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Class Information
Number: 257/692
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With particular lead geometry
Description: Subject matter wherein the contact or lead provided as part of or in addition to the package or housing has a specified geometrical configuration.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619307 |
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package |
Nov. 17, 2009 |
| 7615854 |
Semiconductor package that includes stacked semiconductor die |
Nov. 10, 2009 |
| 7615852 |
Semiconductor component in a housing with mechanically inforcing flat conductor webs |
Nov. 10, 2009 |
| 7615851 |
Integrated circuit package system |
Nov. 10, 2009 |
| 7612445 |
Circuit apparatus and method of fabricating the apparatus |
Nov. 3, 2009 |
| 7612436 |
Packaged microelectronic devices with a lead frame |
Nov. 3, 2009 |
| 7608920 |
Memory card and method for devising |
Oct. 27, 2009 |
| 7605462 |
Universal substrate for a semiconductor device having selectively activated fuses |
Oct. 20, 2009 |
| 7605461 |
Chip package structure |
Oct. 20, 2009 |
| 7605454 |
Memory card and method for devising |
Oct. 20, 2009 |
| 7598608 |
Mounting substrate |
Oct. 6, 2009 |
| 7598603 |
Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink |
Oct. 6, 2009 |
| 7595548 |
Physical quantity sensor and manufacturing method therefor |
Sep. 29, 2009 |
| 7592694 |
Chip package and method of manufacturing the same |
Sep. 22, 2009 |
| 7589411 |
Device for electrical connection of an integrated circuit chip |
Sep. 15, 2009 |
| 7589400 |
Inverter and vehicle drive unit using the same |
Sep. 15, 2009 |
| RE40887 |
Semiconductor chip with redistribution metal layer |
Sep. 1, 2009 |
| 7582958 |
Semiconductor package |
Sep. 1, 2009 |
| 7579682 |
Power semiconductor module |
Aug. 25, 2009 |
| 7579680 |
Packaging system for semiconductor devices |
Aug. 25, 2009 |
| 7579676 |
Leadless leadframe implemented in a leadframe-based BGA package |
Aug. 25, 2009 |
| 7576429 |
Packaged semiconductor device with dual exposed surfaces and method of manufacturing |
Aug. 18, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7563648 |
Semiconductor device package and method for manufacturing same |
Jul. 21, 2009 |
| 7560809 |
Semiconductor device |
Jul. 14, 2009 |
| 7557646 |
Semiconductor device with non-intersecting power and ground wiring patterns |
Jul. 7, 2009 |
| 7557436 |
Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes |
Jul. 7, 2009 |
| 7556987 |
Method of fabricating an integrated circuit with etched ring and die paddle |
Jul. 7, 2009 |
| 7554188 |
Low inductance bond-wireless co-package for high power density devices, especially for IGBTs and diodes |
Jun. 30, 2009 |
| 7554182 |
Semiconductor device and package, and method of manufacturer therefor |
Jun. 30, 2009 |
| 7554136 |
Micro-switch device and method for manufacturing the same |
Jun. 30, 2009 |
| 7550855 |
Vertically spaced plural microsprings |
Jun. 23, 2009 |
| 7550806 |
Bondwire utilized for coulomb counting and safety circuits |
Jun. 23, 2009 |
| 7547971 |
Semiconductor integrated circuit device |
Jun. 16, 2009 |
| 7545036 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements |
Jun. 9, 2009 |
| 7541683 |
Semiconductor integrated circuit device |
Jun. 2, 2009 |
| 7541672 |
Semiconductor device |
Jun. 2, 2009 |
| 7541666 |
Semiconductor package having dimpled plate interconnections |
Jun. 2, 2009 |
| 7538414 |
Semiconductor integrated circuit device |
May. 26, 2009 |
| 7535084 |
Multi-chip package with a single die pad |
May. 19, 2009 |
| 7534654 |
Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
May. 19, 2009 |
| 7531893 |
Power semiconductor devices having integrated inductor |
May. 12, 2009 |
| 7531852 |
Electronic unit with a substrate where an electronic circuit is fabricated |
May. 12, 2009 |
| 7514800 |
Semiconductor device and wire bonding method therefor |
Apr. 7, 2009 |
| 7514796 |
Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips |
Apr. 7, 2009 |
| 7514671 |
Optical disk apparatus |
Apr. 7, 2009 |
| 7514298 |
Printed wiring board for mounting semiconductor |
Apr. 7, 2009 |
| 7511371 |
Multiple die integrated circuit package |
Mar. 31, 2009 |
| 7508061 |
Three-dimensional semiconductor module having multi-sided ground block |
Mar. 24, 2009 |
| 7508059 |
Stacked chip package with redistribution lines |
Mar. 24, 2009 |
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