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Class Information
Number: 257/690
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Housing or package > With contact or lead
Description: Subject matter wherein the device is provided with a contact or lead, in addition to or as part of the package or housing.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6777802 |
Integrated circuit package substrate with multiple voltage supplies |
Aug. 17, 2004 |
| 6774456 |
Configuration of fuses in semiconductor structures with Cu metallization |
Aug. 10, 2004 |
| 6774466 |
Semiconductor device |
Aug. 10, 2004 |
| 6774492 |
Chip package assembly having chip package mounted on printed circuit board |
Aug. 10, 2004 |
| 6770959 |
Semiconductor package without substrate and method of manufacturing same |
Aug. 3, 2004 |
| 6770962 |
Disposable mold runner gate for substrate based electronic packages |
Aug. 3, 2004 |
| 6770964 |
Semiconductor device including intermediate wiring element |
Aug. 3, 2004 |
| 6770982 |
Semiconductor device power distribution system and method |
Aug. 3, 2004 |
| 6768187 |
Coupling spaced bond pads to a contact |
Jul. 27, 2004 |
| 6768192 |
Pin layout of dual band receiver with two input pads/pins restricted to a single side of a four sided package |
Jul. 27, 2004 |
| 6765301 |
Integrated circuit bonding device and manufacturing method thereof |
Jul. 20, 2004 |
| 6762485 |
Plastic lead frames for semiconductor devices |
Jul. 13, 2004 |
| 6759738 |
Systems interconnected by bumps of joining material |
Jul. 6, 2004 |
| 6759742 |
Interchangeable bond-wire interconnects |
Jul. 6, 2004 |
| 6759307 |
Method to prevent die attach adhesive contamination in stacked chips |
Jul. 6, 2004 |
| 6756138 |
Micro-electromechanical devices |
Jun. 29, 2004 |
| 6756666 |
Surface mount package including terminal on its side |
Jun. 29, 2004 |
| 6756683 |
High-frequency semiconductor device including a semiconductor chip |
Jun. 29, 2004 |
| 6753612 |
Economical high density chip carrier |
Jun. 22, 2004 |
| 6750488 |
Focal plane plate for a high-resolution camera with light-sensitive semiconductor sensors |
Jun. 15, 2004 |
| 6747360 |
Conductive hardening resin for a semiconductor device and semiconductor device using the same |
Jun. 8, 2004 |
| 6744124 |
Semiconductor die package including cup-shaped leadframe |
Jun. 1, 2004 |
| 6737749 |
Resistive vias for controlling impedance and terminating I/O signals at the package level |
May. 18, 2004 |
| 6734543 |
Module housing and power semiconductor module |
May. 11, 2004 |
| 6734544 |
Integrated circuit package |
May. 11, 2004 |
| 6734555 |
Integrated circuit package and printed circuit board arrangement |
May. 11, 2004 |
| 6734563 |
Post passivation interconnection schemes on top of the IC chips |
May. 11, 2004 |
| 6727575 |
Semiconductor device |
Apr. 27, 2004 |
| 6727577 |
Tape carrier package |
Apr. 27, 2004 |
| 6727587 |
Connection device and method for producing the same |
Apr. 27, 2004 |
| 6724067 |
Low stress thermal and electrical interconnects for heterojunction bipolar transistors |
Apr. 20, 2004 |
| 6724070 |
Fine pitch lead frame |
Apr. 20, 2004 |
| 6720205 |
Electronic device and method of manufacturing the same, and electronic instrument |
Apr. 13, 2004 |
| 6720646 |
Power converter with improved lead frame arrangement including stand-up portion |
Apr. 13, 2004 |
| 6717066 |
Electronic packages having multiple-zone interconnects and methods of manufacture |
Apr. 6, 2004 |
| 6717245 |
Chip scale packages performed by wafer level processing |
Apr. 6, 2004 |
| 6717252 |
Semiconductor device |
Apr. 6, 2004 |
| 6717254 |
Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture |
Apr. 6, 2004 |
| 6717255 |
Chip carrier for a high-frequency electronic package |
Apr. 6, 2004 |
| 6713836 |
Packaging structure integrating passive devices |
Mar. 30, 2004 |
| 6713849 |
Semiconductor utilizing grooves in lead and tab portions of lead frame to prevent peel off between the lead frame and the resin |
Mar. 30, 2004 |
| 6713881 |
Semiconductor device and method of manufacturing same |
Mar. 30, 2004 |
| 6710437 |
Semiconductor device having a chip-size package |
Mar. 23, 2004 |
| 6710453 |
Integrated circuit containing redundant core and peripheral contacts |
Mar. 23, 2004 |
| 6705005 |
Method of forming assemblies of circuit boards in different planes |
Mar. 16, 2004 |
| 6707149 |
Low cost and compliant microelectronic packages for high i/o and fine pitch |
Mar. 16, 2004 |
| 6703694 |
Frame for semiconductor package including plural lead frames having thin parts or hollows adjacent the terminal roots |
Mar. 9, 2004 |
| 6700138 |
Modular semiconductor die package and method of manufacturing thereof |
Mar. 2, 2004 |
| 6700182 |
Thermally conductive substrate, thermally conductive substrate manufacturing method and power module |
Mar. 2, 2004 |
| 6700193 |
Semiconductor package with elevated tub |
Mar. 2, 2004 |
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