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Class Information
Number: 257/692
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With particular lead geometry
Description: Subject matter wherein the contact or lead provided as part of or in addition to the package or housing has a specified geometrical configuration.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459779 |
Pad arrangement of driver IC chip for LCD and related circuit pattern structure of TAB package |
Dec. 2, 2008 |
| 7459345 |
Packaging method for an electronic element |
Dec. 2, 2008 |
| 7456494 |
Surface mount electronic component and process for manufacturing same |
Nov. 25, 2008 |
| 7453142 |
System and method for implementing transformer on package substrate |
Nov. 18, 2008 |
| 7453140 |
Semiconductor chip assembly with laterally aligned filler and insulative base |
Nov. 18, 2008 |
| 7449726 |
Power semiconductor apparatus |
Nov. 11, 2008 |
| 7447041 |
Compression connection for vertical IC packages |
Nov. 4, 2008 |
| 7446400 |
Chip package structure and fabricating method thereof |
Nov. 4, 2008 |
| 7443019 |
Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same |
Oct. 28, 2008 |
| 7443018 |
Integrated circuit package system including ribbon bond interconnect |
Oct. 28, 2008 |
| 7443010 |
Matrix form semiconductor package substrate having an electrode of serpentine shape |
Oct. 28, 2008 |
| 7432580 |
Semiconductor device with a substrate having a spiral shaped coil |
Oct. 7, 2008 |
| 7427812 |
Semiconductor device with increased number of external connection electrodes |
Sep. 23, 2008 |
| 7425756 |
Semiconductor device and electronic device |
Sep. 16, 2008 |
| 7417312 |
Use of solder paste for heat dissipation |
Aug. 26, 2008 |
| 7414308 |
Integrated circuit with offset pins |
Aug. 19, 2008 |
| 7414307 |
Electronic device and pressure sensor |
Aug. 19, 2008 |
| 7411287 |
Staggered wirebonding configuration |
Aug. 12, 2008 |
| 7408251 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Aug. 5, 2008 |
| 7405472 |
Semiconductor device |
Jul. 29, 2008 |
| 7405467 |
Power module package structure |
Jul. 29, 2008 |
| 7400514 |
Non-rigid conductor link measurement sensor and method for the production thereof |
Jul. 15, 2008 |
| 7400512 |
Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor |
Jul. 15, 2008 |
| 7400213 |
System and method for configuring conductors within an integrated circuit to reduce impedance variation caused by connection bumps |
Jul. 15, 2008 |
| 7400036 |
Semiconductor chip package with a package substrate and a lid cover |
Jul. 15, 2008 |
| 7400002 |
MOSFET package |
Jul. 15, 2008 |
| 7397135 |
Top layers of metal for high performance IC's |
Jul. 8, 2008 |
| 7394164 |
Semiconductor device having bumps in a same row for staggered probing |
Jul. 1, 2008 |
| 7394152 |
Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same |
Jul. 1, 2008 |
| 7391107 |
Signal routing on redistribution layer |
Jun. 24, 2008 |
| 7391102 |
Semiconductor apparatus configured with a lead frame having sufficient strenght to protect against external forces |
Jun. 24, 2008 |
| 7391101 |
Semiconductor pressure sensor |
Jun. 24, 2008 |
| 7388293 |
Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions |
Jun. 17, 2008 |
| 7388283 |
Method and device for integrating an illumination source and detector into the same IC package that allows angular illumination with a common planar leadframe |
Jun. 17, 2008 |
| 7385298 |
Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same |
Jun. 10, 2008 |
| 7385286 |
Semiconductor module |
Jun. 10, 2008 |
| 7385284 |
Transponder incorporated into an electronic device |
Jun. 10, 2008 |
| 7385227 |
Compact light emitting device package with enhanced heat dissipation and method for making the package |
Jun. 10, 2008 |
| 7382058 |
Top layers of metal for high performance IC's |
Jun. 3, 2008 |
| 7378727 |
Memory device and a method of forming a memory device |
May. 27, 2008 |
| 7375424 |
Wirebonded device packages for semiconductor devices having elongated electrodes |
May. 20, 2008 |
| 7375423 |
Semiconductor device |
May. 20, 2008 |
| 7375418 |
Interposer stacking system and method |
May. 20, 2008 |
| 7368810 |
Invertible microfeature device packages |
May. 6, 2008 |
| 7368326 |
Methods and apparatus to reduce growth formations on plated conductive leads |
May. 6, 2008 |
| 7352054 |
Semiconductor device having conducting portion of upper and lower conductive layers |
Apr. 1, 2008 |
| 7345363 |
Semiconductor device with a rewiring level and method for producing the same |
Mar. 18, 2008 |
| 7335977 |
Semiconductor chip mounting arrangement |
Feb. 26, 2008 |
| 7332814 |
Bondwire utilized for coulomb counting and safety circuits |
Feb. 19, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
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