492786 Light emitting device package and lighting system Jul. 23, 2013
8487443 Semiconductor structure, manufacturing method of semiconductor structure and semiconductor device Jul. 16, 2013
8487435 Sheet-molded chip-scale package Jul. 16, 2013
8482115 Integrated circuit packaging system with dual side connection and method of manufacture thereof Jul. 9, 2013











 
 
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