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Class Information
Number: 257/692
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > With particular lead geometry
Description: Subject matter wherein the contact or lead provided as part of or in addition to the package or housing has a specified geometrical configuration.


Sub-classes under this class:

Class Number Class Name Patents
257/693 External connection to housing 862


Patents under this class:

Patent Number Title Of Patent Date Issued
7619307 Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package Nov. 17, 2009
7615854 Semiconductor package that includes stacked semiconductor die Nov. 10, 2009
7615852 Semiconductor component in a housing with mechanically inforcing flat conductor webs Nov. 10, 2009
7615851 Integrated circuit package system Nov. 10, 2009
7612445 Circuit apparatus and method of fabricating the apparatus Nov. 3, 2009
7612436 Packaged microelectronic devices with a lead frame Nov. 3, 2009
7608920 Memory card and method for devising Oct. 27, 2009
7605462 Universal substrate for a semiconductor device having selectively activated fuses Oct. 20, 2009
7605461 Chip package structure Oct. 20, 2009
7605454 Memory card and method for devising Oct. 20, 2009
7598608 Mounting substrate Oct. 6, 2009
7598603 Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink Oct. 6, 2009
7595548 Physical quantity sensor and manufacturing method therefor Sep. 29, 2009
7592694 Chip package and method of manufacturing the same Sep. 22, 2009
7589411 Device for electrical connection of an integrated circuit chip Sep. 15, 2009
7589400 Inverter and vehicle drive unit using the same Sep. 15, 2009
RE40887 Semiconductor chip with redistribution metal layer Sep. 1, 2009
7582958 Semiconductor package Sep. 1, 2009
7579682 Power semiconductor module Aug. 25, 2009
7579680 Packaging system for semiconductor devices Aug. 25, 2009
7579676 Leadless leadframe implemented in a leadframe-based BGA package Aug. 25, 2009
7576429 Packaged semiconductor device with dual exposed surfaces and method of manufacturing Aug. 18, 2009
7569920 Electronic component having at least one vertical semiconductor power transistor Aug. 4, 2009
7563648 Semiconductor device package and method for manufacturing same Jul. 21, 2009
7560809 Semiconductor device Jul. 14, 2009
7557646 Semiconductor device with non-intersecting power and ground wiring patterns Jul. 7, 2009
7557436 Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes Jul. 7, 2009
7556987 Method of fabricating an integrated circuit with etched ring and die paddle Jul. 7, 2009
7554188 Low inductance bond-wireless co-package for high power density devices, especially for IGBTs and diodes Jun. 30, 2009
7554182 Semiconductor device and package, and method of manufacturer therefor Jun. 30, 2009
7554136 Micro-switch device and method for manufacturing the same Jun. 30, 2009
7550855 Vertically spaced plural microsprings Jun. 23, 2009
7550806 Bondwire utilized for coulomb counting and safety circuits Jun. 23, 2009
7547971 Semiconductor integrated circuit device Jun. 16, 2009
7545036 Semiconductor device that suppresses variations in high frequency characteristics of circuit elements Jun. 9, 2009
7541683 Semiconductor integrated circuit device Jun. 2, 2009
7541672 Semiconductor device Jun. 2, 2009
7541666 Semiconductor package having dimpled plate interconnections Jun. 2, 2009
7538414 Semiconductor integrated circuit device May. 26, 2009
7535084 Multi-chip package with a single die pad May. 19, 2009
7534654 Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component May. 19, 2009
7531893 Power semiconductor devices having integrated inductor May. 12, 2009
7531852 Electronic unit with a substrate where an electronic circuit is fabricated May. 12, 2009
7514800 Semiconductor device and wire bonding method therefor Apr. 7, 2009
7514796 Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips Apr. 7, 2009
7514671 Optical disk apparatus Apr. 7, 2009
7514298 Printed wiring board for mounting semiconductor Apr. 7, 2009
7511371 Multiple die integrated circuit package Mar. 31, 2009
7508061 Three-dimensional semiconductor module having multi-sided ground block Mar. 24, 2009
7508059 Stacked chip package with redistribution lines Mar. 24, 2009



 
 
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