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Class Information
Number: 257/691
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > Having power distribution means (e.g., bus structure)
Description: Subject matter wherein the contact or lead includes means for distributing electrical power to one or more active solid-state devices within the package or housing.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6034862 |
Diode module assembly with bifurcated terminals |
Mar. 7, 2000 |
| 6025616 |
Power distribution system for semiconductor die |
Feb. 15, 2000 |
| 6025640 |
Resin-sealed semiconductor device, circuit member for use therein and method of manufacturing resin-sealed semiconductor device |
Feb. 15, 2000 |
| 6025650 |
Semiconductor device including a frame terminal |
Feb. 15, 2000 |
| 6020631 |
Method and apparatus for connecting a bondwire to a bondring near a via |
Feb. 1, 2000 |
| 6018191 |
Semiconductor device |
Jan. 25, 2000 |
| 6013946 |
Wire bond packages for semiconductor chips and related methods and assemblies |
Jan. 11, 2000 |
| 6008531 |
Hybrid frame with lead-lock tape |
Dec. 28, 1999 |
| 6008532 |
Integrated circuit package having bond fingers with alternate bonding areas |
Dec. 28, 1999 |
| 6008533 |
Controlling impedances of an integrated circuit |
Dec. 28, 1999 |
| 6008534 |
Integrated circuit package having signal traces interposed between power and ground conductors in order to form stripline transmission lines |
Dec. 28, 1999 |
| 6005777 |
Ball grid array capacitor |
Dec. 21, 1999 |
| 6002164 |
Semiconductor lead frame |
Dec. 14, 1999 |
| 6002165 |
Multilayered lead frame for semiconductor packages |
Dec. 14, 1999 |
| 6002166 |
Semiconductor device |
Dec. 14, 1999 |
| 6002183 |
Power semiconductor packaging |
Dec. 14, 1999 |
| 5998864 |
Stacking semiconductor devices, particularly memory chips |
Dec. 7, 1999 |
| 5994766 |
Flip chip circuit arrangement with redistribution layer that minimizes crosstalk |
Nov. 30, 1999 |
| 5990547 |
Semiconductor device having plated contacts and method thereof |
Nov. 23, 1999 |
| 5986345 |
Semiconductor device having two ground pads connected to a ground connection lead and method for testing the same |
Nov. 16, 1999 |
| 5982027 |
Integrated circuit interposer with power and ground planes |
Nov. 9, 1999 |
| 5982043 |
Semiconductor device having two or more bonding option pads |
Nov. 9, 1999 |
| 5982632 |
Short power signal path integrated circuit package |
Nov. 9, 1999 |
| 5977614 |
Lead on chip type semiconductor integrated circuit device to avoid bonding wire short |
Nov. 2, 1999 |
| 5977626 |
Thermally and electrically enhanced PBGA package |
Nov. 2, 1999 |
| 5973554 |
Semiconductor device structured to be less susceptible to power supply noise |
Oct. 26, 1999 |
| 5960535 |
Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink |
Oct. 5, 1999 |
| 5959354 |
Connection components with rows of lead bond sections |
Sep. 28, 1999 |
| 5955777 |
Lead frame assemblies with voltage reference plane and IC packages including same |
Sep. 21, 1999 |
| 5952083 |
Aluminum alloys for electronic components |
Sep. 14, 1999 |
| 5952611 |
Flexible pin location integrated circuit package |
Sep. 14, 1999 |
| 5952726 |
Flip chip bump distribution on die |
Sep. 14, 1999 |
| 5945730 |
Semiconductor power device |
Aug. 31, 1999 |
| 5942795 |
Leaded substrate carrier for integrated circuit device and leaded substrate carrier device assembly |
Aug. 24, 1999 |
| 5939780 |
Power supply circuit for a semiconductor integrated circuit |
Aug. 17, 1999 |
| 5936303 |
Plastic molded semiconductor package |
Aug. 10, 1999 |
| 5929510 |
Integrated electronic circuit |
Jul. 27, 1999 |
| 5929520 |
Circuit with small package for mosfets |
Jul. 27, 1999 |
| 5925925 |
Three-dimensional integrated circuit package having conductors at different fixed potentials |
Jul. 20, 1999 |
| 5923089 |
Efficient routing method and resulting structure for integrated circuits |
Jul. 13, 1999 |
| 5923540 |
Semiconductor unit having semiconductor device and multilayer substrate, in which grounding conductors surround conductors used for signal and power |
Jul. 13, 1999 |
| 5907184 |
Integrated circuit package electrical enhancement |
May. 25, 1999 |
| 5907186 |
Lead-on-clip lead frame and semiconductor package using the same |
May. 25, 1999 |
| 5903050 |
Semiconductor package having capacitive extension spokes and method for making the same |
May. 11, 1999 |
| 5897193 |
Semiconductor wafer |
Apr. 27, 1999 |
| 5898217 |
Semiconductor device including a substrate having clustered interconnects |
Apr. 27, 1999 |
| 5895887 |
Semiconductor device |
Apr. 20, 1999 |
| 5895967 |
Ball grid array package having a deformable metal layer and method |
Apr. 20, 1999 |
| 5895968 |
Semiconductor device assembly with minimized bond finger connections |
Apr. 20, 1999 |
| 5894171 |
Semiconductor integrated circuit having a grounding terminal |
Apr. 13, 1999 |
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