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Class Information
Number: 257/692
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With particular lead geometry
Description: Subject matter wherein the contact or lead provided as part of or in addition to the package or housing has a specified geometrical configuration.










Sub-classes under this class:

Class Number Class Name Patents
257/693 External connection to housing 1,133


Patents under this class:

Patent Number Title Of Patent Date Issued
8710681 Isolation rings for blocking the interface between package components and the respective molding compound Apr. 29, 2014
8710675 Integrated circuit package system with bonding lands Apr. 29, 2014
8710663 Method of manufacturing semiconductor device and semiconductor device Apr. 29, 2014
8710644 Semiconductor unit having a power semiconductor and semiconductor apparatus using the same Apr. 29, 2014
8704352 Semiconductor device having a liquid cooling module Apr. 22, 2014
8703543 Vertical sensor assembly method Apr. 22, 2014
8692367 Wafer-level packaged device having self-assembled resilient leads Apr. 8, 2014
8692366 Apparatus and method for microelectromechanical systems device packaging Apr. 8, 2014
8692361 Electric device package comprising a laminate and method of making an electric device package comprising a laminate Apr. 8, 2014
8681133 Display driver integrated circuit which stores output mode of driving circuit control signal in non-volatile memory and method of outputting the driving circuit control signal Mar. 25, 2014
8680668 Device including a semiconductor chip and metal foils Mar. 25, 2014
8680568 Semiconductor light-emitting device Mar. 25, 2014
RE44811 High power light emitting diode package Mar. 18, 2014
8674488 Light emitting diode (LED) packages Mar. 18, 2014
8669655 Chip package and a method for manufacturing a chip package Mar. 11, 2014
8669654 Integrated circuit packaging system with die paddle and method of manufacture thereof Mar. 11, 2014
8669653 Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductor Mar. 11, 2014
8664755 Power module package and method for manufacturing the same Mar. 4, 2014
8659171 Patch on interposer assembly and structures formed thereby Feb. 25, 2014
8659145 Semiconductor device Feb. 25, 2014
8659129 Semiconductor device and method of manufacturing same Feb. 25, 2014
8653647 Plastic package and method of fabricating the same Feb. 18, 2014
8653639 Layered chip package and method of manufacturing same Feb. 18, 2014
8653637 Stack type semiconductor package apparatus Feb. 18, 2014
8653636 Contactless communication medium Feb. 18, 2014
8643191 On-chip radial cavity power divider/combiner Feb. 4, 2014
8643189 Packaged semiconductor die with power rail pads Feb. 4, 2014
8643166 Integrated circuit packaging system with leads and method of manufacturing thereof Feb. 4, 2014
8643165 Semiconductor device having agglomerate terminals Feb. 4, 2014
8643164 Package-on-package technology for fan-out wafer-level packaging Feb. 4, 2014
8637977 Semiconductor device and method of packaging a semiconductor device with a clip Jan. 28, 2014
8637976 Semiconductor device with lead terminals having portions thereof extending obliquely Jan. 28, 2014
8637975 Semiconductor device having lead wires connecting bonding pads formed on opposite sides of a core region forming a shield area Jan. 28, 2014
8637974 Integrated circuit packaging system with tiebar-less design and method of manufacture thereof Jan. 28, 2014
8637973 Packaged microelectronic components with terminals exposed through encapsulant Jan. 28, 2014
8637972 Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel Jan. 28, 2014
8637965 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device Jan. 28, 2014
8633583 Semiconductor package substrate and methods for forming same, in particular for MEMS devices Jan. 21, 2014
8633575 IC package with integrated electrostatic discharge protection Jan. 21, 2014
8633507 LED with versatile mounting ways Jan. 21, 2014
RE44699 Semiconductor integrated circuit having pads layout for increasing signal integrity and reducing chip size Jan. 14, 2014
8629550 Printed wiring board with crossing wiring pattern Jan. 14, 2014
8629549 Carrier body for a semiconductor component, semiconductor component and method for producing a carrier body Jan. 14, 2014
8624380 Vertical mount package for MEMS sensors Jan. 7, 2014
8618664 Semiconductor package and method for packaging the same Dec. 31, 2013
8618650 Flange package for a semiconductor device Dec. 31, 2013
8610260 Stub minimization for assemblies without wirebonds to package substrate Dec. 17, 2013
8610259 Multi-function and shielded 3D interconnects Dec. 17, 2013
8610254 Apparatus for integrated circuit packaging Dec. 17, 2013
8604602 Integrated circuit packaging system with reinforced encapsulant having embedded interconnect and method of manufacture thereof Dec. 10, 2013











 
 
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