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Class Information
Number: 257/691
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > Having power distribution means (e.g., bus structure)
Description: Subject matter wherein the contact or lead includes means for distributing electrical power to one or more active solid-state devices within the package or housing.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459778 |
Chip on board leadframe for semiconductor components having area array |
Dec. 2, 2008 |
| 7459765 |
Semiconductor apparatus with decoupling capacitor |
Dec. 2, 2008 |
| 7456496 |
Package design and method of manufacture for chip grid array |
Nov. 25, 2008 |
| 7454637 |
Voltage regulator having reduced droop |
Nov. 18, 2008 |
| 7453142 |
System and method for implementing transformer on package substrate |
Nov. 18, 2008 |
| 7449772 |
Chip-type electronic component including thin-film circuit elements |
Nov. 11, 2008 |
| 7447038 |
Module |
Nov. 4, 2008 |
| 7446417 |
Semiconductor integrated circuit device and fabrication method thereof |
Nov. 4, 2008 |
| 7446406 |
Circuit device and manufacturing method thereof |
Nov. 4, 2008 |
| 7446400 |
Chip package structure and fabricating method thereof |
Nov. 4, 2008 |
| 7446389 |
Semiconductor die package with internal bypass capacitors |
Nov. 4, 2008 |
| 7432575 |
Two-layer electrical substrate for optical devices |
Oct. 7, 2008 |
| 7429797 |
Electronic device and carrier substrate |
Sep. 30, 2008 |
| 7429703 |
Methods and apparatus for integrated circuit device power distribution via internal wire bonds |
Sep. 30, 2008 |
| 7420270 |
Tape wiring substrate and chip-on-film package using the same |
Sep. 2, 2008 |
| 7417328 |
External power ring with multiple tapings to reduce IR drop in integrated circuit |
Aug. 26, 2008 |
| 7414306 |
Preamplifier integrated circuit on flex circuit for magnetic media storing devices |
Aug. 19, 2008 |
| 7408256 |
Integrated circuit chip module |
Aug. 5, 2008 |
| 7400512 |
Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor |
Jul. 15, 2008 |
| 7400034 |
Semiconductor device |
Jul. 15, 2008 |
| 7397135 |
Top layers of metal for high performance IC's |
Jul. 8, 2008 |
| 7397116 |
Semiconductor apparatus and production method thereof suitable for electric power devices |
Jul. 8, 2008 |
| 7394164 |
Semiconductor device having bumps in a same row for staggered probing |
Jul. 1, 2008 |
| 7394150 |
Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys |
Jul. 1, 2008 |
| 7391110 |
Apparatus for providing capacitive decoupling between on-die power and ground conductors |
Jun. 24, 2008 |
| 7391100 |
Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area |
Jun. 24, 2008 |
| 7388293 |
Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions |
Jun. 17, 2008 |
| 7385286 |
Semiconductor module |
Jun. 10, 2008 |
| 7385283 |
Three dimensional integrated circuit and method of making the same |
Jun. 10, 2008 |
| 7385278 |
Strobe light control circuit and IGBT device |
Jun. 10, 2008 |
| 7382058 |
Top layers of metal for high performance IC's |
Jun. 3, 2008 |
| 7375423 |
Semiconductor device |
May. 20, 2008 |
| 7372170 |
Flip chip interconnection pad layout |
May. 13, 2008 |
| 7372142 |
Vertical conduction power electronic device package and corresponding assembling method |
May. 13, 2008 |
| 7372139 |
Semiconductor chip package |
May. 13, 2008 |
| 7368810 |
Invertible microfeature device packages |
May. 6, 2008 |
| 7361983 |
Semiconductor device and semiconductor assembly module with a gap-controlling lead structure |
Apr. 22, 2008 |
| 7352059 |
Low loss interconnect structure for use in microelectronic circuits |
Apr. 1, 2008 |
| 7352054 |
Semiconductor device having conducting portion of upper and lower conductive layers |
Apr. 1, 2008 |
| 7345363 |
Semiconductor device with a rewiring level and method for producing the same |
Mar. 18, 2008 |
| 7342262 |
Split-gate power module for suppressing oscillation therein |
Mar. 11, 2008 |
| 7341938 |
Single mask via method and device |
Mar. 11, 2008 |
| 7339263 |
Integrated circuit packages, systems, and methods |
Mar. 4, 2008 |
| 7335985 |
Method and system for electrically coupling a chip to chip package |
Feb. 26, 2008 |
| 7335956 |
Capacitor device with vertically arranged capacitor regions of various kinds |
Feb. 26, 2008 |
| 7327581 |
Circuit device |
Feb. 5, 2008 |
| 7327024 |
Power module, and phase leg assembly |
Feb. 5, 2008 |
| 7326642 |
Method of fabricating semiconductor device using low dielectric constant material film |
Feb. 5, 2008 |
| 7323771 |
Electronic circuit device |
Jan. 29, 2008 |
| 7323770 |
Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
Jan. 29, 2008 |
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