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Class Information
Number: 257/691
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > Having power distribution means (e.g., bus structure)
Description: Subject matter wherein the contact or lead includes means for distributing electrical power to one or more active solid-state devices within the package or housing.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710514 Power surface mount light emitting die package Apr. 29, 2014
8705257 Switching module including a snubber circuit connected in parallel to a series-connected unit of flowing restriction elements Apr. 22, 2014
8705238 External storage device and method of manufacturing external storage device Apr. 22, 2014
8692362 Semiconductor structure having conductive vias and method for manufacturing the same Apr. 8, 2014
8686567 Semiconductor device having plural wiring layers Apr. 1, 2014
8680666 Bond wireless power module with double-sided single device cooling and immersion bath cooling Mar. 25, 2014
8674497 Stacked half-bridge package with a current carrying layer Mar. 18, 2014
8674492 Power module Mar. 18, 2014
8669648 Power semiconductor module Mar. 11, 2014
8665605 Substrate structure and package structure using the same Mar. 4, 2014
8665596 Power switching circuitry Mar. 4, 2014
8659171 Patch on interposer assembly and structures formed thereby Feb. 25, 2014
8659144 Power and ground planes in package substrate Feb. 25, 2014
8659143 Stub minimization for wirebond assemblies without windows Feb. 25, 2014
8659142 Stub minimization for wirebond assemblies without windows Feb. 25, 2014
8659141 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Feb. 25, 2014
8659140 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Feb. 25, 2014
8659139 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Feb. 25, 2014
8653646 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Feb. 18, 2014
8653645 Semiconductor device comprising stacked LSI having circuit blocks connected by power supply and signal line through vias Feb. 18, 2014
8653639 Layered chip package and method of manufacturing same Feb. 18, 2014
8653636 Contactless communication medium Feb. 18, 2014
8653629 Semiconductor device and wafer Feb. 18, 2014
8643189 Packaged semiconductor die with power rail pads Feb. 4, 2014
8643184 Crosstalk polarity reversal and cancellation through substrate material tuning Feb. 4, 2014
8643174 Calibration of temperature sensitive circuits with heater elements Feb. 4, 2014
8637972 Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel Jan. 28, 2014
8637964 Low stray inductance power module Jan. 28, 2014
8629548 Clock network fishbone architecture for a structured ASIC manufactured on a 28 NM CMOS process lithographic node Jan. 14, 2014
8624379 Semiconductor device Jan. 7, 2014
8624378 Chip-housing module and a method for forming a chip-housing module Jan. 7, 2014
8624366 Semiconductor package structure and method of fabricating the same Jan. 7, 2014
8624242 Semiconductor integrated circuit Jan. 7, 2014
8598709 Method and system for routing electrical connections of semiconductor chips Dec. 3, 2013
8598631 Semiconductor integrated circuit chip and layout method for the same Dec. 3, 2013
8593817 Power semiconductor module and method for operating a power semiconductor module Nov. 26, 2013
8592966 RF transistor packages with internal stability network including intra-capacitor resistors and methods of forming RF transistor packages with internal stability networks including intra-capaci Nov. 26, 2013
8576000 3D chip stack skew reduction with resonant clock and inductive coupling Nov. 5, 2013
8575761 Segmented supply rail configuration for a digital integrated circuit Nov. 5, 2013
8575743 Printed board and semiconductor integrated circuit Nov. 5, 2013
8575742 Semiconductor device with increased I/O leadframe including power bars Nov. 5, 2013
8566068 Trace routing network Oct. 22, 2013
8564141 Chip unit and stack package having the same Oct. 22, 2013
8564112 Semiconductor device Oct. 22, 2013
8546943 Ball grid array substrate with insulating layer and semiconductor chip package Oct. 1, 2013
8546939 RF module including control IC without the aid of a relay pad Oct. 1, 2013
8546903 Ionic isolation ring Oct. 1, 2013
8536716 Supply voltage or ground connections for integrated circuit device Sep. 17, 2013
8531038 Top layers of metal for high performance IC's Sep. 10, 2013
8531023 Substrate for semiconductor package and method of manufacturing thereof Sep. 10, 2013











 
 
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