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Class Information
Number: 257/691
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead > Having power distribution means (e.g., bus structure)
Description: Subject matter wherein the contact or lead includes means for distributing electrical power to one or more active solid-state devices within the package or housing.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615854 |
Semiconductor package that includes stacked semiconductor die |
Nov. 10, 2009 |
| 7612457 |
Semiconductor device including a stress buffer |
Nov. 3, 2009 |
| 7612439 |
Semiconductor package having improved thermal performance |
Nov. 3, 2009 |
| 7608922 |
Semiconductor device including amplifier and frequency converter |
Oct. 27, 2009 |
| 7605462 |
Universal substrate for a semiconductor device having selectively activated fuses |
Oct. 20, 2009 |
| 7605460 |
Method and apparatus for a power distribution system |
Oct. 20, 2009 |
| 7602058 |
Flip-chip semiconductor device with improved power pad arrangement |
Oct. 13, 2009 |
| 7602056 |
On-die termination method for multi-chip packages |
Oct. 13, 2009 |
| 7598605 |
Semiconductor device having capacitive insulation means and communication terminal using the device |
Oct. 6, 2009 |
| 7595561 |
Semiconductor device including multiple rows of peripheral circuit units |
Sep. 29, 2009 |
| 7595268 |
Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same |
Sep. 29, 2009 |
| 7592250 |
Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device |
Sep. 22, 2009 |
| 7589400 |
Inverter and vehicle drive unit using the same |
Sep. 15, 2009 |
| 7586186 |
Ball grid array |
Sep. 8, 2009 |
| 7579683 |
Memory interface optimized for stacked configurations |
Aug. 25, 2009 |
| 7576420 |
Semiconductor integrated circuit device having reduced terminals and I/O area |
Aug. 18, 2009 |
| 7573107 |
Power module |
Aug. 11, 2009 |
| 7571415 |
Layout of power device |
Aug. 4, 2009 |
| 7569923 |
Recyclying faulty multi-die packages |
Aug. 4, 2009 |
| 7569916 |
Separable network interconnect systems and assemblies |
Aug. 4, 2009 |
| 7569428 |
Method for manufacturing semiconductor device, semiconductor device and apparatus comprising same |
Aug. 4, 2009 |
| 7566964 |
Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures |
Jul. 28, 2009 |
| 7560808 |
Chip scale power LDMOS device |
Jul. 14, 2009 |
| 7557444 |
Power-via structure for integration in advanced logic/smart-power technologies |
Jul. 7, 2009 |
| 7554198 |
Flexible joint methodology to attach a die on an organic substrate |
Jun. 30, 2009 |
| 7554181 |
Semiconductor device with non-overlapping chip mounting sections |
Jun. 30, 2009 |
| 7554133 |
Pad current splitting |
Jun. 30, 2009 |
| 7550855 |
Vertically spaced plural microsprings |
Jun. 23, 2009 |
| 7547964 |
Device packages having a III-nitride based power semiconductor device |
Jun. 16, 2009 |
| 7547961 |
IC card with bonding wire connections of different lengths |
Jun. 16, 2009 |
| 7538418 |
IC card |
May. 26, 2009 |
| 7528467 |
IC substrate with over voltage protection function |
May. 5, 2009 |
| 7525183 |
Surface mount multichip devices |
Apr. 28, 2009 |
| 7521781 |
Integrated circuit package system with mold clamp line critical area having widened conductive traces |
Apr. 21, 2009 |
| 7514796 |
Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips |
Apr. 7, 2009 |
| 7514794 |
Semiconductor integrated circuit and the method of designing the layout |
Apr. 7, 2009 |
| 7514778 |
Power semiconductor device |
Apr. 7, 2009 |
| 7514774 |
Stacked multi-chip package with EMI shielding |
Apr. 7, 2009 |
| 7511370 |
Power gridding scheme |
Mar. 31, 2009 |
| 7508061 |
Three-dimensional semiconductor module having multi-sided ground block |
Mar. 24, 2009 |
| 7504721 |
Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips |
Mar. 17, 2009 |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
Mar. 17, 2009 |
| 7501709 |
BGA package with wiring schemes having reduced current loop paths to improve cross talk control and characteristic impedance |
Mar. 10, 2009 |
| 7498671 |
Power semiconductor module |
Mar. 3, 2009 |
| 7495329 |
Semiconductor memory card |
Feb. 24, 2009 |
| 7489023 |
Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device |
Feb. 10, 2009 |
| 7485959 |
Structure for joining a semiconductor package to a substrate using a solder column |
Feb. 3, 2009 |
| 7479693 |
Arrangement of conductive connectors in a power semiconductor device |
Jan. 20, 2009 |
| 7479680 |
Method and apparatus that provides differential connections with improved ESD protection and routing |
Jan. 20, 2009 |
| 7466013 |
Semiconductor die structure featuring a triple pad organization |
Dec. 16, 2008 |
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