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Class Information
Number: 257/691
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > Having power distribution means (e.g., bus structure)
Description: Subject matter wherein the contact or lead includes means for distributing electrical power to one or more active solid-state devices within the package or housing.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6137166 |
Semiconductor device |
Oct. 24, 2000 |
| 6137167 |
Multichip module with built in repeaters and method |
Oct. 24, 2000 |
| 6137168 |
Semiconductor package with traces routed underneath a die |
Oct. 24, 2000 |
| 6137688 |
Apparatus for retrofit mounting a VLSI chip to a computer chassis for current supply |
Oct. 24, 2000 |
| 6133623 |
Resin sealing type semiconductor device that includes a plurality of leads and method of making the same |
Oct. 17, 2000 |
| 6133624 |
Semiconductor device utilizing a lead on chip structure |
Oct. 17, 2000 |
| RE36907 |
Leadframe with power and ground planes |
Oct. 10, 2000 |
| 6130459 |
Over-voltage protection device for integrated circuits |
Oct. 10, 2000 |
| 6130475 |
Clock distribution system for synchronous circuit assemblies |
Oct. 10, 2000 |
| 6127726 |
Cavity down plastic ball grid array multi-chip module |
Oct. 3, 2000 |
| 6127729 |
Semiconductor chip with corner electrode terminals and detecting wiring for defect inspection |
Oct. 3, 2000 |
| 6114749 |
Integrated circuit with lead frame package having internal power and ground busses |
Sep. 5, 2000 |
| 6114758 |
Article comprising a superconducting RF filter |
Sep. 5, 2000 |
| 6109530 |
Integrated circuit carrier package with battery coin cell |
Aug. 29, 2000 |
| 6111310 |
Radially-increasing core power bus grid architecture |
Aug. 29, 2000 |
| 6111311 |
Semiconductor device and method of forming the same |
Aug. 29, 2000 |
| 6107684 |
Semiconductor device having a signal pin with multiple connections |
Aug. 22, 2000 |
| 6100580 |
Semiconductor device having all outer leads extending from one side of a resin member |
Aug. 8, 2000 |
| 6097081 |
Semiconductor device having adhesive between lead and chip |
Aug. 1, 2000 |
| 6097097 |
Semiconductor device face-down bonded with pillars |
Aug. 1, 2000 |
| 6097098 |
Die interconnections using intermediate connection elements secured to the die face |
Aug. 1, 2000 |
| 6092281 |
Electromagnetic interference shield driver and method |
Jul. 25, 2000 |
| 6093957 |
Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
Jul. 25, 2000 |
| 6091140 |
Thin chip-size integrated circuit package |
Jul. 18, 2000 |
| 6087720 |
Integrated circuit package electrical enhancement |
Jul. 11, 2000 |
| 6087728 |
Interconnect design with controlled inductance |
Jul. 11, 2000 |
| 6084270 |
Semiconductor integrated-circuit device having n-type and p-type semiconductor conductive regions formed in contact with each other |
Jul. 4, 2000 |
| 6081026 |
High density signal interposer with power and ground wrap |
Jun. 27, 2000 |
| 6075285 |
Semiconductor package substrate with power die |
Jun. 13, 2000 |
| 6072231 |
Semiconductor device |
Jun. 6, 2000 |
| 6066515 |
Multilevel leadframe for a packaged integrated circuit |
May. 23, 2000 |
| 6066887 |
LOC semiconductor package |
May. 23, 2000 |
| 6064112 |
Resin-molded semiconductor device having a lead on chip structure |
May. 16, 2000 |
| 6064113 |
Semiconductor device package including a substrate having bonding fingers within an electrically conductive ring surrounding a die area and a combined power and ground plane to stabilize signa |
May. 16, 2000 |
| 6060772 |
Power semiconductor module with a plurality of semiconductor chips |
May. 9, 2000 |
| 6060774 |
Semiconductor device |
May. 9, 2000 |
| 6060775 |
Semiconductor device |
May. 9, 2000 |
| 6057599 |
Hybrid high-power microwave-frequency integrated circuit |
May. 2, 2000 |
| 6057600 |
Structure for mounting a high-frequency package |
May. 2, 2000 |
| 6054753 |
Plastic-encapsulated semiconductor device equipped with LOC package structure |
Apr. 25, 2000 |
| 6054758 |
Differential pair geometry for integrated circuit chip packages |
Apr. 25, 2000 |
| 6054759 |
Semiconductor chip and package with heat dissipation |
Apr. 25, 2000 |
| 6054763 |
Semiconductor device |
Apr. 25, 2000 |
| 6054767 |
Programmable substrate for array-type packages |
Apr. 25, 2000 |
| 6051784 |
Semiconductor package |
Apr. 18, 2000 |
| 6049470 |
Package with reticulated bond shelf |
Apr. 11, 2000 |
| 6046504 |
Resin-encapsulated LOC semiconductor device having a thin inner lead |
Apr. 4, 2000 |
| 6043558 |
IC packages including separated signal and power supply edge connections, systems and devices including such packages, and methods of connecting such packages |
Mar. 28, 2000 |
| 6040621 |
Semiconductor device and wiring body |
Mar. 21, 2000 |
| 6034423 |
Lead frame design for increased chip pinout |
Mar. 7, 2000 |
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