| |
 |
|
Class Information
Number: 257/691
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > Having power distribution means (e.g., bus structure)
Description: Subject matter wherein the contact or lead includes means for distributing electrical power to one or more active solid-state devices within the package or housing.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6737732 |
Data carrier with an integrated circuit between two carrier layers |
May. 18, 2004 |
| 6737739 |
Method of vacuum packaging a semiconductor device assembly |
May. 18, 2004 |
| 6738258 |
Power semiconductor module |
May. 18, 2004 |
| 6734545 |
BGA type semiconductor device and electronic equipment using the same |
May. 11, 2004 |
| 6731011 |
Memory module having interconnected and stacked integrated circuits |
May. 4, 2004 |
| 6727578 |
Semiconductor device having power supply voltage routed through substrate |
Apr. 27, 2004 |
| 6727596 |
Semiconductor integrated circuit |
Apr. 27, 2004 |
| 6727597 |
Integrated circuit device having C4 and wire bond connections |
Apr. 27, 2004 |
| 6724077 |
Semiconductor package having multi-signal bus bars |
Apr. 20, 2004 |
| 6720662 |
Semiconductor device of chip-on-chip structure with a radiation noise shield |
Apr. 13, 2004 |
| 6717253 |
Assembly package with stacked dies and signal transmission plate |
Apr. 6, 2004 |
| 6717255 |
Chip carrier for a high-frequency electronic package |
Apr. 6, 2004 |
| 6717256 |
Mounting structure for semiconductor device having entirely flat leads |
Apr. 6, 2004 |
| 6717257 |
Lead frame decoupling capacitor, semiconductor device packages including the same and methods |
Apr. 6, 2004 |
| 6717258 |
Power semiconductor device |
Apr. 6, 2004 |
| 6713853 |
Electronic package with offset reference plane cutout |
Mar. 30, 2004 |
| 6713855 |
Dual die memory |
Mar. 30, 2004 |
| 6713937 |
Minitab rectifier for alternators |
Mar. 30, 2004 |
| 6710438 |
Enhanced chip scale package for wire bond dies |
Mar. 23, 2004 |
| 6710439 |
Three-dimensional power semiconductor module and method of manufacturing the same |
Mar. 23, 2004 |
| 6710459 |
Flip-chip die for joining with a flip-chip substrate |
Mar. 23, 2004 |
| 6707145 |
Efficient multiple power and ground distribution of SMT IC packages |
Mar. 16, 2004 |
| 6707146 |
Semiconductor apparatus with decoupling capacitor |
Mar. 16, 2004 |
| 6707159 |
Semiconductor chip and production process therefor |
Mar. 16, 2004 |
| 6707164 |
Package of semiconductor chip with array-type bonding pads |
Mar. 16, 2004 |
| 6707684 |
Method and apparatus for direct connection between two integrated circuits via a connector |
Mar. 16, 2004 |
| 6707685 |
Multi-layer wiring board |
Mar. 16, 2004 |
| 6703704 |
Stress reducing stiffener ring |
Mar. 9, 2004 |
| 6703705 |
Semiconductor device and method for packaging same |
Mar. 9, 2004 |
| 6703706 |
Concurrent electrical signal wiring optimization for an electronic package |
Mar. 9, 2004 |
| 6700191 |
Electronic power circuit of several power modules |
Mar. 2, 2004 |
| 6696712 |
Semicustom IC having adjacent macrocells |
Feb. 24, 2004 |
| 6697257 |
Power semiconductor module |
Feb. 24, 2004 |
| 6693348 |
Semiconductor device with power supplying unit between a semiconductor chip and a supporting substrate |
Feb. 17, 2004 |
| 6683375 |
Semiconductor die including conductive columns |
Jan. 27, 2004 |
| 6680530 |
Multi-step transmission line for multilayer packaging |
Jan. 20, 2004 |
| 6674155 |
Chip carrier film, method of manufacturing the chip carrier film and liquid crystal display using the chip carrier film |
Jan. 6, 2004 |
| 6674157 |
Semiconductor package comprising vertical power transistor |
Jan. 6, 2004 |
| 6670703 |
Buried ground plane for high performance system modules |
Dec. 30, 2003 |
| 6667546 |
Ball grid array semiconductor package and substrate without power ring or ground ring |
Dec. 23, 2003 |
| 6667549 |
Micro circuits with a sculpted ground plane |
Dec. 23, 2003 |
| 6664630 |
Semiconductor device |
Dec. 16, 2003 |
| 6661100 |
Low impedance power distribution structure for a semiconductor chip package |
Dec. 9, 2003 |
| 6661101 |
Semiconductor device |
Dec. 9, 2003 |
| 6657291 |
Combined resistor-capacitor elements for decoupling in electronic packages |
Dec. 2, 2003 |
| 6657293 |
Chip scale package in which layout of wiring lines is improved |
Dec. 2, 2003 |
| 6657307 |
Semiconductor integrated circuit having functional macro with improved power line connection structure |
Dec. 2, 2003 |
| 6657310 |
Top layers of metal for high performance IC's |
Dec. 2, 2003 |
| 6653671 |
Semiconductor device |
Nov. 25, 2003 |
| 6653717 |
Enhancement in throughput and planarity during CMP using a dielectric stack containing an HDP oxide |
Nov. 25, 2003 |
|
|
|
